Abstract: A liquid droplet ejection apparatus includes: a liquid droplet ejection portion that ejects a liquid droplet containing a structure forming material onto a substrate; and drying means that dries the droplet on the substrate, thereby forming a structure made of the structure forming material. The drying means includes an energy outputting section that outputs energy onto the droplet on the substrate, thereby causing the structure forming material in the droplet to flow; and an energy profile controlling section controlling an energy profile of the energy output by the energy outputting section to be an energy profile that permits the structure forming material to flow such that the structure forming material is distributed in accordance with a structure profile of the structure to be formed. According to the liquid droplet ejection apparatus, a structure having a desired structure profile is obtained.

Abstract: A substrate bonding apparatus includes a first chamber having a first surface plate where a first substrate is placed. A second chamber is disposed opposite to the first chamber. The second chamber has a second surface plate where a second substrate is placed. The second substrate is to be bonded to the first substrate. An alignment unit is installed in at least one of the first and second chambers. The alignment unit is capable of carrying out a six-degrees-of-freedom alignment between the first and second substrates. Thus, the substrates can be maintained parallel to each other, a spacing between the substrates can be automatically adjusted, and the substrates can be aligned in the X and Y axis directions.

Abstract: A grinding unit grinds an annular convex portion formed at an outer periphery of a back face of a wafer such that the wafer has a uniform thickness. After such process, a robot arm of a transport unit transports the wafer to an inspection unit for inspecting occurrence of damage at the wafer. Then, the robot arm transports the wafer without damage to a mount frame preparation unit. Herein, the wafer is joined to a ring frame through a dicing tape, and then a protective tape is separated from a front face of the wafer. Thus, a mount frame is prepared.

Abstract: A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.

Abstract: A label applicator system provides for high speed, accurate label transfer from a web to items moving on an item transport along a path relative to the system. The items, such as bottles, have a contoured surface. The applicator includes a supply reel for supplying labels on a web and a take-up for taking up the web after transfer of the label. A drive roller moves the web through the applicator system. The system includes a web positioning assembly and a movable label applicator head. A contour sensor senses the bottle contour and develops a profile for the head to follow to apply the labels to the bottles. The supply, take-up and the drive are operably engaged with one another to maintain a relatively constant tension in the web.

Abstract: A gantry tower spraying system with a cartridge/receptacle assembly includes a gantry and a spray assembly coupled to the gantry to allow for translational movement of the spray assembly along the gantry. The spray assembly includes a receptacle for receiving a cartridge containing a cosmetic liquid for skin treatment, and a spray nozzle coupled to the receptacle for receiving the cosmetic liquid and dispensing the cosmetic liquid in a spray. The receptacle has an inner surface of a size and shape to generally conform to a size and shape of a portion of an outer surface of the cartridge. The spraying system can further be provided with an oscillation mechanism adapted to cause oscillation of the spray nozzle. The bottle can be provided with a keying mechanism for engaging a corresponding key structure of the receptacle.

Abstract: A laminating apparatus is composed of a thermo compression bonding section, a first bobbin holder and a second bobbin holder. The thermo compression bonding section pulls a laminating film having a member for forming a protective film out from a roll of the laminating film, which is wrapped around a core bobbin in a cylindrical shape, and overlaps the protective film on one surface of a card and thermally compresses the protective film against the one surface of the card so as to be bonded.

Abstract: A method for applying and monitoring an application structure comprising a repairing function and device thereof are provided. The method includes arranging automatically a first application structure on the substrate using the application device. The first application structure on the substrate monitored by the at least one camera such that the at least one camera is constantly aligned to the first application structure and the first application structure. The method further includes transmitting the images acquired by the at least one camera to an image processing device that analyzes the images of the first application structure and the image processing device filing partial areas of the first application structure. The method also includes applying, after application of all partial areas of the first application structure, at least a second application structure to the substrate by the application device based on the repair list.

Abstract: A method for manufacturing an absorbent hygiene article having a plurality of components that are joined together during the manufacturing process. Thermochromic fibres are incorporated in a component web, component or a selected area thereof, said thermochromic fibres being adapted to change colour between a contrasting colour to a less contrasting colour. A colour change of said thermochromic fibres is induced during one step of the manufacturing process and the presence of the thermochromic fibres being in their contrasting state is detected by a detection means. A measure in the process control is actuated in response to the detected presence of thermochromic fibres in their contrasting state.

Abstract: A method for monitoring the quality of a pattern of fluid beads applied to a moving substrate measures time delays between the passage of a reference point on a substrate element and leading and trailing edges of a bead, the quality of which is to be measured. A time delay ratio is generated, and compared to a reference ratio. The result of the comparison is indicative of variations in the quality of the measured bead. The invention has utility in a variety of industries, including industries in which adhesive beads are applied to a substrate, such as the envelope and box industries. An apparatus in accordance with the invention may conveniently utilize non-contact sensors to monitor the passage of the substrate and beads, and further may advantageously monitor the leading edge of the substrate and leading and trailing edges of the beads.

Abstract: A method and apparatus for producing disposable undergarments having areas of defined elastic material is disclosed. The method provides for staggered cutting knives for severing the elastic material, which results in less necessary material used in the construction of the undergarments.

Abstract: A protocol for determining process parameters for debulking composite laminates is established using a standardized a double vacuum debulk (DVD) process. This allows for the development of a rapid fabrication process for thick laminates of toughened carbon/epoxy composite materials. For rework, a single piece multilayer patch is made available for bonding with an adhesive layer to a prepared structural area.

Abstract: The invention relates to a method for production of a multi-layer analysis element for liquid samples, with at least one test field for the analysis of the liquid samples, in which method an analysis element blank composed of at least two superposed material layers is made available. The multi-layer analysis element or a constituent part of the multi-layer analysis element is cut out from the analysis element blank by means of laser radiation. The laser radiation cuts through different material layers in at least two areas and has a laser power which is effective for the cutting and which is varied as a function of the thickness and the material of the different material layers to be cut in the areas.

Abstract: In association with movement of an affixation roller, a movement position of the affixation roller is detected by a rotation sensor based on a rotation amount of a motor. A control device changes and controls an amount of an adhesive tape to be fed forcibly based on a result of the detection, and keeps a tensile force applied to the adhesive tape in the affixation of the adhesive tape to the semiconductor wafer within a preset range.

Abstract: A bonding sheet applying apparatus of the present invention includes an applying stage for supporting a board, an applying unit having a bonding-sheet supplying device for supplying a bonding sheet to above the board supported by the applying stage and an applying head provided above the board so as to be movable up and down, for sequentially pressing the bonding sheet supplied by the bonding-sheet supplying device on a plurality of applying positions arranged on the board, a transfer device for transferring the applying unit, which has completed a bonding sheet applying operation for one of the applying positions, to a position upward above another applying position at which a bonding sheet applying operation has not been completed, and an inspection device for inspecting an applied state of the bonding sheet which has already been applied by the applying unit, while the applying unit is successively performing the bonding sheet applying operations.

Abstract: An apparatus for reorienting liner-borne inlays is provided. Such apparatus utilize electronic control devices to precisely move inlays from a first orientation and spacing to a second orientation and spacing. Embodiments of the present invention include a vacuum manifold having an elongated ridge member so that the apparatus are useful in handling thin and flexible inlays and minimize errors in inlay reorientation.

Abstract: An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.

Abstract: An alignment tool for a bonding apparatus comprises a loading surface for receiving a pushing force from a surface of a device which is attached to the bonding apparatus, the loading surface being arranged and constructed to experience a tilting moment upon receiving an unequally distributed pushing force from a misaligned device acting on it. The loading surface transmits the tilting moment experienced by it to a sensing surface which is operatively connected to the loading surface through a columnar body, which has a smaller width than the loading surface and the sensing surface, and which connects the loading surface and the sensing surface. An array of piezoelectric elements communicates with the sensing surface and produces electrical signals in response to the tilting moment such that a computing unit operatively connected to the piezoelectric elements may detect a direction of tilt of the loading surface from the electrical signals produced by the piezoelectric elements.

Abstract: A composite member and an associated method for forming the composite member are provided. The composite member is formed of a plurality of elongate tapes. Each tape is disposed a path defined by a plurality of natural path segments, each of which defines a non-natural offset angle relative to the adjacent segments.

Abstract: In a method and an apparatus for coating an object with photosensitive material, a roller stabilizes a supply amount of the photosensitive material and is disposed between the object and a slit coater, so that the stabilized photosensitive material is supplied to the object through the slit coater. The photosensitive material includes additives for controlling amount of a solid powder, a boiling point and a surface tension thereof. Accordingly, the photosensitive material may be uniformly coated on the object.