Patents Examined by Hung Q Lam
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Patent number: 11828983Abstract: Structures for a cavity included in a photonics chip and methods of fabricating a structure for a cavity included in a photonics chip. The structure includes a substrate, a back-end-of-line stack having interlayer dielectric layers on the substrate, and a cavity penetrating through the back-end-of-line stack and into the substrate. The cavity includes first sidewalls and second sidewalls, and the second sidewalls have an alternating arrangement with the first sidewalls to define non-right-angle corners.Type: GrantFiled: January 17, 2022Date of Patent: November 28, 2023Assignee: GlobalFoundries U.S. Inc.Inventors: Ian Melville, Nicholas Polomoff, Thomas Houghton, Koushik Ramachandran, Pallabi Das
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Patent number: 11815709Abstract: An optical device has a light-transmitting substrate, an optical coupling-out configuration, and an optical arrangement. The light-transmitting substrate has at least two major surfaces and guides light by internal reflection between the major surfaces. The optical coupling-out configuration couples the light, guided by internal reflection, out of the light-transmitting substrate toward an eye of a viewer. The optical arrangement is associated with at least one of the two major surfaces, and has a first optical element and a second optical element. The optical elements are optically coupled to each other to define an interface region associated with at least a portion of the coupling-out configuration. The interface region deflects light rays that emanate from an external scene that are incident to the optical arrangement at a given range of incident angles.Type: GrantFiled: March 17, 2021Date of Patent: November 14, 2023Assignee: LUMUS LTD.Inventors: Eitan Ronen, Edgar Friedmann
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Patent number: 11815748Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: GrantFiled: December 2, 2021Date of Patent: November 14, 2023Assignee: Rockley Photonics LimitedInventors: James Dongyoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Patent number: 11808980Abstract: A compact silicon waveguide mode converter, a dielectric meta-surface structure based on periodical oblique subwavelength perturbations, including a top silicon structure with oblique subwavelength perturbations etched in certain periods with period length of ?, a duty cycle and an oblique angle ? on the SOI substrate. The invention adopts an all-dielectric meta-surface structure with oblique subwavelength perturbation, which can achieve a compact mode conversion from fundamental mode to arbitrary high-order mode of silicon waveguide, and can improve the optical communication capacity greatly.Type: GrantFiled: June 25, 2019Date of Patent: November 7, 2023Assignee: SHANGHAI JIAOTONG UNIVERSITYInventors: Hongwei Wang, Yong Zhang, Yu He, Lu Sun, Yikai Su
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Patent number: 11808979Abstract: A method of fabricating a device coupon including a waveguide which is suitable for use in a micro-transfer printing process. The method comprises the steps, on a wafer, of: depositing a lower cladding layer on an uppermost surface of the wafer; providing a silicon nitride guiding layer on an uppermost surface of the lower cladding; depositing an upper cladding over at least an uppermost surface of the silicon nitride guiding layer; providing a tether over the coupon, and etching away a region of the uppermost layer of the wafer located between the lower cladding layer and a substrate of the wafer, thereby leaving the lower cladding layer, silicon nitride guiding layer, and upper cladding layer suspended above the wafer via the tether.Type: GrantFiled: March 16, 2021Date of Patent: November 7, 2023Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Aaron John Zilkie
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Patent number: 11808975Abstract: A semiconductor structure and a fabrication method are provided. The semiconductor structure includes: a base substrate, an optical waveguide layer over the base substrate; a first dielectric layer over the base substrate; a cavity between the first dielectric layer and the optical waveguide layer; and a second dielectric layer on the first dielectric layer and the optical waveguide layer. The cavity is located on sidewall surfaces of the optical waveguide layer and has a bottom coplanar with a bottom of the optical waveguide layer. The second dielectric layer is located on a top of the cavity and seals the cavity.Type: GrantFiled: December 27, 2021Date of Patent: November 7, 2023Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) CorporationInventors: Jun Liu, Hong Gang Dai, Dong Xiang Cheng
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Patent number: 11803010Abstract: Structures for an optical coupler and methods of fabricating a structure for an optical coupler. The structure includes a first waveguide core having a first tapered section and a second waveguide core having a second tapered section positioned adjacent to the first tapered section of the first waveguide core. The second tapered section is positioned with a lateral offset in a lateral direction relative to the first tapered section. The second tapered section is positioned with a vertical offset in a vertical direction relative to the first tapered section.Type: GrantFiled: November 11, 2021Date of Patent: October 31, 2023Assignee: GlobalFoundries U.S. Inc.Inventor: Yusheng Bian
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Patent number: 11804452Abstract: A photonic integrated circuit (PIC) structure includes an active region in at least an active layer over a substrate, the active region including a plurality of transistors therein. A plurality of dielectric interconnect layers are over the active region, and an opening is defined through the plurality of dielectric interconnect layers. The opening extends to at least the active layer. A barrier is within the plurality of dielectric interconnect layers and surrounding the opening. An optical element is positioned in the opening. The barrier prevents stress damage, such as cracks and/or delaminations, from propagating from or to the opening, and maintains the hermetic seal of the PIC structure.Type: GrantFiled: July 30, 2021Date of Patent: October 31, 2023Assignee: GLOBALFOUNDRIES U.S. Inc.Inventors: Nicholas A Polomoff, Jae Kyu Cho, Mohamed Rabie, Yunyao Jiang, Koushik Ramachandran, Pallabi Das
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Patent number: 11796644Abstract: An apparatus including a light detection and ranging (LiDAR) antenna of an optical phased array includes a silicon-on-insulator substrate including a silicon wire waveguide embedded within the substrate and a grating layer disposed over the substrate. The grating layer includes a silicon nitride layer coating the silicon-on-insulator substrate and including a plurality of etchings formed in a direction perpendicular to a longitudinal axis of the optical phased array and a silicon oxynitride layer coating the silicon nitride layer and filling the etchings. The etchings are relatively thin in the direction of the longitudinal axis of the optical phased array at a first end of the optical antenna and are relatively thick in the direction of the longitudinal axis at a second end. The etchings gradually increase in thickness between the first end of the optical phased array and the second end of the optical antenna.Type: GrantFiled: March 10, 2020Date of Patent: October 24, 2023Assignee: GM Global Technology Operations LLCInventors: Raymond Sarkissian, Keyvan Sayyah, Biqin Huang
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Patent number: 11796353Abstract: This application relates to a fibre optic cable (104, 300) suitable for use with a distributed fibre optic sensor apparatus (106). The fibre optic cable includes at least one optical fibre (301) and a force transformer (304) mechanically coupled to the at least one optical fibre. The cable may also include at least one cladding later (302) and/or a compliant material (303). The cable may be surrounded by a jacket layer (306). The force transformer (304) is configured to transform transverse forces due to dimension changes of the cable arising from a temperature variation of the cable into longitudinal forces to counteract the longitudinal component of said dimension change over a tuned temperature range. In this way optical path length changes due to a change of temperature can be reduced or eliminated providing a cable which is insensitive to temperature.Type: GrantFiled: January 30, 2018Date of Patent: October 24, 2023Assignee: Optasense Holdings LimitedInventor: Alastair Godfrey
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Process flow with pre-biased mask and wet etching for smooth sidewalls in silicon nitride waveguides
Patent number: 11782211Abstract: Aspects of the present disclosure are directed to process flow to fabricate a waveguide structure with a silicon nitride core having atomic-level smooth sidewalls achieved by wet etching instead of the conventional dry etching process. A mask is pre-biased to account for lateral etching during the wet-etching steps.Type: GrantFiled: December 16, 2022Date of Patent: October 10, 2023Assignee: Anello Photonics, Inc.Inventor: Avi Feshali -
Patent number: 11760092Abstract: An inkjet head including a flow path unit and a plurality of actuator units, each of the plurality of actuator units has a parallelogram shape defined by two sets of opposing sides, which is substantially parallel to a first direction and a second direction intersecting with each other along a plane, the side of the actuator unit parallel to the second direction is substantially parallel to that of an adjacent actuator unit and is shifted from that of the adjacent actuator unit in the second direction, the plurality of actuator units are inclined with respect to two contour lines of a flow path unit, the two contour lines being parallel with each other and extending in a longitudinal direction of the flow path unit, and centers of gravity of contours of the plurality of actuator units are arranged on substantially one straight line which is parallel to the contour lines.Type: GrantFiled: April 16, 2021Date of Patent: September 19, 2023Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventor: Atsuo Sakaida
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Patent number: 11733582Abstract: A tunable optical filter includes sequentially coupled Mach-Zehnder (MZ) interferometers. The first and last interferometers are configured to function as variable power splitter/combiner, whereas the middle interferometer or interferometers have unequal optical paths, creating a desired spectral response of the entire filter. The amplitude of the spectral response can be varied by varying the optical power splitting/combining ratios.Type: GrantFiled: March 15, 2018Date of Patent: August 22, 2023Assignee: GC Photonics, Inc.Inventor: Lijie Qiao
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Patent number: 11726262Abstract: An in-plane photonic device is provided for transmission of an optical signal across a gap, in particular an in-plane photonic device for use in a photonic integrated circuit with one or more in-plane crossings of electrical connections and photonic waveguides. One embodiment relates to an in-plane photonic device for use in a photonic integrated circuit with in-plane crossings of electrical connections and photonic waveguides, including: at least one input optical waveguide; and at least one output optical waveguide; wherein the at least one input optical waveguide and the at least one output optical waveguides are positioned such that a gap between them separates the input and the output optical waveguide(s), and wherein the input and the output optical waveguides are configured for optical mode matching across the gap, such that an optical signal can be transmitted from the input optical waveguide to the output optical waveguide across the gap.Type: GrantFiled: May 18, 2022Date of Patent: August 15, 2023Assignee: DANMARKS TEKNISKE UNIVERSITETInventors: Marcus Albrechtsen, Babak Vosoughi Lahijani, Søren Stobbe, Rasmus Ellebæk Christiansen
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Patent number: 11726381Abstract: The present disclosure relates to a modulator arrangement, including at least a first and a second electro-optical Mach-Zehnder modulator. At least one optical waveguide of the first Mach-Zehnder modulator crosses at least one optical waveguide of the second Mach-Zehnder modulator. A method for fabricating a modulator arrangement is also disclosed herein.Type: GrantFiled: February 21, 2019Date of Patent: August 15, 2023Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Inventor: Alessandro Aimone
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Patent number: 11719948Abstract: An apparatus includes a laser system that includes a first fiber having an output end and situated to propagate a first laser beam with a first beam parameter product (bpp) and a second fiber having an input end spliced to the output end of the first fiber at a fiber splice so as to receive the first laser beam and to form a second laser beam having a second bpp that is greater than the first bpp, wherein the output end of the first fiber and the input end of the second fiber are spliced at a tilt angle so as to increase the first bpp to the second bpp.Type: GrantFiled: August 6, 2020Date of Patent: August 8, 2023Assignee: nLIGHT, Inc.Inventors: David Logan, Ryan Hawke, David R. Balsley, Ron Stevens
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Patent number: 11662585Abstract: A display subsystem for a virtual image generation system comprises a planar waveguide apparatus, an optical fiber, at least one light source configured for emitting light from a distal end of the optical fiber, and a mechanical drive assembly to which the optical fiber is mounted as a fixed-free flexible cantilever. The drive assembly is configured for displacing a distal end of the optical fiber about a fulcrum in accordance with a scan pattern, such that the emitted light diverges from a longitudinal axis coincident with the fulcrum. The display subsystem further comprises an optical modulation apparatus configured for converging the light from the optical fiber towards the longitudinal axis, and an optical waveguide input apparatus configured for directing the light from the optical modulation apparatus down the planar waveguide apparatus, such that the planar waveguide apparatus displays one or more image frames to an end user.Type: GrantFiled: January 7, 2021Date of Patent: May 30, 2023Assignee: Magic Leap, Inc.Inventors: Ivan Yeoh, Hui-Chuan Cheng, Lionel Ernest Edwin, David Tinch, William Hudson Welch
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Patent number: 11656408Abstract: The present invention relates to an optical assembly comprising a first optical circuit and a second optical circuit. The invention further relates to an optical device in which the first and second optical circuit are fixedly connected to each other. In addition, the present invention relates to a method for manufacturing the optical device. According to the invention, flexible waveguide ends of waveguides on the second optical circuit are used that extend upwards from the second optical circuit to optically couple to waveguides on the first optical circuit.Type: GrantFiled: September 27, 2021Date of Patent: May 23, 2023Assignee: Photon IP B.V.Inventor: Rui Manuel Lemos Alvares Dos Santos
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Patent number: 11656413Abstract: A fiber optic cable slack management module includes a base defining a first cable management spool, an outer face of which is configured to contact cables when cables are pulled away from the base and a second cable management spool, within which the first cable management spool is located. An inner face of the second cable management spool is configured to contact cables when cables are in a relaxed, non-pulled state. The fiber optic cable slack management module defines a cable exit adjacent the first cable management spool and defined at least partially by the inner face of the second cable management spool, the cable exit defined by a channel positioned between the first and second cable management spools.Type: GrantFiled: October 29, 2020Date of Patent: May 23, 2023Assignee: CommScope Technologies LLCInventors: Paula Rudenick, Brent Campbell, James J. Solheid, Duane R. Sand
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Patent number: 11650439Abstract: Embodiments provide for an optical modulator that includes a first silicon region, a polycrystalline silicon region; a gate oxide region joining the first silicon region to a first side of the polycrystalline region; and a second silicon region formed on a second side of the polycrystalline silicon region opposite to the first side, thereby defining an active region of an optical modulator between the first silicon region, the polycrystalline region, the gate oxide region, and the second silicon region. The polycrystalline silicon region may be between 0 and 60 nanometers thick, and may be formed or patterned to the desired thickness. The second silicon region may be epitaxially grown from the polycrystalline silicon region and patterned into a desired cross sectional shape separately from or in combination with the polycrystalline silicon region.Type: GrantFiled: January 12, 2021Date of Patent: May 16, 2023Assignee: Cisco Technology, Inc.Inventors: Alexey V. Vert, Mark A. Webster