Abstract: An exposure device includes a laser source, a first spatial light modulator, a second spatial light modulator and a controller. The laser source is provided for emitting a laser. The first spatial light modulator is irradiated by the laser and used for modulating the phase of the laser irradiated on the first spatial light modulator before reflecting the laser. The second spatial light modulator is irradiated by the laser reflected from the first spatial light modulator and used for modulating the amplitude of the laser irradiated on the second spatial light modulator before reflecting the laser. The laser reflected by the second spatial light modulator is irradiated on a photoresist layer to form an exposure pattern.

Abstract: The invention provides an object positioner comprising:—an object support having an object support surface which is configured to engage at least a part of an object, said object support surface having a support surface temperature,—a thermal device, which thermal device is configured to provide at least a part of the object with a first object temperature, which first object temperature differs from the support surface temperature by a first predetermined temperature difference.

Abstract: In some embodiments, the present disclosure relates to a process tool that includes a lithography apparatus arranged over a wafer chuck and an immersion hood apparatus laterally around the lithography apparatus. The lithography apparatus includes a photomask arranged between a light source and a lens. The immersion hood apparatus comprises input piping, output piping, and extractor piping. The input piping is arranged on a lower surface of the immersion hood apparatus and configured to distribute a liquid between the lens and the wafer chuck. The output piping is arranged on the lower surface of the immersion hood apparatus and configured to contain the liquid arranged between the lens and the wafer chuck. The extractor piping is arranged on an outer sidewall of the immersion hood apparatus and configured to remove any liquid above the wafer chuck that is outside of the immersion hood apparatus.

Abstract: The invention provides an assembly having a cryostat and a flat coil layer of superconducting coils for use with a magnetic levitation and/or acceleration motor system of a lithographic apparatus. The cryostat has two insulation coverings. The coil layer is arranged between the two coverings. The coverings each have an inner plate configured to be cryocooled and an outer plate parallel to the inner plate, and an insulation system with a vacuum layer between the inner and outer plate. The insulation system of said covering has a layers of circular bodies, the central axes of these bodies extending perpendicular to the inner and outer plate, and is configured to provide a layer of point contacts between two layers of circular bodies or between a layer of circular bodies and the inner and/or outer plate.

Abstract: A method of manufacturing a circuit board includes preparing a substrate having electrical conductivity, removing a portion of a first surface of the substrate to form a plurality of pillars on the first surface of the substrate, locating an insulating material on the first surface of the substrate to cover a space between the plurality of pillars of the substrate, forming a pattern on a second surface, which is opposite to the first surface of the substrate, by removing a portion of the second surface of the substrate, forming a first metal layer on the first surface of the substrate, and forming a second metal layer on the second surface of the substrate.

Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: An exposure apparatus including an obtainment unit configured to obtain, for each of a plurality of exposure regions on a substrate, surface positions in a height direction in the exposure region, and a control unit configured to control, based on the obtained surface positions, driving of a substrate stage in the height direction, wherein the control unit obtains an approximate surface approximately representing a cross-sectional shape of a surface of the exposure region from the obtained surface positions obtained, and for a first exposure region for which information related to the approximate surface does not exceed a predetermined range, controls the driving based on a correction value related to the driving obtained from an approximate surface approximately representing a cross-sectional shape of a surface of the exposure region that has been exposed prior to the first exposure region.

Abstract: A detection apparatus that detects a mark formed on a substrate is provided. The detection apparatus comprises a detection optical system that irradiates light on the mark on the substrate held by a stage and detects an image of the mark, and a processor that performs a detection process of the mark based on the image of the mark. The processor finds a detection value indicating a position of the mark in an observation field of the detection optical system based on the image of the mark, finds a subregion in which the mark is located among a plurality of subregions in the observation field, and corrects the detection value based on a correction value corresponding to the found subregion among correction values predetermined for the plurality of subregions, respectively.

Abstract: A method includes: providing a workpiece to a semiconductor apparatus, the workpiece including a material layer, wherein the material layer includes a first strip having a first plurality of exposure fields configured to be exposed in a first direction and a second plurality of exposure fields configured to be exposed in a second direction different from the first direction; scanning the first strip along a first scan route in the first direction to generate first topography measurement data; scanning the first strip along a second scan route in the second direction to generate second topography measurement data; and exposing the first plurality of exposure fields according to the first topography measurement data and exposing the second plurality of exposure fields according to the second topography measurement data.

Abstract: A Z-axis measurement fixture used for testing whether a chemical reagent test slide exhibits Z-axis variability, which may affect measurements performed by an automated chemical analyzer using such test slides, includes a planar main body that holds three stainless steel balls, each ball having a known and calibrated diameter. Portions of the stainless steel balls extend outwardly from the top wall and the bottom wall of the planar main body. A chemical reagent test slide is placed on the fixture to rest on and be supported at three points by the portions of the stainless steel balls which project outwardly from the top wall of the planar main body. The fixture is placed on the surface of a gauge block of an optical measurement system such that the lower portions of the three stainless steel balls will rest on the gauge block of the optical measurement system.

Abstract: An optical pulse stretcher includes a first delay optical system including a plurality of concave toroidal mirrors; and a beam splitter including a first surface and a second surface, causing a part of pulse laser light incident on the first surface to be transmitted in a first direction and output as a first beam and another part thereof to be reflected in a second direction and enter the first delay optical system, and causing a part of pulse laser light incident on the second surface from the first delay optical system to be reflected in the first direction and output as a second beam.

Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

Abstract: The invention provides a support with first and second end portions. The second end portion is on the side opposite to the first end portion in a longitudinal direction of the support. A coil spring is arranged between the first and second end portions. The coil spring comprises a first spiral member that extends between the first and second end portions in a circumferential direction of the support, and a second spiral member that extends between the first and second end portions in a circumferential direction of the support. The first and second spiral members extend in the longitudinal direction around a longitudinal axis of the support, wherein the first spiral member of the coil spring and the second spiral member of the coil spring are moveable relative to each other, and wherein the support further comprises a damper device that is attached to the first spiral member.

Abstract: A method of identifying an item on a surface of a workpiece is disclosed. An optical device identifies an item on the surface of a workpiece. An item identification system includes a light projector and a photogrammetry system. One of the light projector and the photogrammetry system generates a three-dimensional coordinate system within the work cell. One of the light projector and the photogrammetry system identifies a location of the surface of the workpiece within the three-dimensional coordinates system. The controller calculates geometric location of the item on the surface of the work piece in the three-dimensional coordinate system as identified by the optical device. The controller signals the light projector to project a beam of light onto the surface of the workpiece identifying a disposition of the item disposed upon the surface of the workpiece.

Abstract: The present invention provides a positioning apparatus for positioning of an object, the positioning apparatus including a first actuator and a second actuator configured to be arranged along a first direction so as to be parallel to each other, and to cause a beam to move in the first direction, a third actuator configured to be built in the beam, and to cause the object to move in a second direction relative to the beam, the second direction intersecting with the first direction, and a control unit configured to control the first actuator, the second actuator, and the third actuator.

Abstract: A reticle is pre-heated prior to an exposure operation of a semiconductor substrate lot to reduce substrate to substrate temperature variations of the reticle in the exposure operation. The reticle may be pre-heated while being stored in a reticle storage slot, while being transferred from the reticle storage slot to a reticle stage of an exposure tool, and/or in another location prior to being secured to the reticle stage for the exposure operation. In this way, the reduction in temperature variation of the reticle in the exposure operation provided by pre-heating the reticle may reduce overlay deltas and misalignment for the semiconductor substrates that are processed in the exposure operation. This increases overlay performance, increases yield of the exposure tool, and increases semiconductor device quality.

Abstract: A nano projection structure inspection apparatus herein disclosed includes an inspection light irradiation part and a chromameter. The inspection light irradiation part irradiates inspection light to an inspected surface being a surface of a metal. An imaging optical axis of an imaging element of the chromameter is arranged to be tilted to a regular reflection direction of the inspection light caused by the inspected surface. The chromameter makes the imaging element receive diffusion reflection light, among reflection light of the inspection light from the inspected surface, the reflection light containing regular reflection light and the diffusion reflection light, so as to inspect a nanoscale projection structure on the inspected surface.

Abstract: A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include an electrode assembly and a base assembly. The electrode assembly includes a permeable electrode. The base assembly includes one or more process fluid channels disposed around a circumference of the substrate support surface and configured to fill a process volume with a process fluid. The electrode assembly is configured to apply an electric field to a substrate disposed within the process volume.

Abstract: A fluid handling structure configured to confine immersion fluid to a region of a lithographic apparatus, the fluid handling structure comprising an aperture formed therein for the passage therethrough of a radiation beam through the immersion fluid, the aperture defining an immersion space to be filled with the immersion fluid, and an inner part and an outer part; wherein the inner part and the outer part are arranged so as to form therebetween a variable space and a connecting space that connects the variable space to the immersion space, wherein the outer part is movable relative to the inner part in a first plane so as to change in shape the variable space but not the connecting space, and wherein the fluid handling structure is configured to contain the immersion fluid in the variable space.

Abstract: A method for cleaning a reflective photomask, a method of manufacturing a semiconductor structure, and a system for forming a semiconductor structure are provided. The method for cleaning a reflective photomask includes placing a photomask in a first chamber, and performing a dry cleaning operation on the photomask in the first chamber, wherein the dry cleaning operation includes providing hydrogen radicals to the first chamber, generating hydrocarbon gases as a result of reactions of the hydrogen radicals, and removing the hydrocarbon gases from the first chamber.