Patents Examined by Hans R Weiland
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Patent number: 11234348Abstract: Proposed is a heatsink module for an inverter. The heatsink module includes a housing a bottom face, both spaced side walls, and both flanges. The heatsink module include a heat-dissipation plate including a base fixed to the both flanges; and a plurality of heat-dissipation fins extending downward from a bottom of the base. The heatsink module includes a supporter interposed between the bottom face of the housing and the heat-dissipation fins. The supporter has slots defined therein for accommodating at least portions of the heat-dissipation fins respectively.Type: GrantFiled: August 13, 2019Date of Patent: January 25, 2022Assignee: LSIS CO., LTD.Inventor: Kyu-Hwa Kim
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Patent number: 11231239Abstract: A threaded cooling apparatus includes a head having a heat exchanger and a shaft having a threaded section configured to mechanically fasten the head to a structure. The heat exchanger is configured to exchange heat with a coolant flowing through the head. The shaft also includes first and second cooling channels. The first cooling channel is configured to deliver the coolant to the heat exchanger, and the second cooling channel is configured to exhaust the coolant from the heat exchanger. The apparatus may also include a first seal between the head and the structure that is configured to reduce or prevent coolant loss. The apparatus may further include a second seal that is configured to reduce or prevent coolant flow between the first and second cooling channels that bypasses the heat exchanger.Type: GrantFiled: October 1, 2019Date of Patent: January 25, 2022Assignee: Raytheon CompanyInventors: Christopher R. Koontz, Scott T. Johnson, Shadi S. Merhi
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Patent number: 11229878Abstract: A dry air generation apparatus includes a first heat exchanger, a second heat exchanger, a switching valve, and a controller. The first heat exchanger and the second heat exchanger are provided in the air flow path, and the moisture contained in the air is removed by cooling the air which flows through the flow path to 0° C. or lower. The switching valve switches the direction of the air flowing through the first heat exchanger and the second heat exchanger. The controller controls the first heat exchanger, the second heat exchanger, and the switching valve. The first heat exchanger and the second heat exchanger are connected in series in the air flow path.Type: GrantFiled: September 25, 2019Date of Patent: January 25, 2022Assignee: TOKYO ELECTRON LIMITEDInventor: Jun Young Chung
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Patent number: 11221178Abstract: A heat exchanger with several plates arranged in parallel is provided. The heat exchanger has a first series of passages for channeling at least one first fluid and a second series of passages for channeling at least one second fluid. The second fluid being in a heat-exchange relationship with at the first fluid. A mixer is arranged in the passage of the first series. The mixer has at least one first channel for the flow of a first phase of the first fluid in a flow direction. The mixer has at least one second channel for the flow of a second phase of the first fluid. The mixer has at least one opening fluidically connecting the first channel to the second channel.Type: GrantFiled: March 20, 2018Date of Patent: January 11, 2022Assignee: L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Precédés Georges ClaudeInventors: Natacha Haik-Beraud, Philippe Grigoletto, Sophie Lazarrini, Jean-Marc Peyron, Jorge Ernesto Tovar Ramos
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Patent number: 11221182Abstract: Embodiments described herein relate to a heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a heat exchanging surface within the heat exchanger. The heat exchanging surface can be a curved shaped which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller foot print and reducing costs.Type: GrantFiled: July 11, 2019Date of Patent: January 11, 2022Assignee: Applied Materials, Inc.Inventors: Manoj A. Gajendra, Arul Vasanth Subramanian
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Patent number: 11199340Abstract: A diffuser plate for a thermal transfer device can include a body having a number of first apertures and a second aperture that traverse therethrough, where the first apertures are asymmetrically arranged with respect to the second aperture. The first apertures can have a first shape and a first size, and where the first apertures are configured to receive a plurality of tubes. The second aperture has a second size, where the second size is larger than the first size.Type: GrantFiled: October 4, 2019Date of Patent: December 14, 2021Assignee: Rheem Manufacturing CompanyInventor: Reza David Khatami
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Patent number: 11181293Abstract: In an air-conditioning apparatus, in the case where a compressor is in operation, a fan is in operation, a wind guide plate is in a first state and a second heat exchanger operates as a condenser, when a detected temperature of target space for air-conditioning is higher than a set temperature for the target space and a detected temperature of a second heat exchanger is lower than or equal to a first reference temperature, a controller performs a first control to keep the compressor and the fan in operation and switch the state of the wind guide plate from the first state to a second state.Type: GrantFiled: April 7, 2017Date of Patent: November 23, 2021Assignee: Mitsubishi Electric CorporationInventors: Chiyoko Hirose, Daisuke Sugiyama
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Patent number: 11137213Abstract: A water cooling head includes water cooling head includes a casing, a base and a pump. The casing includes an inlet and an outlet. An outer side of the base has a heat-absorbing surface. A thermal conduction structure is disposed on an inner side of the base. An active space is defined by the base and the casing collaboratively. The pump includes a first magnetic element, a second magnetic element, an impeller and a pivotal part. The first magnetic element is located outside the active space. The first magnetic element is arranged between the impeller and the base along a direction perpendicular to the base. The pivotal part, the second magnetic element and the impeller are disposed within the active space. The pivotal part is connected with the impeller and arranged between the impeller and the base. The second magnetic element is installed on the pivotal part.Type: GrantFiled: July 9, 2019Date of Patent: October 5, 2021Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-An Chen, Mu-Shu Fan, Chien-Yu Chen
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Patent number: 11131508Abstract: A middle member of heat dissipation device and the heat dissipation device. The middle member includes a middle member main body having a first face, a second face, multiple perforations and a channeled structure assembly. The channeled structure assembly is disposed on the first face or the second face. The perforations are formed through the middle member main body between the first and second faces. The channeled structure assembly and the perforations are arranged in alignment with each other or not in alignment with each other. The middle member and a first plate body and a second plate body are overlapped with each other to form the heat dissipation device. The complex structures disposed on the first and second faces of the middle member main body are able to achieve a stable vapor-liquid circulation effect.Type: GrantFiled: October 3, 2018Date of Patent: September 28, 2021Assignee: Asia Vital Components Co., Ltd.Inventor: Wei-Kong Sheng
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Patent number: 11125509Abstract: A heat storage system using a heat storage container having a tubular body, an adsorbent that is accommodated in the tubular body, generates heat by adsorption of an adsorbate and absorbs heat by desorption of the adsorbate, and a flow channel that penetrates the tubular body in a longitudinal direction, the heat storage system comprising a diffusion layer for transporting the adsorbate in liquid phase from the flow channel to the adsorbent, wherein the adsorbate is transported to the flow channel, the adsorbate is transported to the diffusion layer, a part of the adsorbate transported to the diffusion layer is adsorbed on the adsorbent, the adsorbent releases heat, and the remaining adsorbate is vaporized by the heat to become heat transport fluid.Type: GrantFiled: January 25, 2019Date of Patent: September 21, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Keiko Chikazawa, Yuichi Kimura, Kengo Tanaka, Mamoru Shimada
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Patent number: 11117105Abstract: The embodied invention is a low humidity generator which encapsulates essential piping, pressure regulator, flow regulator, and saturator in a sealed vacuum chamber. Additionally, a Stirling piston type cooler is used to cool the saturator. This eliminates atmospheric water vapor permeation and the need for thermal insulation surrounding the piping and control units. Also, the humidity generator has improved cool down characteristics, improved thermal control, and better maintenance access.Type: GrantFiled: September 6, 2019Date of Patent: September 14, 2021Inventor: Robert O. Hardy
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Patent number: 11107749Abstract: A heat dissipation fin structure includes a plurality of fins provided on a surface of a fin base plate. The fins configure a plurality of flow passages in which cooling air that enters from an inlet passes. The fins include a first fin, and an end portion of the first fin on an inlet side is arranged in an intermediate part of a first flow passage that is formed between a pair of the fins. The first flow passage is divided by the first fin into a second flow passage and a third flow passage. An interval between the pair of fins is wider on an outlet side than the inlet side. A sectional area of the first flow passage is substantially equal to a sum of sectional areas of the second flow passage and the third flow passage.Type: GrantFiled: February 13, 2019Date of Patent: August 31, 2021Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Naotaka Taniguchi, Akihiro Ozeki
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Patent number: 11098964Abstract: An air-cooled heat exchanger is connectable between an upstream fluid source and a downstream fluid destination by a plurality of external pipes having connection ends arranged in one or more external pipe connection configurations. The air-cooled heat exchanger has a cooling tubes assembly that includes a plurality of headers, a plurality of intermediate pipes connected to the plurality of headers, and a modular manifold system that connects the plurality of intermediate pipes to the plurality of external pipes. The modular manifold system includes a plurality of pipe elbows each connected to a corresponding one of the plurality of intermediate pipes, and one or more trays. Each of the plurality of pipe elbows is retained within the one or more trays in a configuration that matches the one or more external pipe connection configurations.Type: GrantFiled: April 30, 2019Date of Patent: August 24, 2021Assignee: Hudson Products CorporationInventors: Indian Martin, Chad Martin, Ron Kuegler, Scott Williams
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Patent number: 11097591Abstract: A system for controlling movements of doors of an HVAC module includes an actuation gear and an intermediate cam. A main door includes a first portion and a second portion having a first guide. The first portion engages with actuation gear to enable linear movement of the main door. A slave door includes a second engagement element and moves between a blocking and unblocking position based on movement of main door. The intermediate cam moves angularly and includes a first engagement element and a second guide. The first engagement element interacts with the first guide, and the second guide interacts with second engagement element to facilitate angular movement of slave door in response to movement of the main door. The first guide includes a bend positioned to enable angular movement of the slave door after the main door moves a pre-determined distance.Type: GrantFiled: April 30, 2019Date of Patent: August 24, 2021Assignee: Valeo North America, Inc.Inventors: Richard Sikorski, Darshan Parikh
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Patent number: 11092391Abstract: A heat transfer system includes a substrate having a heat exchange region including a surface having an enhancement region including alternating regions of selectively placed plurality of nucleation sites and regions lacking selectively placed nucleation sites, such that bubble formation and departure during boiling of a liquid in contact with the enhancement region induces liquid motion over the surface of the regions lacking selectively placed nucleation sites sufficient to enhance both critical heat flux and heat transfer coefficient at the critical heat flux in the enhancement region of the system.Type: GrantFiled: May 18, 2015Date of Patent: August 17, 2021Assignee: Rochester Institute of TechnologyInventors: Satish G. Kandlikar, Chinmay Patil
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Patent number: 11085709Abstract: A heat exchange unit is disclosed. At least one air opening of the heat exchange unit is formed from a sloped surface, enabling the area of the air opening to exceed the cross-sectional area of heat exchange of the heat exchange unit, and further enhancing heat exchange efficiency. A heat exchange device employing the heat exchange unit and a closed electrical apparatus employing the heat exchange device are also disclosed.Type: GrantFiled: February 11, 2011Date of Patent: August 10, 2021Assignee: DELTA ELECTRONICS, INC.Inventors: Lee-Long Chen, Chien-Hsiung Huang, Ya-Sen Tu, Zse-Hsin Wang
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Patent number: 11073344Abstract: A tube for a thermal transfer device can include a wall having a length and having an inner surface and an outer surface, wherein the inner surface forms a cavity. The tube can also include at least one first dimple pressed into the wall toward the cavity at a first location along the length of the wall, where the inner surface of the wall at the at least one first dimple is separated from itself by a first distance. The tube can further include at least one second dimple pressed into the wall toward the cavity at a second location along the length of the wall, where the inner surface of the wall at the at least one second dimple is separated from itself by a second distance. The cavity can be configured to receive a fluid that flows continuously along a length of the at least one wall.Type: GrantFiled: April 24, 2019Date of Patent: July 27, 2021Assignee: Rheem Manufacturing CompanyInventors: Kevin Williams, Amin Akbarimonfared
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Patent number: 11046583Abstract: The present disclosure provides a wave-to-heat conversion structure. The wave-to-heat conversion structure is a loose tissue formed by a plurality of intersect and hooking fibrous structures. The loose tissue retains a dendritic structure of the fibrous structure, and a plurality of micro-gaps are formed between the fibrous structures. The wave-to-heat conversion structure further includes a heat conductive layer, and the heat conduction coefficient of the heat conductive layer is ranged from about 10 W/m·K to 3000 W/m·K. The present disclosure provides a wave-to-heat conversion spectrum plate using the wave-to-heat conversion structure.Type: GrantFiled: November 3, 2017Date of Patent: June 29, 2021Assignee: NINGBO SINYUAN INDUSTRY GROUP CO., LTD.Inventor: YiLin Yuan
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Patent number: 11035627Abstract: A distributor includes a first member having a plurality of first through holes spaced apart from each other in the first direction, a second member having a first groove facing each of the plurality of first through holes, and a third member having at least one second groove facing at least one of the plurality of first through holes. The first groove extends in the first direction. The first space inside a groove is connected to a second space inside at least one second groove through a third space inside each of the plurality of first through holes. The third space is higher in flow path resistance than the first space and the second space.Type: GrantFiled: October 26, 2016Date of Patent: June 15, 2021Assignee: Mitsubishi Electric CorporationInventors: Ryota Akaiwa, Shinya Higashiiue, Yuta Komiya, Tsuyoshi Maeda
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Patent number: 11029101Abstract: A header for a header tank of a heat exchanger comprises a header wall defining a tube receiving portion having a plurality of longitudinally spaced tube openings formed therethrough. The tube receiving portion includes a planar portion and an adjacent offset portion. The planar portion is disposed on a first plane and the offset portion has a variable distance from the first plane as the offset portion extends away from the planar portion with respect to a longitudinal direction of the header.Type: GrantFiled: February 11, 2019Date of Patent: June 8, 2021Assignee: HANON SYSTEMSInventors: Richard Armsden, Tom Kelham