Abstract: A display assembly with divided interior space includes a first and second electronic display subassembly attached to a structural framework, where each of the subassemblies include an electronic display layer located behind a cover, an illumination device for providing illumination to the electronic display layer when powered, and a passageway for circulating gas. A common passageway for the circulating gas is located between the subassemblies and is in fluid communication with the passageways. A central septum extends within the common passageway between the subassemblies to divide the common passageway into a first portion and a second portion.

Abstract: A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.

Abstract: A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

Abstract: A holder has a holding body, a spring member, and a tensioning member. The holding body forms a cavity to receive the electronic component. A connecting section has a thermally conductive heat conductive section adjacent to the cavity. The tensioning member tensions the spring member. The spring member supports itself in a tensioned state on a counter-holding member. The spring member moves a connecting surface of the holding body to the cooling body and/or presses it against the cooling body.

Abstract: A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposed thereto, the first substrate being made of an insulating material; a second substrate made of a carbon material; at least one surface metal layer located on the first surface, including at least one mounting portion for at least one electronic element; and a bonding metal layer on the second surface. Heat conduction of the second substrate in a direction perpendicular to a longitudinal direction of the at least one mounting portion is greater than heat conduction of the second substrate in the longitudinal direction of the at least one mounting portion, and a width of the bonding metal layer is greater than or equal to a maximum width of the at least one surface metal layer in a direction perpendicular to the longitudinal direction of the at least one mounting portion.

Abstract: A power conversion device includes a cooling structure capable of cooling down, by a coolant that flows through a first flow channel formed by a first wall portion and a second wall portion facing with each other, a first electronic component and a second electronic component mounted on an external surface of the first wall portion. The first wall portion is formed in a stepwise shape, and includes a first mount portion on which the first electronic component is mounted, a second mount portion which has a different height from the first mount portion, and on which the second electronic component is mounted, and a first connection portion that is extended between the first mount portion and the second mount portion.

Abstract: An overheating destructive disconnecting method for switch, which enables a first elastic force to concurrently apply force to an overheating destructive member and a movable conductive member. Moreover, the force direction causes the movable conductive member to concurrently contact a first conductive member and a second conductive member to form a conductive circuit. A second elastic force acts on the movable conductive member, and the force direction thereof causes the movable conductive member to separate away from the first conductive member or the second conductive member, The overheating destructive member is positioned in a required non-electric transmission path and at a distance from the movable conductive member. When the overheating destructive member is destructed or deformed under a fail temperature condition, the first elastic force is lessened or lost, at which time the second elastic force causes the movable conductive member to change position, thereby breaking the current-carrying circuit.

Abstract: A pluggable module assembly includes a housing having a top wall, a bottom wall and sidewalls between the top wall and the bottom wall forming a cavity configured to hold an electrical component therein. The top wall has an opening above the cavity aligned with the electrical component receiving a thermal transfer device that is separate and discrete from the housing. The thermal transfer device transmits heat from the electrical component to fins separated by channels at an upper thermal interface. The upper thermal interface is exposed from above the housing for interfacing with an external heat sink for transferring heat from the thermal transfer device.

Abstract: The invention relates to a thermally triggered, mechanical switching device, consisting of a heat-sensitive means and a mechanical force-storage means, wherein the heat-sensitive means blocks or unblocks the movement path of a switching piece; furthermore, the switching piece is preloaded and held by the mechanical force-storage means, and comprising a housing that accommodates the aforementioned means. According to the invention, the housing is designed as a cartridge-shaped shell which receives a plunger in the interior thereof, which plunger is mounted in a movable manner through a first end-side opening in the housing and is supported against a fusible shaping part under pretension, wherein the fusible shaping part is arranged so as to cover a second opening, which is located opposite the first end-side opening, in such a way that, when the melting temperature of the fusible shaping part is reached, said fusible shaping part is displaced by the plunger and the plunger takes on a changed position.

Abstract: A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.

Abstract: An outdoor unit of an air-conditioning apparatus includes a casing forming an outer shell, a terminal block disposed in the casing, a terminal block support element configured to support the terminal block, and an earth grounding plate sandwiched between the terminal block and the terminal block support element. An engaging portion to be engaged with the terminal block support element is provided in the earth grounding plate. A fixing element is provided to fasten the terminal block and the earth grounding plate engaged with the terminal block support element by the engaging portion together to the terminal block support element.

Abstract: A cooling manifold positioned on an electrical or computer to provide liquid cooling for a plurality of slot-mounted electrical modules received in a corresponding plurally of module slots arranged in faceplate assembly of an electrical or computer card is described and illustrated.

Abstract: Compressed air cooling is disclosed. In an embodiment, an assembly includes an input configured to receive compressed air. The assembly also includes an expansion chamber configured to at least in part contain an expansion of the compressed air. The assembly also includes a base configured to be thermally cooled via the expansion of the compressed air and configured to be coupled to an electronic component.

Abstract: An image display device includes a frame including posts partitioning the inside space defined by rectangular frame members in a grid, and a display unit including two or more light-emitting diodes (LEDs) disposed on one surface of a substrate and a case accommodating the substrate and the LEDs. The case includes a bottom plate and an opening facing the bottom plate. The bottom plate faces the substrate, the opening exposes the LEDs, and a rear surface of the bottom plate is waterproofed. The display unit is accommodated in each of two or more compartments partitioned in a grid by the posts of the frame. A rear plate covers, from the rear surface of the bottom plate, the frame in which the display unit is accommodated, and a magnet is attached to a surface of the rear plate to attach/detach the rear plate to/from the frame.

Abstract: A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.

Abstract: In one aspect, an apparatus comprises a first housing and a second housing. The first housing comprises a surface to receive heat from a heat-generating component. The second housing comprising a receptacle in which to receive the first housing. The first housing is to nest within the receptacle. The receptacle inhibits movement of the first housing along a first axis and facilitates movement of the first housing along a second axis. The first housing is moveable within the receptacle along the second axis. Movement of the first housing along the second axis changes a size of a gap between the surface and the heat-generating component.

Abstract: A power conversion device of the present invention includes a power conversion circuit configured to convert power; a conductor configured to transmit a current to the power conversion circuit; and a coreless current sensor configured to detect the current, in which the coreless current sensor includes: a magnetic field detection portion configured to detect a magnetic field of the current; and a shield portion that faces the magnetic field detection portion, the conductor includes: a first conductor portion that passes through a space between the magnetic field detection portion and the shield portion; and a second conductor portion connected to the first conductor portion via a first bent portion, and the first bent portion is formed such that the space between the magnetic field detection portion and the shield portion is not disposed in a direction perpendicular to a face of the second conductor portion closest to the shield portion.

Abstract: Power modules of a power module assembly each have a power card including a substrate, signal pins, and power terminals, and a casing over molded on the power card to define a passageway extending between opposite ends of the power module, and a continuous uninterrupted thermal path from the power card to the passageway. The modules are arranged end-to-end to define a continuous fluid pathway via the passageways.

Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.