Patents Examined by Jeffrey B. Robertson
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Patent number: 7041379Abstract: Elastomer coating composition are disclosed which cure at room temperature, and form highly flex-resistant, durable, and flexible protective layer on elastomers and provides excellent adhesion to elastomeric and metal substrates. The coating is a solvent solution of (A) a carboxylated hydrogenated acrylonitrile-butadiene copolymer, and (B) a room temperature isocyanate curing component. Coated bonded elastomer-metal composites are obtained without an additional application of heat to cure the coating.Type: GrantFiled: September 4, 2003Date of Patent: May 9, 2006Assignee: Lord CorporationInventors: James R. Halladay, Frank J. Krakowski
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Patent number: 7041748Abstract: The present invention relates to ultra-large scale integrated (ULSI) interconnect structures, and more particularly to patternable low dielectric constant (low-k) materials suitable for use in ULSI interconnect structures. The patternable low-k dielectrics disclosed herein are functionalized polymers that having one or more acid-sensitive imageable functional groups.Type: GrantFiled: January 8, 2003Date of Patent: May 9, 2006Assignee: International Business Machines CorporationInventors: Qinghuang Lin, Ratnam Sooriyakumaran
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Patent number: 7041737Abstract: The present invention provides a low temperature curing coating powder composition comprising a mixture of a high gloss film-forming system and a low gloss film-forming system. Preferably, the high gloss film-forming system comprises a GMA (glycidyl methacrylate) resin, a curing agent, and a catalyst and forms a coating having a gloss greater than 80% measured at 60°. Preferably the low gloss film-forming system comprises a carboxyl terminated polyester, acrylic resin and a catalyst and forms a coating having a gloss less than 50% measured at 60°. The composition of the present invention provides coatings having a control gloss, which can range from a low to a high gloss and is useful for coating heat-sensitive substrates.Type: GrantFiled: November 13, 2002Date of Patent: May 9, 2006Assignee: Rohm and Haas CompanyInventors: Edward G. Nicholl, Andrew T. Daly, Carryll A. Seelig
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Patent number: 7037527Abstract: The invention features a method of treating polyester material to generate functional carboxylic acid and amine groups. These functional groups can be used as sites for covalent bond formation to attach chemical or biological moieties. This bifunctionalized polyester polymer can be used in any medical application in which biocompatible polymers are used.Type: GrantFiled: January 27, 2003Date of Patent: May 2, 2006Assignees: University of Rhode Island, Beth Israel Deaconess Medical Center, BioMod SurfacesInventors: Martin J. Bide, Matthew D. Phaneuf, William C. Quist, Donald J. Dempsey, Frank W. LoGerfo
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Patent number: 7037984Abstract: The present invention relates to the penetrating networks comprising a covalently crosslinked polymer component and a polyester urethane component. The materials in accordance with the present invention are suitable in particular as materials for medicinal purposes, as implants, for target controlled stimuli-sensitive drug release, as ligament augmentation and as replacement material for inter-vertebrae disks.Type: GrantFiled: April 17, 2003Date of Patent: May 2, 2006Assignee: mnemoScience GmbHInventors: Andreas Lendlein, Annette Schmidt
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Patent number: 7037983Abstract: There is provided a method to modify biodegradable polymers using the direct reaction of a biodegradable polymer in a vinyl monomer and may take place in the presence of initiators. The initiator may be free radical initiators, heat, ionic initiators, UV irradiation, ionizing irradiation and other high energy irradiation. Suitable biodegradable polymer include polycaprolactone, poly(lactic acid), poly(glycolic acid) and poly(lactic-co-glycolic acid). Suitable vinyl monomers include acrylates, methacrylates and the like.Type: GrantFiled: November 22, 2002Date of Patent: May 2, 2006Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Yanbin Huang, Jaeho Kim
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Patent number: 7038076Abstract: This invention is to provide a polymerizable composition having excellent curability and surface hardness, and a cured product thereof. A novel fumarate derivative having two or more fumarate groups within one molecule and ensuring copolymerizability with the terminal alkenyloxy group, a method for producing the derivative, a polymerizable composition containing the derivative, and a cured product thereof are provided.Type: GrantFiled: July 11, 2001Date of Patent: May 2, 2006Assignee: Showa Denko K.K.Inventors: Kazufumi Kai, Keisuke Ohta, Yasushi Kadowaki, Hiroshi Uchida
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Patent number: 7029755Abstract: The invention is drawn to silane copolymers prepared from the reaction of one or more polyisocyanates with one or more lubricious polymers having at least two functional groups, which may be the same or different, that are reactive with an isocyanate functional group and with one or more organo-functional silanes having at least two functional groups, which may be the same or different, that are reactive with an isocyanate functional group and at least one functional group reactive with a silicone rubber substrate. The silane copolymers of the invention can be used as coatings that are elastic when dry, lubricious when wet, and resist wet abrasion. These copolymers are useful as coatings for polysiloxane (rubber) and other difficult to coat substrates, especially for medical devices, such as catheters. These silane copolymers can contain active agents such as antimicrobials, pharmaceuticals, herbicides, insecticides, algaecides, antifoulants, and antifogging agents.Type: GrantFiled: May 30, 2003Date of Patent: April 18, 2006Assignee: C. R. Bard, Inc.Inventors: Richard N. Terry, Kevin Walsh
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Patent number: 7030190Abstract: A thermoplastic resin composition material 1 includes a resin portion (a) 2 made of a thermoplastic resin (A); elastomer portions (b) 3 made of a thermoplastic elastomer (B) having substantially no compatibility with the thermoplastic resin (A) and having a glass transition temperature of lower than or equal to ?40° C.; and polymer portions (c) 4 made of a high polymer (C) having substantially no compatibility with the thermoplastic resin (A) and the thermoplastic elastomer (B), having a glass transition temperature or crystallization temperature of lower than or equal to ?50° C., and having a viscosity at 40° C. of 0.1 to 200000 cP. The material has a structure in which the elastomer portions (b) 3 are dispersed in the resin portion (a) 2, and the polymer portions (c) 4 are dispersed in the elastomer portions (b) 3. Accordingly, low-temperature impact resistance can significantly be improved without deterioration in the other inherent excellent physical properties of the thermoplastic resin.Type: GrantFiled: February 26, 2002Date of Patent: April 18, 2006Assignee: Daicel-Degussa Ltd.Inventors: Naoki Wakita, Hiroaki Arita
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Patent number: 7030189Abstract: The present invention is a thermoplastic elastomer resin composition comprising (A) 50 to 90% by weight of a urethane-based thermoplastic elastomer; (B) 5 to 45% by weight of polar group-containing thermoplastic elastomer; and (C) 5 to 45% by weight of a thermoplastic elastomer, and a shaped article, which is excellent in moldability, oil resistance scratch and softness.Type: GrantFiled: November 15, 2002Date of Patent: April 18, 2006Assignee: Riken Technos Corp.Inventor: Naganori Masubuchi
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Patent number: 7026382Abstract: A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5–2,000 parts by weight of a conductive filler, and (C) 0.1–300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.Type: GrantFiled: April 24, 2003Date of Patent: April 11, 2006Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hideki Akiba, Masachika Yoshino, Nobuhiro Ichiroku, Toshio Shiobara
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Patent number: 7026426Abstract: A room temperature curable organopolysiloxane composition comprising (A) an organopolysiloxane of HO(SiR12O)nH and/or (R2O)3-mR1mSiO(SiOR12O)nSiR1m(OR2)3-m wherein R1 is a monovalent C1–10 hydrocarbon radical, R2 is a monovalent C1–6 hydrocarbon radical, n is an integer of at least 10, and m is 0 or 1, (B) a silane compound having at least two hydrolyzable radicals, the remaining radicals being methyl, ethyl, propyl, vinyl or phenyl, and/or a partial hydrolyzate thereof, and (C) an organosilicon compound of (RO)pR13-pSiR3—NH—R4—NH2 wherein R1 and R2 are as defined above, R3 is a divalent C1–10 hydrocarbon radical, R4 is a divalent aromatic ring-bearing C7–10 hydrocarbon radical, and p is 1, 2 or 3, at least one of the NH and NH2 radicals being not directly attached to the aromatic ring in R4, cures into silicone rubber which has improved adherence even upon exposure to hot steam.Type: GrantFiled: October 28, 2003Date of Patent: April 11, 2006Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Tsuneo Kimura
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Patent number: 7022768Abstract: The invention concerns thermoplastic polyesters (such as PET or PBT) comprising, by weight, the total being 100%: 60 to 99% of thermoplastic polyester; 1 to 40% of impact modifier comprising: (a) a core-shell copolymer (A), (b) an ethylene copolymer (B) selected among ethylene copolymers (B1) and an unsaturated carboxylic acid anhydride, ethylene copolymers (B2) and an unsaturated epoxy compound and mixtures thereof, (c) a copolymer (C) selected among ethylene copolymers (C1) and an alkyl (meth)acrylate, ethylene copolymers (C2) and (meth)acrylic acid optionally neutralised and mixtures thereof. The invention also concerns an impact modifying composition which can be added in thermoplastic polyesters to improve their shock-proof properties and comprising constituents (A), (B) and (C).Type: GrantFiled: November 23, 2000Date of Patent: April 4, 2006Assignee: AtofinaInventors: Christophe Lacroix, Alain Bouilloux, Claude Granel, Michael Tran
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Patent number: 7022778Abstract: The invention relates to coating compositions comprising: A) at least one low molecular weight reactive compound with a molecular weight (Mn) of 300–1,500 g/mol, preferably of 300–1,200 g/mol, with at least one secondary and/or tertiary amino group and at least two hydroxyl groups per molecule, which compound is obtained by reacting A1) at least one hydroxyalkyl ester of an olefinically unsaturated carboxylic acid with 2–12 C atoms in the hydroxyalkyl residue with A2) at least one lactone and with A3) at least one hydroxy-functional alkyl-, cycloalkyl- and/or alkoxyamine with at least one primary and/or secondary amino group per molecule and with 2–10 C atoms per molecule, B) at least one cross-linking agent with functional groups reactive towards active hydrogen and optionally, C) at least one binder with functional groups containing active hydrogen.Type: GrantFiled: November 18, 2003Date of Patent: April 4, 2006Assignee: E. I. duPont de Nemours and CompanyInventors: Gerhard Bremer, Hans-Juergen Gawin, Hermann Kerber
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Patent number: 7022777Abstract: A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an easily dissolved solid concentrate with the thermosetting resin.Type: GrantFiled: June 28, 2001Date of Patent: April 4, 2006Assignee: General ElectricInventors: Michael John Davis, James Estel Tracy
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Patent number: 7019069Abstract: Resinous composition comprising: (A) 100 weight parts of (R2SiO2/2)w(RSiO3/2)x(SiO4/2)y(O1/2R1)z wherein R is selected from the group consisting of monovalent hydrocarbon groups having 1 to 10 carbon atoms, R1 is selected from the group consisting of the hydrogen atom and saturated hydrocarbon groups having from 1 to 6 carbon atoms, w is a number from 0 to 0.2, x is a number from 0.4 to 0.9, y is a number from 0.1 to 0.6, z is a number from 0.1 to 0.5, and (w+x+y)=1; (B) 20 to 150 weight parts of an alcohol-based solvent; (C) 100 to 1000 weight parts of a solvent selected from the group consisting of hydrocarbon-based solvents and polydimethylsiloxanes described by the formula Me3SiO(Me2SiO)nSiMe3, wherein Me is the methyl group and n has a value of 0 or 1; (D) 1 to 100 weight parts of a coupling agent selected from the group consisting of alkoxysilanes and silane coupling agents; (E) 0.1 to 20 weight parts of a condensation catalyst, and (F) 0.Type: GrantFiled: February 12, 2001Date of Patent: March 28, 2006Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Hideki Kobayashi, Mari Tateishi, Toru Masatomi
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Patent number: 7019088Abstract: The invention is used in the fields of chemistry and relates to hardenable materials which can be used for producing lacquers. The aim of the invention is to provide materials which harden at low temperatures in the same amount of time as the others. This is achieved by using hardenable materials containing uretdione groups and containing (A) a binding agent constituent, whereby this component either (A1) does not contain carboxyl groups, or (A2) the concentration of carboxyl groups is less than that of the catalyst (C) or (A3) in the case of a high level of concentration, a quantity of a reactive agent is added. The hardenable materials also contain (B) a polyaddition compound which comprises uretdione groups, and (C) at least one Lewis acid catalyst.Type: GrantFiled: December 3, 1999Date of Patent: March 28, 2006Assignee: Bayer MaterialScience AGInventors: Frank Lehmann, Michaela Gedan-Smolka, Dieter Lehmann
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Patent number: 7011890Abstract: A method for depositing a low dielectric constant film is provided. The low dielectric constant film includes alternating sublayers, which include at least one carbon-doped silicon oxide sublayer. The sublayers are deposited by a plasma process than includes pulses of RF power. The alternating sublayers are deposited from two or more compounds that include at least one organosilicon compound. The two or more compounds and processing conditions are selected such that adjacent sublayers have different and improved mechanical properties.Type: GrantFiled: March 3, 2003Date of Patent: March 14, 2006Assignee: Applied Materials Inc.Inventors: Son Van Nguyen, Yi Zheng
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Patent number: 7008986Abstract: The invention relates to thermoplastic moulding materials containing A) 29 to (100 wt. % minus 1 ppb) of at least one thermoplastic polymer. B) 1 ppb to 1 wt. % or at least one polyethyleneimine homopolymer of copolymer, as well as C) 0 to 70 wt. % of other additives, as the essential constituents thereof. The weight percent of constituents A) to C) amounts to 100% in every case.Type: GrantFiled: June 22, 2001Date of Patent: March 7, 2006Assignee: BASF AktiengesellschaftInventors: Burkhardt Dames, Bernd Ziegler
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Patent number: 7005476Abstract: Disclosed is a multicomponent, isocyanate-terminated or silane-functionalized coating and adhesive material which is continuously produced by mixing the individual components and by heating the latter and continuing mixing until said components reach a liquid state, wherein the resulting reactive coating and adhesive material is fed for direct use especially in profile sheathing plants, coating plants or the like. In the case of isocyanate-terminated material, one component has a reactive high-molecular weight starting polymer and a second component has a reactive isocyanate-terminated cross-linking agent. In the case of the silane- functionalized material, one component has a high-molecular weight starting material and a second component has a reactive, silane-functionalized cross-linking agent.Type: GrantFiled: February 10, 2000Date of Patent: February 28, 2006Assignee: Jowat Lobers und Frank GmbH & Co. KGInventors: Christian Terfloth, Theodor Hippold