Abstract: A presently-preferred electrical connector comprises an electrically insulative base member having a first surface, a substantially planar second surface, and a plurality of stud members projecting from the second surface. The base member has a plurality of through holes formed therein. The through holes each extend from the first surface to a respective stud member. At least a portion of each of the stud members is coated with an electrically conductive material. The electrical connector also comprises an electrically-insulative plate member mounted on the base member, and a conducting member. The conducting member comprises a lead portion at least partially disposed within the plate member, and a contact portion at least partially disposed within the stud member.

Abstract: A high density interconnection system (100) includes a daughter card header (1) and a backplane receptacle (2). The daughter card header comprises an insulative housing (10) and a number of signal terminals (14) and grounding members (15) received in the housing. The insulative housing is composed of a number of modularized housing portions (11, 12, 13) mechanically assembled with each other. The backplane receptacle has an insulative base (20), a cover (26) attached onto the insulative base, a plurality of circuit boards (27) arranged between the base and the cover, and a plurality of signal contacts (24) and grounding elements (25) received in the insulative base. The insulative base is composed of a plurality of modularized base sections (21, 22, 23) mechanically assembled with each other. The header and the receptacle each have a plurality of fastening means (117, 127, 127′, 137, 204, 205) formed thereon to interconnect the plurality of housing portions and base sections.

Abstract: In making use of an add/drop multiplexer for demultiplexing or multiplexing signal light of a few specific wavelengths from signal light subjected to optical wavelength multiplexing, a fiber bragg grating is excellent for enhancing rejection of a leakage of a demultiplexed light, but with respect to a high speed optical signal at the demultiplexing or multiplexing, a waveform deterioration occurs. When a dielectric multilayer film filter is used for dealing with the high speed optical signal, a plurality of filters are used to suppress a coherent cross talk, resulting in an increase of loss of pass-through light and an increase of costs.

Abstract: An electrical plug-in connector for electrically connecting two regions separated by a wall. The wall has an assembly hole with a reinforcement bead on a first wall side around the hole. The connector includes a connector part positioned on a second wall side. A guide bushing is positioned on the first wall side. An extended portion of the bushing penetrates the hole in the wall. The extended portion has a support flange and a lock stop. The support flange is supported on the bead on the first wall side. The lock stop extends through the hole to the second wall side and is connected to the connector part. A locking element is connected to the connector part and is operable to engage the lock stop and exert a fastening pressure directed away from the wall towards the connector part such that the extended portion braces the bushing against the hole.

Abstract: A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.

Abstract: A connector having a set of terminals (10) that are preferably coplanar and are used to connect electrical components, such as surface mount components, with a printed circuit board (PCB). The connector uses an insulative wafer (50) to achieve and to maintain the coplanarity of the terminals (10). Initially, the terminals (10) are overbent so that as the wafer (50) is being placed in the connector housing (5), the terminals (10) contact the wafer (50) on a slope (55) of the wafer (50). In other words, as the wafer (50) is being mated with the connector housing (5), the wafer (50) pushes against the terminals (10) to establish coplanarity. Thus, the wafer (50) works in conjunction with the terminals (10) in the connector housing (5) to establish coplanarity. Therefore, the connector supports the terminals (10) for positioning while ensuring that the terminals (10) are coplanar.

Abstract: A connector for connecting at least one first conductor 5 with another conductor 50, including a connector body 2 having a first end containing a chamber 2a, and a second end containing a through bore 2b communicating with the chamber, a slide member 4 slidably mounted in the connector body chamber, the slide member containing a transverse bore 25 for receiving the first conductor, the slide member including at its end within the chamber a longitudinally projecting pin portion 18, and an electrical terminal 3 slidably mounted on the slide member pin portion, the slide member being slidably displaceable relative to the electrical contact from a first position in which a contact portion 9 of the terminal is remote from the transverse bore to permit the insertion of the first conductor therein, to a second position in which the contact portion extends across the transverse bore in electrical engagement with the first conductor, the free extremity of the contact being received by a corresponding opposed recess fo