Patents Examined by Hoy King
  • Patent number: 7368079
    Abstract: A method for forming an ultra hard material layer is provided. The method includes disposing a metallic liner inside the periphery of a refractory metal enclosure, introducing ultra hard material feed stock into the enclosure, and sintering using HPHT processing and cooling to form the ultra hard material layer, substantially free of peripheral cracking, chipping and fracturing.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: May 6, 2008
    Assignee: Smith International, Inc.
    Inventors: Xian Yao, David DenBoer, Scott Horman
  • Patent number: 7282132
    Abstract: A film of zinc oxide electrochemically deposited from an aqueous solution is subjected to heat treatment at a temperature equal to or higher than 150° C. and equal to or lower than 400° C. in a nitrogen or inert gas atmosphere that contains oxygen, thereby obtaining a zinc oxide film that is low in electric resistance without impairing the light transmittance of the zinc oxide film.
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: October 16, 2007
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masumitsu Iwata, Noboru Toyama, Ryo Hayashi, Yuichi Sonoda, Tomonori Nishimoto, Takaharu Kondo, Satoru Yamada, Yusuke Miyamoto
  • Patent number: 7258720
    Abstract: A three-dimensional object of a desired shape is made by irradiating an optical beam on a metal powder layer to form a sintered layer and by laminating such sintered layer one above another. A metal powder composition for use in making such a three-dimensional object includes an iron-based powder material, a nickel and/or nickel alloy powder material, a copper and/or copper alloy powder material, and a graphite powder material. The graphite powder material acts to enhance the wettability during melting and to reduce microcracks during solidification.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: August 21, 2007
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Isao Fuwa, Norio Yoshida, Shushi Uenaga, Toshiharu Iwanaga, Yoshikazu Higashi, Hirohiko Togeyama, Satoshi Abe, Masataka Takenami, Takashi Shimizu
  • Patent number: 7223323
    Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: May 29, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Michael X. Yang, Ming Xi, Russell C. Ellwanger, Eric B. Britcher, Bernardo Donoso, Lily L. Pang, Svetlana Sherman, Henry Ho, Anh N. Nguyen, Alexander N. Lerner, Allen L. D'Ambra, Arulkumar Shanmugasundram, Tetsuya Ishikawa, Yevgeniy Rabinovich, Dmitry Lubomirsky, Yeuk-Fai Edwin Mok, Son T. Nguyen