Abstract: An inspection system (1) includes: a probe (12) that is hollow, extends in a rod shape along a center axis (11), and rotates around the center axis; an optical system (30) that, through the probe, supplies laser light for inspection purposes along the center axis and receives reflected light from a surface of an inspection target that has returned along the center axis; an optical element (50) that, through an opening at a front end of the probe, emits the laser light for inspection purposes toward the inspection target with respect to the center axis and guides the reflected light in the direction of the center axis; and a gas supplying system (80) that discharges gas (89) from the opening through the probe.

Abstract: An optical pulse stretcher includes a first delay optical system including a plurality of concave toroidal mirrors; and a beam splitter including a first surface and a second surface, causing a part of pulse laser light incident on the first surface to be transmitted in a first direction and output as a first beam and another part thereof to be reflected in a second direction and enter the first delay optical system, and causing a part of pulse laser light incident on the second surface from the first delay optical system to be reflected in the first direction and output as a second beam.

Abstract: A photoresist baking apparatus is provided. The photoresist baking apparatus includes a baking chamber, a hot plate disposed in the baking chamber, and a cover plate disposed over the hot plate. The cover plate has a plurality of exhaust holes. The exhaust holes include a first exhaust hole and a second exhaust hole arranged in a first direction. The first exhaust hole and the second exhaust hole have different sizes.

Abstract: A device manufacturing method including: performing a first exposure on a substrate using a first lithographic apparatus to form a first patterned layer including first features; processing the substrate to transfer the first features into the substrate; and performing a second exposure on the substrate using a second lithographic apparatus to form a second patterned layer including second features, wherein: the first lithographic apparatus has first and second control inputs effective to control first and second parameters of the first features at least partly independently; the second lithographic apparatus has a third control input effective to control the first and second parameters of the second features together; and the first exposure is performed with the first and/or second control input set to pre-bias the first and/or second parameter.

Abstract: A control apparatus for controlling a controlled object includes a measuring device configured to measure a state of the controlled object, and a controller configured to generate a manipulated variable corresponding to an output of the measuring device and a target value. The controller includes a compensator configured to output an index corresponding to the output of the measuring device and the target value, and a converter configured to convert the index into the manipulated variable such that a probability at which a predetermined manipulated variable is generated is a target probability.

Abstract: A photolithography device includes: a fixed slot, configured to install and fix the light source; a sensing module, configured to sense the distance information between the light source and the fixed slot; a prompt module, configured to send prompt information according to the distance information; and a determination module, configured to determine the installation status of the light source according to the prompt information.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for verification and re-use of process fluids. The apparatus generally includes a tool for performing lithography, and a recirculation path coupled to the tool. The recirculation path generally includes a collection unit coupled at first end to a first end of the tool, and a probe coupled at a first end to a second end of the collection unit, the probe for determining one or more characteristics of a fluid flowing from the tool. The recirculation path of the apparatus further generally includes a purification unit coupled at a first end to a third end of the collection unit, the purification unit further coupled at a second end to a second end of the probe, the purification unit for changing a characteristic of the fluid.

Abstract: A method of making a mirror for use with extreme ultraviolet (EUV) or X-ray radiation is disclosed. The method includes: a) providing an optical element having a curved mirror surface, wherein the curved mirror surface comprises localized defects that degrade performance of the curved mirror surface; b) spin-coating the curved mirror surface with a material to cover at least some of the defects; and c) curing the spin-coated material on the curved mirror surface to reduce the number of defects and improve the performance of the curved mirror surface. Also disclosed is a mirror made by the method.

Abstract: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.

Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

Abstract: A metrology system may include a characterization tool configured to generate metrology data for a sample based on the interaction of an illumination beam with the sample, and may also include one or more adjustable measurement parameters to control the generation of metrology data. The metrology system may include one or more processors that may receive design data associated with a plurality of regions of interest for measurement, select individualized measurement parameters of the characterization tool for the plurality of regions of interest, and direct the characterization tool to characterize the plurality of regions of interest based on the individualized measurement parameters.

Abstract: A lithography apparatus includes a detector that detects an original-side mark image and a substrate-side mark image via a projection optical system, and a controller. The detector generates refocusable light field image data that includes the original-side mark image and the substrate-side mark image. The controller performs, based on the light field image data obtained from the detector, a refocus operation of reconstructing a plurality of images different in position in a focus direction and adjusts a position of at least one of the original holder and the substrate holder based on the plurality of images reconstructed by the refocus operation.

Abstract: A movable body apparatus includes a base member, a movable body that is movable at least two-dimensionally, parallel to a predetermined plane, on the base member, a planar motor of a magnetic levitation method having a stator provided at the base member and a mover provided at the movable body, a measurement system that measures a position of the movable body in a direction parallel to the predetermined plane, and a controller. The controller limits movement of the movable body in the direction parallel to the predetermined plane by applying, to the movable body, a driving force generated by the planar motor, directed from the movable body to the base member in a direction intersecting the predetermined plane.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid.

Abstract: A substrate processing apparatus includes: a rotary cylindrical member (DR) that includes a cylindrical supporting surface curved with a constant radius from a predetermined center line (AX2) and that feeds a substrate (P) in a length direction of the substrate; a processing mechanism that performs a predetermined process on the substrate at a specific position (PA, EL2) of a part of the substrate; a scale member (SD) that rotates about the center line along with the rotary cylindrical member so as to measure a displacement in a circumferential direction of the supporting surface of the rotary cylindrical member or a displacement in a direction of the center line of the rotary cylindrical member and that includes a scale portion (GP) carved in a ring shape; and a reading mechanism (EN1, EN2) that faces the scale portion, that is disposed in substantially a same direction as the specific position when viewed from the center line, and that reads the scale portion.

Abstract: An immersion lithography apparatus comprises a temperature controller configured to adjust a temperature of a projection system, a substrate and a liquid towards a common target temperature. Controlling the temperature of these elements and reducing temperature gradients may improve imaging consistency and general lithographic performance. Measures to control the temperature may include controlling the immersion liquid flow rate and liquid temperature, for example, via a feedback circuit.

Abstract: A lithographic projection apparatus is disclosed for use with an immersion liquid positioned between the projection system and a substrate. Several methods and mechanism are disclosed to protect components of the projection system, substrate table and a liquid confinement system. These include providing a protective coating on a final element of the projection system as well as providing one or more sacrificial bodies upstream of the components. A two component final optical element of CaF2 is also disclosed.

Abstract: A target image-capture device may be configured to capture an image of a target that is made into plasma when irradiated with laser light and generates extreme-ultraviolet-light. The target image-capture device may include a droplet detector configured to detect passage of a droplet output as the target, and output a detection signal, an illumination light source, an image capturing element, a shutter device, and a controller configured to output, to the image capturing element, an exposure signal allowing the image capturing element to perform image capturing, and output, to the shutter device, a shutter open/close signal allowing a shutter to perform an open and close operation upon input of the detection signal. The controller may output the shutter open/close signal to the shutter device to make the shutter closed during when the droplet is irradiated with the laser light so that the plasma is generated.

Abstract: An inspection method determines values of profile parameters of substrate patterns. A baseline substrate with a baseline pattern target (BP) is produced that has a profile described by profile parameters, for example CD (median critical dimension), SWA (side wall angle) and RH (resist height). Scatterometry is used to obtain first and second signals from first and second targets. Values of differential pattern profile parameters are calculated using a Bayesian differential cost function based on a difference between the baseline pupil and the perturbed pupil and dependence of the pupil on pattern profile parameters. For example, the difference is measured between a baseline process and a perturbed process for stability control of a lithographic process. Fed-forward differential stack parameters are also calculated from observations of stack targets on the same substrates as the pattern targets.

Abstract: An alignment apparatus for aligning a substrate, and a substrate processing system including such alignment apparatus. The alignment apparatus includes an alignment base for supporting the substrate and/or a substrate support member. A force generating device applies a contact force on the substrate. The force generating device includes an arm including a rigid proximal end and a rigid distal end. The distal end is provided with a contact section for contacting an edge of the substrate and an elastically deformable arm section extending between the proximal and distal ends. The connection part connects the proximal end to the alignment base. The arm is movable with respect to the alignment base via the connection part. The alignment apparatus also includes an actuator for causing a displacement of the proximal end, whereby the contact force, defined by the elastically deformable arm section, is applied to the substrate by the contact section.