Patents Examined by Hung Ngo
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Patent number: 9197154Abstract: A detachable solar junction box base is disclosed, having a junction box, whose left and right sides being respectively installed with a pivotal connection button, and the bottom side thereof being installed with at least an elastic snap tab, two elastic clip tabs, a first connection port and a second connection port; and a base, the body thereof being an integral base formed by two arm parts and a traverse board part, in which the two arm parts are located at the left and right sides of the base and the traverse board part is disposed at the front end of the base, and in which each of the arm parts is respectively installed with an ear seat and a pivotal connection hole at the interior corner thereof, as well as a hollow accommodation part constituted by the arm parts and the traverse board part to receive the junction box.Type: GrantFiled: October 19, 2012Date of Patent: November 24, 2015Assignee: T-Conn Precision CorporationInventor: Chang Wei
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Patent number: 8981238Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.Type: GrantFiled: June 22, 2010Date of Patent: March 17, 2015Assignee: Osram Opto Semiconductor GmbHInventors: Michael Zitzlsperger, Stefan Grötsch
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Patent number: 8933347Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.Type: GrantFiled: September 11, 2012Date of Patent: January 13, 2015Inventors: Bryan P. Kiple, Charles B. Woodhull, David A. Pakula, Tang Y. Tan
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Patent number: 8907231Abstract: An apparatus and a method are disclosed. The apparatus includes: a display panel having a length, a width and a depth; and a film including a first portion, extending along a surface of the display panel defined by the length and the width, and a second portion, extending at least partially along the depth, coupled to an electronic device housing.Type: GrantFiled: July 18, 2012Date of Patent: December 9, 2014Assignee: Nokia CorporationInventor: Vicente Calvo Alonso
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Patent number: 8907213Abstract: An electric junction box for preventing brackets, while inclined to each other, from being fastened together, comprises a first cassette block and a second cassette block. Brackets of the first block and the second block are stacked onto each other, a bolt is passed through each of the through holes, and the blocks are fastened together. A metal collar formed tubular in nearly eclipse cross-sectional shape is also attached to inner surfaces of the through holes formed into nearly ellipse cross-sectional shape. Each of the collars is attached to each of the brackets so that long axes of the collars intersect to each other.Type: GrantFiled: July 27, 2012Date of Patent: December 9, 2014Assignee: Yazaki CorporationInventors: Sunsoku I, Masahiro Akahori
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Patent number: 8901439Abstract: An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.Type: GrantFiled: August 18, 2006Date of Patent: December 2, 2014Assignee: STATS ChipPAC Ltd.Inventors: Chee Keong Chin, Yu Feng Feng, Guo Qiang Shen
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Patent number: 8895851Abstract: A magnetically shielded cable arrangement, comprising at least two AC cables (201-203) comprising a spaced portion extending between two close portions of parallel cables, such spaced portion sequentially including a diverging portion, a widely spaced portion and a converging portion, and an EMF shielding system (1) laid over said at least two AC cables (201-203), said EMF shielding system (1) comprising a conductor (2, 3, 11, 12) having two branches (2, 3) forming a median portion (4, 5) and end portions (7-10), the median portion width being equal to or larger than the AC cables distance in the widely spaced portion and the width at the extremities of the end portions (7-10) being larger than the AC cables distance in the close portions and smaller than the AC cables distance in the widely spaced portion, said conductor (2, 3, 11, 12) comprising an inner electrical path (2a, 3a) and an outer electrical path (2e, 3e) connected together (11, 12) at relevant longitudinal ends.Type: GrantFiled: April 23, 2010Date of Patent: November 25, 2014Assignee: Prysmian S.p.A.Inventor: Paolo Maioli
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Patent number: 8890003Abstract: An apparatus for electromagnetic compatibility (EMC) shielding, the apparatus comprising a first EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. A second EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. The first EMC shield coupled to the second EMC shield, wherein at least one finger element of the plurality of finger elements of the first EMC shield is situated between at least two finger elements of the plurality of finger elements of the second EMC shield and in parallel with the at least two finger elements such that a space is formed between the at least one finger element and at least one of the at least two finger elements.Type: GrantFiled: January 3, 2013Date of Patent: November 18, 2014Assignee: International Business Machines CorporationInventors: James D. Gerken, David B. Johnson, David G. Lund, Timothy L. McMillan
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Patent number: 8878080Abstract: An electromagnetic interference shield enclosure with an extended edge defining a sleeve, the enclosure and sleeve having an outer protective layer and an inner shielding layer to shield electronic devices from electromagnetic interference. The outer layer and inner layer may be transparent to view the electronic device. A magnet system may be provided to allow the device to be operated while in the enclosure. The auxiliary cable with filtering mechanisms may be provided inside the sleeve to allow access and transfer of data from the electronic device while still in the enclosure.Type: GrantFiled: May 14, 2012Date of Patent: November 4, 2014Assignee: E.C. Ryan International, Inc.Inventors: Ryan Judy, Deniz Armani
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Patent number: 8872042Abstract: An inflatable, lightweight shielded enclosure that includes one or more inflatable, lightweight shielded beams arranged to support a shielded material, and an inflatable, lightweight shielded connection system for connection to a control system is provided along with related methods. The enclosure may have a weight of approximately twenty-one pounds, and provide an attenuation of 70 dB to 80 dB for a 1 GHz signal.Type: GrantFiled: May 14, 2012Date of Patent: October 28, 2014Assignee: InTech Defense, LLCInventors: Marc Cordes, Paul LaHaye
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Patent number: 8867200Abstract: According to one embodiment, an electronic apparatus includes a first housing, a first display and a transparent first panel. The first display in the first housing includes a first display portion. The first panel covers the first display portion and includes a first flat surface portion and a first curved surface portion along an outer edge of the first flat surface portion. The first display portion displays images in a location corresponding to the first flat surface portion and a location corresponding to the first curved surface portion respectively at different aspect ratios from each other.Type: GrantFiled: February 14, 2012Date of Patent: October 21, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Hiromichi Suzuki, Takashi Minemura, Yuji Nakajima
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Patent number: 8866013Abstract: A terminal box includes: a main body (101); at least one pair of terminal strips (106) which are connectable to a positive electrode and a negative electrode of a solar cell module; and a backflow prevention diode (118) bridged between the terminal strips (106) to connect the terminal strips (106). The terminal strip (106) and the backflow prevention diode (118) are contained in the main body (101). The terminal strip (106) includes: a supporting part (S) for supporting a lead wire (118a) of the backflow prevention diode (118) in a mounted state; a pinching part (K) for supporting the lead wire (118a) in a pinched state; and a recess (119B) which is provided between the supporting part (S) and the pinching part (K) and configured to position a connecting solder upon connecting the lead wire (118a) and the terminal strip (106).Type: GrantFiled: April 1, 2014Date of Patent: October 21, 2014Assignee: Hosiden CorporationInventor: Yutaka Masumoto
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Patent number: 8866011Abstract: A connection mechanism is provided. The connection mechanism includes a first fixing member, a fixer, an elastic element, a second fixing member and a connection element. The first fixing member includes a first side and second side, wherein the first side is opposite to the second side. The fixer passes through the first fixing member and is pivotable relative to the first fixing member along the first direction, wherein the fixer has a head portion and an end portion. The head portion is located on the first side and has an outer surface, and the second portion protrudes from the second side. The elastic element is disposed on the first side of the first fixing member and is abutting the outer surface, to prevent the fixer from rotating along a direction opposite the first direction. The connection element is disposed on the second fixing member and has a hollow structure.Type: GrantFiled: July 5, 2012Date of Patent: October 21, 2014Assignee: Acer IncorporatedInventor: Chi-Yuan Liu
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Patent number: 8859913Abstract: An electromagnetic interference shield having a main enclosure and at least one auxiliary enclosure. The auxiliary enclosure in the main enclosure and an interior that is continuous with each other. The auxiliary enclosure is made of elastic Faraday material. The outer layer and inner layer may be transparent to view the electronic device. An auxiliary cable with filtering mechanisms may be provided inside a sleeve to allow access and transfer of data from the electronic device while still in the main enclosure.Type: GrantFiled: June 20, 2013Date of Patent: October 14, 2014Assignee: E. C. Ryan International, Inc.Inventor: Ryan Judy
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Patent number: 8861194Abstract: A system for protecting portable electronic devices within a disposable protective enclosure is disclosed. The system includes a housing, one or more processors, and a power source. A display is communicatively coupled to the one or more processors. One or more user interfaces are communicatively coupled to the one or more processors. A device encapsulator is communicatively coupled to the one or more processors. The device encapsulator includes a receiving area that is configured to receive at least one portable electronic device and a reactive disposable enclosure material. The device encapsulator further includes at least a first forming element disposed above the receiving area and at least a second forming element disposed below the first forming element. The first and second forming elements are configured to apply a stimulus to the reactive disposable enclosure material.Type: GrantFiled: January 11, 2011Date of Patent: October 14, 2014Assignee: Nash Martin Holdings, LLCInventor: Michael Schiffman
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Patent number: 8853564Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole.Type: GrantFiled: April 30, 2010Date of Patent: October 7, 2014Assignee: Ubotic Intellectual Property Co. Ltd.Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
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Patent number: 8835777Abstract: An electronic device having a slide cover slidably attached in an openable/closable manner to a device case, and conceals a recording paper ejection opening in the device case; a waterproof gasket provided on either one of the slide cover and the device case in a part positioned in periphery of the recording paper ejection opening, and arranged between the slide cover and the device case surrounding the recording paper ejection opening, when the slide cover conceals the recording paper ejection opening; and a guide member which does not come in contact with the waterproof gasket on another side of the slide cover and the device case with which the waterproof gasket meets face to face during a sliding motion of the slide cover, and the waterproof gasket presses on both sides between the slide cover and the device case when the sliding motion is completed.Type: GrantFiled: January 29, 2013Date of Patent: September 16, 2014Assignee: Casio Computer Co., LtdInventor: Hiromasu Meguro
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Patent number: 8829363Abstract: A receptacle for supporting a transponder on a support structure includes a housing having a first housing portion securable to the transponder and a second housing portion securable to the support structure. The first housing portion is pivotally secured to the second housing portion. The first housing portion and second housing portion include a shield for attenuating the transmission of electromagnetic signals. The first housing portion has a first position wherein the first housing portion and second housing portion form a chamber for enclosing the transponder and restricting the transmission of electromagnetic signals from the chamber. The first housing portion has a second position wherein the first housing portion and the transponder are displaced from the second housing portion thereby opening the chamber and exposing the transponder to permit the transmission of electromagnetic signals to and from the transponder.Type: GrantFiled: December 9, 2011Date of Patent: September 9, 2014Inventors: David Centner, Burt Faure, Jonathan Schweiger
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Patent number: 8822844Abstract: A method for shielding an electrical circuit may include depositing a potting material upon the electrical circuit. The method may include providing a path to a ground of the electrical circuit. The method may also include depositing an electrically conductive coating upon the electrical circuit and over the potting material. The method may further include connecting the electrically conductive coating to the ground of the electrical circuit.Type: GrantFiled: September 27, 2010Date of Patent: September 2, 2014Assignee: Rockwell Collins, Inc.Inventors: Mark T. Dimke, Brandon C. Hamilton, Luke W. Horak
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Patent number: 8816219Abstract: Provided is a metal strip for an electromagnetic interference shield case. The metal strip is uniform in width and thickness. A metal clip that is integrated with at least one pair of face-to-face elastic parts and is appropriate for soldering is fitted on an end of the metal strip along a width direction of the metal strip. The metal strip is bent and cut so as to have a shape corresponding to a ground pattern disposed on a printed circuit board, and then, a bottom surface of the metal clip is soldered to the ground pattern or a solder member disposed on the ground pattern.Type: GrantFiled: May 16, 2012Date of Patent: August 26, 2014Assignees: Joinset Co. Ltd.Inventor: Sun-Ki Kim