Patents Examined by Hannuri L Kwon
  • Patent number: 8709328
    Abstract: This method for forming ventilation holes in an electrode plate includes: a roughening step of roughening a surface of an electrode plate for a plasma processing apparatus such that a center line average roughness Ra becomes in a range of 0.2 ?m to 30 ?m; and a ventilation hole forming step of irradiating a laser beam having a wavelength within a range of 200 nm to 600 nm on a roughened surface of the electrode plate so as to form ventilation holes in the electrode plate which pass through the electrode plate in a thickness direction, wherein in the ventilation hole forming step, a focus spot of the laser light is swirled along a planar direction of the electrode plate so as to form a circular irradiation area, and while moving the irradiation area along a planar direction of the electrode plate in a circular movement, the focus spot of the laser light is shifted in a thickness direction of the electrode plate.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: April 29, 2014
    Assignee: Mitsubishi Materials Corporation
    Inventors: Satoshi Fujita, Atsushi Matsuda
  • Patent number: 8663412
    Abstract: The present invention is directed to process for making a packaging, said packaging comprising a container (2) with a container body (5) and a container opening having an upper edge, said packaging further comprising a closure (4) for closing said container, the container and the closure being made out of polyethylene terephtalate (PET), polyethylene naphtalate (PEN), or a combination thereof, said container (2) and said closure (4) comprising respectively first (8) and second (9) attachment means, characterized in that: said process comprising the steps of in order: (i) fitting said first (8) and second (9) attachment means to each other, (ii) deforming at least one of the first and/or second attachment means up to the point of permanent deformation of the PET or PEN material, by punching, rolling, or a combination thereof, so as to create a permanent, leak-tight, attachment between said container and said closure.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: March 4, 2014
    Assignee: Nestec S.A.
    Inventors: Christian Detrois, Jean-Paul Cerveny
  • Patent number: 8657982
    Abstract: The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: February 25, 2014
    Assignee: Quanta Computer, Inc.
    Inventors: Yuan-Chen Liang, Chia-Hui Wu, Hung-Ta Lee, Yi-Chun Lin, Li-Chuan Chien, Kuo-Hsiang Hsu
  • Patent number: 8596324
    Abstract: A web conveying apparatus configured to convey a pair of webs folded in the cross direction CD with reference to a folding line. The web conveying apparatus includes a crotch hold bar configured to hold an intermediate web in a conveyable manner with the folded intermediate web stretched in a direction in which the crotch portions get away from the waistline portions; and a conveying mechanism configured to convey the intermediate web and hands over the intermediate web to a joint apparatus and a cutting apparatus, while the crotch portions are being held by the crotch hold bar.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: December 3, 2013
    Assignee: Unicharm Corporation
    Inventor: Hiroki Yamamoto
  • Patent number: 8529726
    Abstract: A method for producing a hollow product comprises a film arrangement step wherein a film is arranged on a fiber layer; a molded body arrangement step wherein a molded body having a recess is arranged on the film after the film after the film arrangement step in such a manner that the opening of the recess faces the film; the gas present between the fiber layer and the film is evacuated; the gas present between the film and the molded body is evacuated; a film-molded body bonding step wherein the film and the molded body are bonded together after the step of gas evacuation from between the film and the molded body; and a fiber layer-film bonding step wherein the fiber layer and the film are bonded together after the step of gas evacuation from between the fiber layer and the film.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: September 10, 2013
    Assignee: Nippi Corporation
    Inventors: Terukuni Fukuoka, Keiichi Hosoda
  • Patent number: 8440043
    Abstract: The present disclosure relates to methods and apparatuses for assembling absorbent articles, and more particularly, methods and apparatuses for severing elastic in an advancing elastic laminate. A continuous elastic laminate may be formed by bonding elastic strands between a first continuous substrate layer and a second continuous substrate layer. As discussed in more detail below, the continuous elastic laminate may advance through a cutting apparatus that intermittently deactivates or severs the elastic strands of the elastic laminate along the machine direction.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: May 14, 2013
    Assignee: The Procter & Gamble Company
    Inventors: Uwe Schneider, Michael Brian Quade, Jose Angel Mercado