Abstract: A semiconductor memory device includes a plurality of semiconductor pillar projections separated by grooves formed in longitudinal and transverse directions in a substrate and arranged in a matrix manner, a MOS capacitor and a MOSFET formed on side surfaces at lower and upper portions, respectively, of each pillar projection, a diffusion layer of a source or drain of each MOSFET formed in an upper end face of the pillar projection, and a bit line connected to the diffusion layer. The bit line is in contact with the upper end face of the pillar projection in a self-alignment manner.