Patents Examined by Jamie Brophy
  • Interconnections for a semiconductor device and method for forming same
    Patent number: 6709893
    Abstract: A method for forming an electrical contact for a semiconductor device comprises the steps of providing a semiconductor wafer section having a major surface with a plurality of conductive pads thereon and electrically coupling each pad with an elongated electrical interconnect. Next, each electrical interconnect is encased in a dielectric and the dielectric is sectioned to expose a portion of each interconnect. An inventive structure which can be formed by the inventive method is also described.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: March 23, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Walter L. Moden, Larry D. Kinsman, Warren M. Farnworth