Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.
Type:
Grant
Filed:
December 21, 2000
Date of Patent:
December 28, 2004
Assignee:
FormFactor, Inc.
Inventors:
Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
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