Patents Examined by Hung V. Ngo
-
Patent number: 11974419Abstract: Methods, systems, and apparatuses for electromagnetic shielding are provided, particularly for semiconductor packages and/or printed circuit boards. For example, an optical device covered by an RF can may be attached to a substrate. The RF can may have a first aperture for an optical path of the optical device. A deposition layer may provide electromagnetic shielding in conjunction with the RF can. The deposition layer may include one or more portions that are deposited at the same time, including a first portion with an aperture that narrows the aperture of the RF can. The deposition layer, after being deposited, may be cured. The deposition layer and RF can may provide electromagnetic shielding for the optical device.Type: GrantFiled: June 13, 2023Date of Patent: April 30, 2024Inventors: Florian Perminjat, Karine Saxod, Etienne Brosse
-
Patent number: 11974418Abstract: This document describes a light-sealing gasket with crossbar force distribution. The gasket can be used in an electronic device with a sensor package that is capable of transmitting and receiving signals and is positioned behind a display of the device. The gasket provides a shield between the receive signals and the transmit signals, prevents signal crosstalk, and protects the delicate panel layer of the display. Use of this gasket in an electronic device allows manufacturers to add more features to the device and enrich the user experience.Type: GrantFiled: February 11, 2021Date of Patent: April 30, 2024Assignee: Google LLCInventors: David I. Rosen, Matthew Douglas Dombach, James L Tanner, Warren Z. Jones, Timothy Patrick Barber
-
Patent number: 11974417Abstract: A shelter with electromagnetic interference (EMI) protection includes first and second wall panels including EMI protection. The panels are connected by at least one of: (i) a hinged connection; (ii) a scissor joint connection. The hinged connection includes an EMI protected hinge that extends between the first and second panels and includes a first hinge leaf, a second hinge leaf, and a hinge joint. A flexible EMI protection covering extends across the hinge joint. The scissor joint connection includes a first hook connected to the first panel and a second hook connected to the second panel and an EMI gasket is located in an open channel of the first hook. Part of the first hook is received in a second open channel of the second hook and part of the second hook is received in the first open channel of the first hook and the gasket is compressed.Type: GrantFiled: February 8, 2023Date of Patent: April 30, 2024Assignees: HDT Expeditionary Systems, Inc., Berg Companies, Inc.Inventors: Charles Deighton, Travis Lontz, Wade Milek, Brent Condie
-
Patent number: 11964347Abstract: A safety plug for a female welding lead connector configured to remain tethered to the female welding lead connector and including a male head configured in the shape of a male end of a male welding lead connector so that the male head of the safety plug can be inserted into a female welding lead connector, rotated, and secured in place inside a female welding lead connector in the same manner as a male welding lead connector.Type: GrantFiled: March 31, 2022Date of Patent: April 23, 2024Assignee: Alpha/Omega Energy Solutions, LLCInventors: Bradley Lance Pearman, Kenny Lavelle Miller
-
Patent number: 11966094Abstract: Sealing assembly for cable ports of a telecommunications closure. The sealing assembly includes a plurality of seal blocks that cooperate with each other to define 3-dimensional labyrinth seals around cables entering the closure through the cable ports. In some examples, the seal blocks cooperate to be self-sealing even without a cable or other structure being present.Type: GrantFiled: June 18, 2021Date of Patent: April 23, 2024Assignee: COMMSCOPE CONNECTIVITY BELGIUM BVBAInventors: El Moïz Mohammed Michel Ghammam, Philippe Coenegracht, Bart Mattie Claessens
-
Patent number: 11961676Abstract: An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.Type: GrantFiled: June 23, 2022Date of Patent: April 16, 2024Assignee: TDK CORPORATIONInventors: Akihiro Masuda, Shinya Ito, Norihisa Ando, Kosuke Yazawa, Yoshiki Satou, Katsumi Kobayashi
-
Patent number: 11963342Abstract: Provided is an electromagnetic interference mitigation apparatus including a power supply; a power cord; a power supply chassis encapsulating at least the power supply, the power supply physically isolated from the power cord; a low value resistor in electrical communication with at least the power cord and the power supply; and a capacitor disposed between the power supply chassis and an equipment chassis, wherein the equipment chassis encapsulates the power supply chassis, wherein the equipment chassis is disposed a distance from the power supply chassis, and wherein the capacitor is formed by the equipment chassis and the power supply chassis.Type: GrantFiled: November 9, 2021Date of Patent: April 16, 2024Assignee: Hydrocision, Inc.Inventors: Mark Lewis, David E. Cassidy
-
Patent number: 11955789Abstract: A supply unit for electromagnetically shielded rooms is provided where the supply unit includes a passthrough unit and is designed to be arranged entirely or partly beneath the electromagnetically shielded room, and where an entrance is situated at a first side of the passthrough unit and an exit is situated at a second side of the passthrough unit, and where the exit is designed to be arranged at the floor of the electromagnetically shielded room, and where the passthrough unit is designed with at least one passthrough arranged in concrete.Type: GrantFiled: March 5, 2021Date of Patent: April 9, 2024Assignee: CESIUM ABInventor: Jack Gustavsson
-
Patent number: 11956905Abstract: A solid state hard disk casing, including: an upper casing and a lower casing fastened to each other, wherein a first lower recess is provided on a side of an inner surface of the lower casing close to one long edge of the lower casing, to accommodate a first portion of one or multiple electrolytic capacitors; a first upper recess is provided on a side of an inner surface of the upper casing close to one long edge of the upper casing, and the first upper recess is opposite to the first lower recess, to accommodate a second portion of the electrolytic capacitor placed in the first lower recess; and a side of the inner surface of the lower casing close to the other long edge of the lower casing is configured to fix a circuit board connected to the electrolytic capacitor.Type: GrantFiled: December 16, 2022Date of Patent: April 9, 2024Assignee: BEIJING MEMBLAZE TECHNOLOGY CO., LTDInventors: Taile Zhang, Guanghua Shangguan
-
Patent number: 11950355Abstract: The flexible circuit board includes: a substrate layer; a first conductive layer; a second conductive layer; a first cover film, a second cover film, a first electromagnetic shielding layer, and a second electromagnetic shielding layer. The part of the first cover film overlapping a first conductive portion has first hollow portions. The part of the second cover film overlapping a second conductive portion has second hollow portions. The orthographic projection of each first hollow portion on the substrate layer has an overlapping area with the orthographic projection of at least one second hollow portion on the substrate layer. The first electromagnetic shielding layer is coupled to the first conductive portion through the first hollow portions. The second electromagnetic shielding layer is coupled to the second conductive portion through the second hollow portions.Type: GrantFiled: May 12, 2021Date of Patent: April 2, 2024Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Hui Wen, Lianbin Liu, Hengzhen Liang, Xu Lu, Zhaolun Liu
-
Patent number: 11943906Abstract: Described herein is electromagnetic shielding that is configured to attenuate electromagnetic interference (EMI) by at least a threshold amount when the EMI has a frequency within a predefined frequency range. The electromagnetic shielding includes a layer of metal, such as aluminum foil, and a layer of thermoplastic polymer fabric (such as woven polyethylene fabric), where the electromagnetic shielding has several apertures that extend therethrough. The electromagnetic shielding is at least partially draped over electronic equipment that is to be shielded from EMI.Type: GrantFiled: May 28, 2022Date of Patent: March 26, 2024Assignee: Microsoft Technology Licensing, LLCInventor: Jesse William Sanders
-
Patent number: 11942742Abstract: A condenser core for being positioned around a high voltage main electrical conductor, the condenser core including an electrically insulating body; a longitudinal through hole for accommodating the main electrical conductor; a plurality of electrically conductive foils encircling the through hole and being surrounded by the body such that each foil is insulated from any other of the foils; a potential electrical conductor for establishing an electrical connection between one of the foils and the main electrical conductor when the main electrical conductor is accommodated in the through hole; and a fastening device configured to mechanically connect the potential electrical conductor to the main electrical conductor when the main electrical conductor is accommodated in the through hole. A bushing, a high voltage application and a method of producing a bushing are also provided.Type: GrantFiled: September 18, 2019Date of Patent: March 26, 2024Assignee: HITACHI ENERGY LTDInventors: Björn Edberg, Thomas Eriksson, Peter Sjöberg
-
Patent number: 11943907Abstract: An RF-shielded window apparatus may include a primary panel and a secondary panel. The primary panel may include a primary RF shield layer disposed between a primary backing substrate and a protective layer. The secondary panel may include a secondary backing substrate and a secondary RF shield layer. The first panel element and the second panel element may be secured to one another such that the primary RF shield layer, the secondary RF shield layer and the protective layer are collectively disposed between the primary backing substrate and the secondary backing substrate. The primary RF shield layer and the secondary RF shield layer may be in electrically-conductive communication with one another. A panel joining strip may help secure the first panel to the second panel, and the electrically-conductive communication may be at least in part by way of the panel joining strip. Associated manufacturing methods are also disclosed.Type: GrantFiled: March 16, 2022Date of Patent: March 26, 2024Assignee: Merakai, LLCInventors: Ryan Judy, Joseph Schwartz
-
Patent number: 11927816Abstract: An optical module optimized for EMI shielding performance and electromagnetic shielding structure of the optical module includes a base, an upper cover, and an unlocking device connected by an unlocking handle and a movable unlocking piece; the base is butted and clamped with the upper cover to form a limiting groove for accommodating the unlocking latch on both sides of the movable unlocking piece, the unlocking latch is correspondingly slidably fitted in the limiting groove; the upper end of the unlocking latch on each side is provided with a first notch, which is used to make way for the base EMI lug boss set on the base, the lower end of the unlocking latch on each side is provided with a second notch, which is used to make way for the upper cover EMI lug boss set on the upper cover.Type: GrantFiled: January 24, 2022Date of Patent: March 12, 2024Assignee: Wuhan HGGenuine Optics Tech Co., Ltd.Inventors: Kun Shu, Yong Zhang, Qijian Xu, Yu Zhai
-
Patent number: 11929601Abstract: A wiring device includes a junction box cover, a wiring spacer, and a seal terminal. The wiring device is disposed on a housing cover of a compressor. The junction box cover is disposed on the junction spacer and forms a cavity space, and the cavity space is provided with a wiring opening at the end away from the seal terminal. The seal terminal is provided with 3 wiring columns; each wiring column is connected to a piece of connector along the extending direction of the wiring column away from the housing cover; and the connector all extend in the direction close to the wiring opening so that the outgoing directions of lead wires are consistent. The present structure enables the lead wires to go out smoothly so as to improve production efficiency.Type: GrantFiled: December 30, 2019Date of Patent: March 12, 2024Assignee: SHANGHAI HIGHLY ELECTRICAL APPLIANCES CO., LTD.Inventors: Yanchun Chen, Wei Geng
-
Patent number: 11925009Abstract: A method includes obtaining a base housing for electronic components. The base housing attenuates radiation entering the base housing by a base amount. An inner volume of the base housing defined by an inner surface of the base housing experiences attenuated radiation. The method also includes affixing one or more inserts to the inner surface of the base housing to further attenuate the attenuated radiation in corresponding one or more areas of the inner volume.Type: GrantFiled: March 9, 2021Date of Patent: March 5, 2024Assignee: HAMILTON SUNDSTRAND CORPORATIONInventors: Darren Woodman, Phong Dinh
-
Patent number: 11924970Abstract: A cable assembly includes a cable having an insulator holding a first signal conductor and a second signal conductor and a cable shield surrounding the insulator. Exposed portions of the signal conductors extend forward of an end of the insulator for termination to a circuit card. The cable assembly includes a ground clip coupled to the end of the cable. The ground clip includes a bottom ground rake below the cable and a top ground hood above the cable. The bottom ground rake includes a window that receives the exposed portions of the first and second signal conductors therethrough. The bottom ground rake includes a lower grounding tab electrically connected to a lower portion of the cable shield and the top ground hood includes an upper grounding tab electrically connected to an upper portion of the cable shield. The bottom ground rake is coupled to the circuit card to support the cable relative to the circuit card.Type: GrantFiled: August 2, 2022Date of Patent: March 5, 2024Assignee: TE CONNECTIVITY SOLUTIONS GmbHInventors: Chad William Morgan, Bruce Allen Champion, John Joseph Consoli
-
Patent number: 11916337Abstract: A wire harness including a wire and a connector, wherein the connector includes a connector main body that is partially or entirely made of a conductive resin or is partially formed by a conductive portion, a shield that is made of a conductive metal and covers a periphery of the connector main body, and a conductive elastic member that is provided between the connector main body and the shield, a circumference of the wire is covered by a tube, the tube including a heat-shrinkable shielding tube having a conductive portion that is configured to surround the circumference of the wire, and in a state in which the tube is attached to an attachment of the connector main body, the conductive portion of the tube, the connector main body, the conductive elastic member, and the shield are electrically connected to each other.Type: GrantFiled: December 17, 2020Date of Patent: February 27, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Daichi Kawaguchi
-
Patent number: 11917800Abstract: Disclosed herein is a multi-layered window or door system for EMP protection. This may include a frame-shaped window or door frame, a plurality of shielding materials disposed on a side of the window or door frame to be spaced apart from each other, a first bracket disposed between the plurality of shielding materials and supported by an elastic mechanism, and a second bracket disposed outside an outermost shielding material among the plurality of shielding materials and supported by a cylinder.Type: GrantFiled: May 24, 2023Date of Patent: February 27, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Dae-Yeon Kim, Dae-Heon Lee, Seung-Kab Ryu
-
Patent number: 11917801Abstract: An electromagnetic interference (EMI) shield may include a frame configured to be coupled to a printed circuit board (PCB). The frame may include a horizontal body and a plurality of vertical walls extending perpendicularly from the horizontal body. The plurality of vertical walls defines a portion of a perimeter of the EMI shield, the perimeter including a concave corner defined virtually by a first and second vertical wall of the plurality of vertical walls. The first vertical wall does not extend all the way to the second wall and an opening if formed between. The first vertical wall includes an attached portion connected to the horizontal frame and an extension portion connected to the attached portion by way of a first fold. The extension portion at least partially overlays, abuts, and extends beyond the attached portion toward the second wall thereby at least partially covering the opening.Type: GrantFiled: April 28, 2023Date of Patent: February 27, 2024Assignee: Hewlett Packard Enterprise Development LPInventors: Yuying Chen, Yuhai Guo, Kehui Cai