Patents Examined by Jayprakash Gandhi
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Patent number: 7355850Abstract: A chassis for plug-in modules may be provided with a vented and ducted sub-rack support member. The vented and ducted sub-rack support member may deflect a portion of the air flowing within the chassis through vents in the top surface of the vented and ducted sub-rack support member in order to increase the air flow to heat producing components mounted on the backplane above the support member. The increased air flow may increase air flow velocity and decrease the ambient temperature of the air around these components and improve the dissipation of heat from each component into the air. Air flow above the vented and ducted sub-rack support member may also be redirected by upper deflectors mounted on the support member to portions of plug-in cards adjacent to the upper deflectors and may provide additional cooling to components on the plug-in cards near the backplane.Type: GrantFiled: March 31, 2006Date of Patent: April 8, 2008Assignee: National Instruments CorporationInventor: Richard G. Baldwin, Jr.
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Patent number: 7352565Abstract: A portable computer system comprising a main chassis with a front edge, a rear edge, an upper surface, and a lower surface. A support chassis is rotatably connected to the front edge of the main chassis. A display panel is rotatably connected to the rear edge of the main chassis.Type: GrantFiled: September 28, 2004Date of Patent: April 1, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Memphis-Zhihong Yin
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Patent number: 7352581Abstract: According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, and a second plate member that covers the first groove. The heat-receiving section is formed at least one of the first and second plate members.Type: GrantFiled: June 23, 2006Date of Patent: April 1, 2008Assignee: Kabushiki Kaisha ToshibaInventor: Kentaro Tomioka
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Patent number: 7352564Abstract: An improved power distribution unit substation, having a plurality of differing voltage rated main breaker cells, encased within a single housing is disclosed. The improved power distribution substation saves considerable floor space as compared to prior art substations. One embodiment houses a plurality of main breaker cells in a single housing. In this embodiment, a low voltage main breaker cell is vertically positioned above a plurality of medium voltage main breaker cells. Alternatively, a medium voltage main breaker cell is vertically positioned above a plurality of low or medium voltage cells. Improved single-ended and double-ended power distribution substations are disclosed that offer cost and floor space savings as compared to prior art substations.Type: GrantFiled: October 16, 2004Date of Patent: April 1, 2008Assignee: Eaton CorporationInventor: Thomas A. Courtney
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Patent number: 7352572Abstract: The fire block module includes a number of rectangular plate strips, arranged vertically and parallel to each other to form a grid layer. The grid layer is arranged horizontally in respect of the vertical direction of flame propagation occurring in the event of a fire, thus achieving good heat energy dissipation and preventing flame propagation.Type: GrantFiled: July 22, 2005Date of Patent: April 1, 2008Assignee: Siemens AktiengesellschaftInventor: Peter Sedlmeier
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Patent number: 7349217Abstract: The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.Type: GrantFiled: April 30, 2004Date of Patent: March 25, 2008Assignee: Tyco Electronics AMP KKInventor: Shinichi Hashimoto
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Patent number: 7349211Abstract: A mounting apparatus for mounting a fan in a computer enclosure includes a panel configured to mount the fan thereon, and a plurality of restricting members. The panel defines a ventilation area corresponding to the fan for air ventilation between an inside and an outside of the computer enclosure. The plurality of restricting members is set around the ventilation area to restrict the movement of the fan along the panel. The plurality of restricting members includes a mounting bracket, which includes an elastic shank extending up from the panel and a pressing portion protruding from the shank configured to clamp the fan against the panel.Type: GrantFiled: April 21, 2006Date of Patent: March 25, 2008Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yun-Lung Chen, Qing-Hao Wu
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Patent number: 7349203Abstract: The present invention is a computer controlled display device. In one embodiment, the display device includes a flat panel display having an input for receiving display data. Additionally, a moveable assembly may be coupled to the display. The moveable assembly may provide at least three degrees of freedom of movement for the flat panel display device. Additionally, the moveable assembly may have a cross-sectional area, which is substantially less than a cross-sectional area of a display structure of the flat panel display. Additionally, the moveable assembly may include a plurality of stacked ball-and-socket assemblies.Type: GrantFiled: September 19, 2006Date of Patent: March 25, 2008Assignee: Apple Inc.Inventors: Steven P Jobs, Jonathan Ive, Michael D. Hillman, Frank Tsai, Michael D. McBroom, Daniel L. McBroom, Brian T Sudderth, Arthur S. Brigham, Joel F. Jensen, Robert B. Brownell, Jr., Sung Kim, Anwyl M. McDonald, Russell C. Mead, Jr., Arturo Meuniot, Jesus Beltran, Bartley K. Andre, Christopher J. Stringer, Daniel J. Riccio, Jr.
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Patent number: 7349214Abstract: A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.Type: GrantFiled: January 13, 2006Date of Patent: March 25, 2008Assignee: Samsung SDI Co., Ltd.Inventor: Kwang-Jin Jeong
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Patent number: 7345870Abstract: A display with a display main body having a screen includes an upper link assembly which includes an upper first link having a first end rotatably coupled with a mounting wall, and an upper second link having a first end rotatably coupled with the display main body and a second end rotatably coupled with a second end of the upper first link and connects an upper rear portion of the display main body to the mounting wall, and a lower link assembly which includes a lower first link having a first end rotatably coupled with the mounting wall, and a lower second link having a first end rotatably coupled with the display main body and a second end rotatably coupled with a second end of the lower first link and connects a lower rear portion of the display main body to the mounting wall.Type: GrantFiled: December 13, 2004Date of Patent: March 18, 2008Assignee: Samsung Electronics Co., Ltd.Inventor: Yong-ha Shin
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Patent number: 7345869Abstract: A supporting frame structure movably joined in a case is used to mount a loaded object, such that the object can be disposed in the case or moved outside the case. In the present invention, a motion mechanism is disposed between the case and the supporting frame, by which the supporting frame has a handling position outside the case and a fixed position inside the case. At the fixed position, the motion mechanism forms an interference relation, such that the supporting frame is fixed on the mounting position and is unable to be departed from the case.Type: GrantFiled: July 19, 2006Date of Patent: March 18, 2008Assignee: Micro-Star Int'l Co., Ltd.Inventor: Yi-Liang Hsiao
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Patent number: 7345884Abstract: A heat-dissipating fan includes a housing, an impeller, and a circuit board. The housing includes an air channel and a base. The base is mounted in one end of the air channel for supporting the circuit board. The impeller is rotatably mounted on the base and includes a hub and a plurality of blades. The circuit board includes at least one heat-generating electronic element mounted thereon. The heat-generating electronic element extends out of the hub in relation to a longitudinal direction of the housing, with at least one portion of the heat-generating electronic element located on a downstream side of the blades for dissipating heat generated by the heat-generating electronic element.Type: GrantFiled: March 14, 2006Date of Patent: March 18, 2008Assignee: Sunonwealth Electic Machine Industry Co., Ltd.Inventors: Alex Horng, Hao-An Shieh, Pei-Wei Lo
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Patent number: 7345871Abstract: Disclosed are systems and methods for locking a movable appendage (e.g., a display) of an electronic device (e.g., a tablet computer) comprising a rotational lock interfaced with a display hinge assembly of the display, and a docking member disposed to engage at least a portion of the rotational lock when the electronic device is interfaced with an external device.Type: GrantFiled: February 1, 2005Date of Patent: March 18, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jeffrey A. Lev, Earl W. Moore
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Patent number: 7345873Abstract: A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.Type: GrantFiled: September 29, 2004Date of Patent: March 18, 2008Assignee: General Electric CompanyInventors: Subhrajit (nmn) Dey, Petrus Joannes Joseph Moeleker, Chellappa (nmn) Balan
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Patent number: 7345872Abstract: A handheld electronic device (300) mainly comprises a cover (310), a main body (320), a monitor (328) mounted on the main body, a keyboard (318) mounted on the cover and a hinge structure (330) to which pivot portions (312), (322) of the cover and main body are hinged. The pivot portions have teeth (314), (324) on circumferential peripheries thereof. The teeth mesh with each other. The cover can rotate for 360 degrees relative to the main body thereby moving from a first position to a second position, wherein at the first position, the cover abuts against a top surface (326) of the main body, and at the second position, the cover abuts against a bottom surface of the main body. The trajectory of the cover during its rotation relative to the main body follows a predetermined path.Type: GrantFiled: December 3, 2004Date of Patent: March 18, 2008Assignee: High Tech Computer, Corp.Inventor: John C. Wang
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Patent number: 7342784Abstract: A cooling device for electronic components has a main body, a motor, an adaptor tube, a shaft, a valve assembly, a reservoir, and a delivery tube. The motor is mounted in the main body. The adaptor tube is mounted between the main body and the reservoir and is gradually smaller in diameter from the main body to the reservoir. The shaft connects to the motor, extends into the adaptor tube and has multiple fan blades corresponding to the inside diameter of the adaptor tube. The fan blades blow the air through the adaptor tube into the reservoir to pressurize the air. The pressurized air flows through the delivery tube to contact the electronic component and equalizes to correspond to the atmosphere. The equalizing process of the pressurized air absorbs heat from the electronic component as it expands to cool the electronic component.Type: GrantFiled: May 24, 2006Date of Patent: March 11, 2008Assignee: Cimaker Technology Co., Ltd.Inventor: Keng-Wen Tseng
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Patent number: 7342798Abstract: An electronic appliance includes an enclosure and an internal device (50). The enclosure includes a bezel (10) defining at least one opening (111). A pair of slanting slideways (151) is defined in the bezel. A bracket (20) is slidably attached to inside of the bezel to cover said opening. A pair of pivots (23) is formed on each end of the bracket, for being received in the slideways. A pair of slanting surface (211) is defined on the bracket. A pair of springs (30) connects between the bracket and the bezel. A tray (51) of the internal device is ejected out to push against the slanting surfaces of the bracket, the bracket is thereby moved to expose said opening, and the tray is extended through said opening. The springs drive the bracket to cover said opening after the tray is retracted in the internal device.Type: GrantFiled: October 29, 2004Date of Patent: March 11, 2008Assignees: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yun-Lung Chen, You-He Ke
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Patent number: 7342789Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.Type: GrantFiled: June 29, 2006Date of Patent: March 11, 2008Assignee: International Business Machines CorporationInventors: Shawn A. Hall, Shurong Tian, Paul W. Coteus, John P. Karidis, Evan G. Colgan, Robert W. Guernsey, Jr.
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Patent number: 7342778Abstract: A portable computer (20) includes a main body (21), a retention portion (23) being arranged on the main body with a part thereof spaced apart from the main body, a fastener (30) detachably attaching a handle (10) between the main body and the retention portion, and means for retaining the fastener to the retention portion when the fastener is not in use for attaching the handle.Type: GrantFiled: June 2, 2005Date of Patent: March 11, 2008Assignees: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Qi-Fei Fan, Wen-Tang Peng, Wen-Kang Lo, Ke-Cheng Lin
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Patent number: 7342776Abstract: The present invention is to provide a portable electronic apparatus having an extendable keyboard which comprises a main body having a storage slot extends inwardly at a front edge of the main body for slidably accommodating a keyboard and enabling the keyboard to be slidably pulled to a position out of the storage slot and then be turned towards a top side of the main body.Type: GrantFiled: February 28, 2007Date of Patent: March 11, 2008Assignee: Inventec CorporationInventor: Tien-Ming Chan