Abstract: Embodiments disclosed herein relate to a protection device and/or system that may include a thimble capable of being placed over a transmission line, such as an electrical power cord, to provide protection in the form of cut resistance, abrasion resistance, and/or impact resistance. In some embodiments, a plurality of thimbles can be placed over the transmission line to form an overlapping arrangement to protect a desired length of the transmission line. While each thimble may be rigid, semi-rigid, and/or flexible, the arrangement can maintain flexibility to allow for many degrees of movement of the electrical power cord even as it is cladded in the protection system.

Abstract: An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

Abstract: Two shot knuckles include a first shot component and a second shot component. Both shot components are composed of different dielectric materials, where the first shot is composed of a relatively high strength structural material and the second is composed of a cosmetic material. The first shot component can physically couple two conductive sections together by interfacing with a coupling structure of that section. The first shot component includes second shot retaining regions and a cosmetic region. The second shot component occupies the cosmetic region and anchors itself to the first shot component using the second shot retaining regions. The second shot may be the only part of the two-shot knuckle visible to a user of an electronic device and can exhibit any desired color.

Abstract: In some examples, a printed circuit board assembly can include a printed circuit board having four (4) central processor unit (CPU) sockets disposed thereon and sixty four (64) dual in-line memory modules (DIMMs) disposed thereon. The printed circuit board can have a top surface and a bottom surface with two (2) CPU sockets and thirty two (32) DIMMs disposed on the top surface and two (2) CPU sockets and thirty two (32) DIMMs disposed on the bottom surface.

Abstract: Embodiments of the present application provide a flexible display device which includes an elastic pressure plate and a flexible display screen. The flexible display screen is disposed on a first surface of the elastic pressure plate. The flexible display screen is bent and flattened through the elastic pressure plate.

Abstract: The present invention discloses a conductive film and a display apparatus provided with the conductive film. A conductive film is disposed on a display panel of a display apparatus, and has a base body, and a conductive section formed on one of the main surfaces of the base body. The conductive section has a mesh pattern composed of fine metal lines, and the fine metal lines have a tilt of 30-44° with respect to the alignment direction of pixels of the display apparatus.

Abstract: An apparatus includes a substrate, a first conductive pad and a second conductive pad, both disposed on the substrate, an electrically conductive trace, and a fusible alloy layer. The electrically conductive trace is laid out between the first and second pads, and is configured to conduct electrical current between the first and second pads, and has a serpentine pattern having multiple bends. The fusible alloy layer is disposed on the first pad and over a portion of the trace including no more than a predefined number of the bends.

Abstract: Oscillation mitigation circuits are implemented in a system for supplying electric power to load circuit boards, for example, load circuit boards entirely immersed into a bath of dielectric heat transfer fluid. The oscillation mitigation circuits can be used to protect the load circuit boards, including the connectors mounted on these load circuit boards, from an anomalous behavior of the electric power. The oscillation mitigation circuits are coupled between wire bundles forming a portion of the electric power supply and the connectors mounted on the load circuit boards.

Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.

Abstract: According to one embodiment, a display device includes a first substrate including a first base member and a first terminal, a second substrate including a second base member including a first surface opposing the first terminal and a second surface on an opposite side to the first surface, a second terminal located on a side of the second surface, and a first hole, an organic insulating layer located between the first terminal and the second base member and including a second hole connecting to the first hole and a connecting material provided on the first hole to electrically connect the first terminal and the second terminal to each other, at least one of the first terminal and the second terminal including an oxide electrode in contact with the connecting material.

Abstract: Systems and methods are disclosed for integration of an electrically functional structure in an information handling system. An information handling system may include may include a housing including a first housing portion coupled to a second housing portion. The first housing portion may include an electrically functional structure integrated within the first housing portion. The first housing portion may also include a first layer and a structural adhesive applied to the first layer. The first housing portion may further include a second layer and a thermally conductive adhesive applied to the second layer to bond the second layer to the first layer. The first housing portion may also include a PCB layer coupled between a first PCB and a second PCB, the PCB layer bonded to the second layer, and the electrically functional structure includes the first PCB and the second PCB.

Abstract: The present subject matter may include an electronic device. The electronic device may include a motherboard socket body. The motherboard socket body may be adapted to couple with a processor. The motherboard socket body may define an aperture in the motherboard socket body. The electronic device may include a socket insulator. The socket insulator may be coupled with the aperture in the motherboard socket body. The socket insulator may include an insulator body that may be sized and shaped to close the aperture in the motherboard socket body. The socket insulator may be configured to isolate electrical communication in portions of the motherboard socket body.

Abstract: An electric cable saddle, or support, arrangement includes a housing having an upper recessed portion adapted to receive and support one or more electrical cables in a fixed, stable manner. Plural apertures disposed on upper portions of the housing on opposed sides of the cable(s) and aligned generally transverse to the length of the cable(s) are adapted to receive a flexible, high strength tie member, or strap, for securely attaching the cable(s) to an upper portion of the housing. A slot disposed in a lower portion of the housing and also aligned generally transverse to the length of the cables(s) is adapted to receive a structural support member for supporting the housing and cable(s). A retaining member also disposed in a lower portion of the housing is moveable adjacent to or into engagement with the support member for fixed positioning of the housing on the support member.

Abstract: A component-embedded substrate includes a laminate and first and second components. The laminate includes resin layers each made of thermoplastic that are laminated together. The first and second components are embedded in the laminate. The first component has a length in the lamination direction that is greater than a length of the first component in a first direction orthogonal or substantially orthogonal to the lamination direction. The first and second components are disposed adjacent to each other in the first direction, and are disposed at respective positions overlapping with each other as viewed from the first direction. A distance between the first and second components in the first direction is less than the length of the first component in the lamination direction.

Abstract: A flexible printed circuit board that can reduce detachment when a flexible printed circuit board is attached to a display panel, and reduce a work cost, and simplify process, and reduce a tearing of the flexible printed circuit board due to a stress concentrated on a specific area of the flexible printed circuit board, and a display apparatus including the same. The flexible printed circuit board includes a base film having a notch at one side, on at least one side, and a plurality of rows of impact absorbing parts spaced apart from each other along the edge of the notch. The impact absorbing part provides a pattern layer one surface or both surfaces of the base film or a pattern hole of penetrating through the base film.

Abstract: A display panel used for coupling to another display panel in a side by side manner is disclosed, which includes: a first substrate, including a first hole, a first surface and a second surface opposite to the first surface; a first conductive layer disposed on the first surface of the first substrate; a first circuit layer disposed on the second surface of the first substrate; a first connecting element disposed in the first hole and connecting the first conductive layer and the first circuit layer; and a first sealing layer disposed on the first conductive layer, wherein the first hole at least partially overlaps the first sealing layer. In addition, a display device comprising two display panels disposed adjacent to each other is also disclosed.

Abstract: A display device according to an exemplary embodiment includes: a substrate including a display region configured to display an image, and a pad region positioned around the display region; and a first pad unit positioned on the pad region, wherein the first pad unit includes a first terminal region including a plurality of first pad terminals arranged in a first pattern, and a second terminal region including a plurality of second pad terminals arranged in a second pattern different from the first pattern.

Abstract: A display unit includes a display section having flexibility, and a bending control section configured to limit a movable shaft in bending the display section to one direction in a display surface and allowed to maintain the display section in an arbitrary bending state.

Abstract: The electronic assembly may include a flexible circuit board, a sensor, and a receiver. The flexible circuit board may include a first face and a second face opposite to the first face. The sensor may be disposed on the first face of the flexible circuit board and electrically connected to the flexible circuit board. The receiver may be disposed on the second face of the flexible circuit board. A sound channel for the receiver may be communicated to outside bypassing the flexible circuit board or through the flexible circuit board.

Abstract: Introduced here are several embodiments of network switch modules having interfaces designed to enable use of different voltages or currents. Accordingly, a network switch may be able to support both optical interfaces and electrical interfaces on the same printed circuit board (e.g., a line card or a fabric card). In some embodiments, the printed circuit board includes a “booster stage” electrical interface that is designed specifically for optical interfaces. Such a design enables the components of a switch to operate with both electrical interfaces and optical interfaces.