Patents Examined by Jean Frantz Duverne
  • Patent number: 9531098
    Abstract: A terminal (1) comprising a connecting portion (15) to be connected to a connecting portion (5) of a mating terminal (3), wherein the connecting portion (15) includes a portion of a base material (19) including iron or an iron-based alloy and having a fine asperity (25) on a surface of the portion of the base material (19), a first layer (21) formed on a surface of at least the portion of the base material (19) included in the connecting portion (15) and having a surface formed into the fine asperity pattern, and a second layer (23) formed on the surface of the first layer (21), wherein the first layer (21) is provided for connecting the base material (19) and the second layer (23) to each other, and has higher hardness than the second layer (23), and the second layer (23) is provided for enhancing conductivity and lubrication property.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: December 27, 2016
    Assignee: YAZAKI CORPORATION
    Inventors: Takakazu Takahashi, Takamichi Kudo, Yoshikatsu Nishida, Takahiro Fujii
  • Patent number: 7195521
    Abstract: A DSX jack module having removable jacks is disclosed. The jack module includes a jack mount for holding the jacks. The jack module also includes a front facing cross-connect array and a front facing IN/OUT array. A circuit board is electrically connected to the arrays. The circuit board includes portions positioned directly behind the cross-connect array and the IN/OUT array. A chassis for holding jack modules is also disclosed. The chassis includes a front door having a double hinge configuration.
    Type: Grant
    Filed: January 11, 2005
    Date of Patent: March 27, 2007
    Assignee: ADC Telecommunications, Inc.
    Inventors: Bruce R. Musolf, Richard T. Demulling
  • Patent number: 7083428
    Abstract: A hybrid interface apparatus including a fixed base including a contact-locking structure supporting several spring-based contact members, and a nesting member slidably positioned over the fixed base and having a central test area that includes an array of through-holes that are aligned with upper ends of the contact members. To facilitate testing of ICs including both relatively low-speed general-purpose I/O structures and new high-speed I/O structures, the contact members mounted on the contact structure include both low-cost, relatively high-inductance contact members for facilitating communication with the general-purpose I/O structures of the IC, and relatively expensive, low-inductance contact members for facilitating high-speed communications with the high-speed I/O structures of the IC.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: August 1, 2006
    Assignee: Xilinx, Inc.
    Inventors: David M. Mahoney, Mohsen Hossein Mardi
  • Patent number: 7018226
    Abstract: An electrical connector is provided that protects the electrical connector and associated components from harsh mechanical, electrical and environmental requirements. A jack is received by a jack housing, and a plug is received by a plug housing. The jack is adapted to receive the plug. A first seal member is positioned between the plug housing and the jack housing to form a seal therebetween when the jack and the plug are connected. A coupling member is attached to the plug housing and is adapted to receive the jack housing. A spring member is positioned between the coupling member and the plug housing to compress the first seal member between the jack housing and the plug housing.
    Type: Grant
    Filed: January 9, 2004
    Date of Patent: March 28, 2006
    Assignee: Hubbell Incorporated
    Inventors: John J. Milner, Douglas P. O'Connor, Glenn T. Kierstead, Alan C. Miller, Randolph R. Ruetsch, Shadi Abughazaleh