Patents Examined by Jianying C Atkisson
  • Patent number: 11268003
    Abstract: Provided is a heat storage device (10) of the present disclosure comprises a heat storage material (12) containing sodium acetate trihydrate; a first electrode having a surface which is in contact with the heat storage material and formed of at least one selected from the group consisting of silver, a silver alloy, and a silver compound; a second electrode in contact with the heat storage material; an inorganic porous material contained in the heat storage material; and a power supply (14) for applying a voltage to the first electrode and the second electrode. The inorganic porous material has an average pore diameter of not more than 50 nanometers. The present invention provides a heat storage device capable of releasing heat by releasing a supercooled state by voltage application. The heat storage device can be used repeatedly.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: March 8, 2022
    Assignee: PANASONIC CORPORATION
    Inventors: Takashi Kubo, Motohiro Suzuki, Hironobu Machida, Shinsuke Takeguchi, Kentaro Shii, Naoyuki Tani, Tatsuya Nakamura
  • Patent number: 11268770
    Abstract: A heat exchanger manifold configured to receive or discharge a first fluid includes a primary fluid channel and a plurality of secondary fluid channels. The primary fluid channel includes a fluid port and a first branched region distal to the fluid port. The plurality of secondary fluid channels are fluidly connected to the primary fluid channel at the first branched region. Each of the plurality of secondary fluid channels includes a first end and a second end opposite the first end. Each of the plurality of secondary fluid channels extends radially from the first branched region at the first end and has an equal length from a center of the first branched region to the second end.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: March 8, 2022
    Assignee: Hamilton Sunstrand Corporation
    Inventors: Gabriel Ruiz, Ahmet T. Becene, Thomas J. Ocken
  • Patent number: 11262136
    Abstract: Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 1, 2022
    Assignee: NEC CORPORATION
    Inventors: Mahiro Hachiya, Masaki Chiba
  • Patent number: 11266039
    Abstract: A liquid immersion tank includes a housing configured to house a heat generator, a gutter provided over the housing, and configured to form a flow path through which a coolant flows, a flow rate adjuster provided at an outflow port through which the coolant flows out from the flow path, and configured to adjust an outflow amount of the coolant, a slope provided over the housing, and configured to include a down-flow surface through which the coolant branched from the flow path flows down toward the housing, the coolant flowing through the flow rate adjuster, and a tank configured to accommodate the housing.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: March 1, 2022
    Assignee: FUJITSU LIMITED
    Inventors: Keita Hirai, Masayuki Watanabe
  • Patent number: 11262110
    Abstract: A heat dissipation module and a heat dissipation method thereof are provided. A cold side of a thermoelectric cooler is disposed on a heat conducting member. A processing circuit controls a voltage control circuit to provide an output voltage to the thermoelectric cooler according to a temperature sensing signal generated by a temperature sensor sensing a temperature of the heat conducting member, so as to adjust a temperature of the cold side of the thermoelectric cooler to dissipate heat for a heat source.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: March 1, 2022
    Assignee: Wistron Corporation
    Inventors: Chih-Teng Shen, Liang-Fang Wan
  • Patent number: 11262140
    Abstract: A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base including a heat dissipation plate. A first surface of the heat dissipation plate is connected to a lower portion of the heat sink body. A protrusion protruding away from the heat sink body is disposed on a portion of a second surface of the heat dissipation plate opposite to the first surface. The protrusion is formed by stamping or bending the heat dissipation plate away from the heat sink body from the first surface of the heat dissipation plate.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 1, 2022
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics AMP Guangdong Ltd.
    Inventors: WenYu Liu, Hongqiang Han, Jinsheng Lai, Yan Lee, Lei Liu
  • Patent number: 11262111
    Abstract: A heat pump apparatus module for heating and/or cooling supply water, the heat pump apparatus module including: an apparatus housing at least partly provided with an outer wall; a heat pump arrangement including a condenser, an evaporator, and a compressor arranged between said condenser and said evaporator, said compressor configured to transfer a heat transferring medium from said evaporator to said condenser; wherein said heat pump apparatus module is divided into at least two separate compartments being: an air-flow compartment including a first heat pump component being either the condenser or the evaporator, and being configured to allow air to flow through said air-flow compartment, said first heat pump component configured to utilize said air for heating or cooling said heat transferring medium; a first closeable compartment being accessible through a first closeable opening.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: March 1, 2022
    Assignee: ES Energy Save Holding AB
    Inventors: Fredrik Sävenstrand, Torbjörn Assarsson, Christian Gullbrandsen, Niklas Hansson
  • Patent number: 11255554
    Abstract: A dehumidifying system includes an enclosure having at least one opening disposed at a first end and at least one opening disposed at a second end. A plurality of air paths that extend through the enclosure and are separated from one another by partitions along at least a portion of the enclosure. A dehumidifier evaporator is disposed within the enclosure and configured such that at least one of the air paths is disposed to flow through the dehumidifier evaporator. The dehumidifier evaporator includes a dehumidifying coil and a heat pipe assembly at least partially wrapping around the dehumidification coil.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: February 22, 2022
    Assignee: Desert Aire Corp.
    Inventor: Craig Burg
  • Patent number: 11248824
    Abstract: A control system and method for a frostless, multivariable coupling and heat pump-based hot blast stove are used for grain drying. A first heat exchanger, a second heat exchanger, a main solution pool, corresponding pipelines, and a temperature detector are configured in the control system. A first heat pump unit, a second heat pump unit and a third heat pump unit are formed. A preheating zone, a low temperature zone, a medium temperature zone and a high temperature zone are sequentially formed on an air supply pipeline from a fresh air inlet to a fresh air outlet. A frostless operation procedure is provided. Through the configuration, the control system and method for a frostless, multivariable coupling and heat pump-based hot blast stove can implement heat supply in a gradient heat-circulation preheating mode and a gradient heat-circulation frostless mode.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: February 15, 2022
    Assignee: JIANGSU TENESUN ELECTRICAL APPLIANCE CO., LTD.
    Inventors: Yujun Wang, Xiaojie Ma, Ying Wang, Tianshu Wang, Yi Yang
  • Patent number: 11248852
    Abstract: A system may include a thermal source, a thermal sink and heat-rejecting media comprising a thermal cable, the thermal cable comprising a main length comprising a flexible graphite layer rolled into a cylindrical shape covered on the outside thereof by a thermally-insulating layer of the same cylindrical shape, a first termination at which the flexible graphite layer thermally couples to the thermal source, and a second termination at which the flexible graphite layer thermally couples to the thermal sink.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: February 15, 2022
    Assignee: Dell Products L.P.
    Inventors: Steven Embleton, Travis C. North
  • Patent number: 11249522
    Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Timothy G. Hanna
  • Patent number: 11236863
    Abstract: An improved system and method for the automated refilling of cryogenic helium is provided. In one embodiment, the system includes a dewar in fluid communication with a liquid helium cryostat through a cryogen transfer line. A controller regulates operation of a three-way valve to pre-cool the transfer line and to cause gaseous helium to flow to the dewar and force liquid helium through the transfer line into the cryostat. The controller is coupled to the output of a cryogenic level sensor, such that the controller regulates the helium liquid level within the cryostat. During filling cycles, the dewar liquid level is also monitored by the cryogenic level sensor and an alarm sounds if the dewar liquid level is undesirably low. Between filling cycles, the controller is operable to ventilate the dewar through a solenoid vent valve in fixed time intervals to ensure the dewar pressure is sufficiently low so as to not bleed liquid helium into the cryostat.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: February 1, 2022
    Assignee: UT-BATTELLE, LLC
    Inventors: Mariano M Ruiz-Rodriguez, Saad R Elorfi, Christopher M Redmon, Ryan J Morgan
  • Patent number: 11236934
    Abstract: A refrigeration cycle apparatus includes: a first four-way valve having first to fourth ports; a second four-way valve and a third four-way valve each having fifth to eighth ports; a compressor; a discharge pipe connecting a discharge port of the compressor and the first port; a suction pipe connecting a suction port of the compressor and the second port; a first high pressure pipe connecting the discharge pipe and the fifth ports; a second high pressure pipe connecting the third port and the first high pressure pipe; a first valve provided at the first high pressure pipe; a second valve provided at the second high pressure pipe; a low pressure pipe connecting the suction pipe and the sixth ports; a first outdoor heat exchanger connected with the seventh port of the second four-way valve; a second outdoor heat exchanger connected with the seventh port of the third four-way valve; and an indoor heat exchanger connected with the fourth port.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: February 1, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yusuke Tashiro, Yasuhide Hayamaru, Masakazu Kondo, Masakazu Sato, Naoki Nakagawa, Atsushi Kawashima
  • Patent number: 11236945
    Abstract: A heat exchanger includes a core tube extending in a shell space, several tubes wound around the core tube, and a liquid distributor. The liquid distributor is arranged above the tubes in the shell space and applies a liquid phase of a first medium to the tubes. The liquid distributor has distributor arms projecting in the radial direction from the core tube, an annular channel extending above the distributor arms in a circumferential direction of the shell and a collector tank formed by the core tube. The annular channel and the collector tank are each designed to collect the first medium. The distributor arms form at least one first container and at least one second container separated from the first container.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: February 1, 2022
    Assignee: LINDE AKTIENGESELLSCHAFT
    Inventors: Heinz Bauer, Florian Deichsel, Marcus Lang, Juergen Spreemann, Manfred Steinbauer
  • Patent number: 11225125
    Abstract: An integrated valve includes a body portion, a flow rate adjustment valve body, a flow passage switching valve body, and a shaft member. The body portion has formed therein a plurality of passages. The flow rate adjustment valve body is provided inside the body portion that adjusts a flow rate of fluid. The flow passage switching valve body is provided inside the body portion configured to switch a flow path of the predetermined fluid in the fluid circulation circuit, the flow passage switching valve body being switchable between distinct communication states. The shaft member is provided inside the body portion that interlocks the flow rate adjustment valve body and the flow passage switching valve body.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: January 18, 2022
    Assignee: DENSO CORPORATION
    Inventors: Tetsuya Ito, Masaaki Kawakubo, Daiki Kato, Ryohei Sugimura, Yasuhiro Kawase
  • Patent number: 11221151
    Abstract: The present disclosure relates to a heating, ventilation, and/or air conditioning (HVAC) unit having a refrigerant circuit including a heat exchanger, an expansion valve, and a compressor. The heat exchanger includes a first coil and a second coil packaged in a common support structure. The HVAC unit further has a flow control system configured to direct refrigerant flow to the first coil from the expansion valve in a cooling mode of the HVAC unit and to the first coil from the compressor in a reheat mode of the HVAC unit, and configured to direct refrigerant flow to the second coil from the expansion valve in both the cooling mode and the reheat mode of the HVAC unit.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: January 11, 2022
    Assignee: Johnson Controls Technology Company
    Inventors: Swapnil V. Mohite, Nivedita Nath, Ravindra B. Salunkhe, Ritesh D. Rokade, Anil V. Bhosale, Ketan S. Khedkar
  • Patent number: 11215383
    Abstract: A cooling apparatus includes: a first fluid flowpath including the following elements, in downstream flow sequence: a separator vessel; a subcooler having a first side in fluid communication with the first fluid flowpath and a second side configured to be disposed in thermal communication with a cold sink; a flow control valve; a primary evaporator assembly including at least one primary evaporator configured to be disposed in thermal communication with a primary heat load; and a pressure regulator operable to maintain a refrigerant saturation pressure within the primary evaporator at a predetermined set point.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: January 4, 2022
    Assignee: Rolls-Royce North American Technologies Inc.
    Inventor: Eugene Charles Jansen
  • Patent number: 11215408
    Abstract: A heat dissipation device includes a heat conducting plate and a heat sink. The heat conducting plate has a first surface and a second surface opposite to each other. The heat sink is coupled to the first surface of the heat conducting plate. The heat sink includes a first peak portion, a second peak portion, a valley portion and a first curved surface. The first peak portion and the second peak portion are adjacent to each other. The valley portion is located between the first peak portion and the second peak portion. The first curved surface is coupled between the first peak portion and the valley portion. An extension line perpendicular to a corresponding tangent line of the first curved surface passes between the first peak portion and the second peak portion.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: January 4, 2022
    Assignee: AVERMEDIA TECHNOLOGIES, INC.
    Inventors: Jui-Hung Kao, Yu-Chin Liu, Wen-Tse Yan
  • Patent number: 11209223
    Abstract: A heat exchanger includes a stack of flow conduits. Each flow conduit is configured to conduct a fluid. Parting sheets separate adjacent flow conduits in the stack, providing heat transfer between them. Each of the flow conduits includes vanes extending along a vane path and between top and bottom parting sheets. The vanes are separated from one another, thereby creating flow channels. Each flow conduit also includes a plurality of flow modifiers, each adjacent to a corresponding leading edge of a corresponding vane, so as to cause a disrupted portion of a fluid flow to be incident upon the corresponding leading edge. Each of the flow modifiers includes an aerodynamic portion and a gap portion. The aerodynamic portion extends from at least one of the top and bottom parting sheets. The aerodynamic portion does not connect the top and bottom parting sheets due to the gap portion.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: December 28, 2021
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: James Streeter, Roberto J. Perez
  • Patent number: 11209177
    Abstract: A method is provided for controlling an outdoor air conditioner formed outside of a structure, the method including: drawing outdoor air into the outdoor air conditioner; cooling the outdoor air to a dehumidification temperature to provide dehumidified air in the outdoor air conditioner; determining whether an air conditioning load exists in an air conditioning space inside the structure; heating the dehumidified air to generate supply air if it is determined that no air conditioning load exists in the air conditioning space; passing the dehumidified air at the dehumidification temperature as the supply air if it is determined that an air conditioning load exists in the air conditioning space; and providing the supply air to the air conditioning space.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: December 28, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinichi Ito, So Nomoto, Daisuke Sakai