Patents Examined by Joel Attey
  • Patent number: 10161689
    Abstract: A heat exchanger including at least one first module and one second module for the heat exchange between a first fluid medium and a second fluid medium, wherein the first fluid medium can be conducted through a closed channel system separate from the second fluid medium, with the closed channel system being able to be flowed around by the second fluid medium and with the second fluid medium being gaseous. A first wetting apparatus is provided for the first module and a second wetting apparatus is provided for the second module by means of which the first module and the second module can be wetted by a third fluid medium, with the first wetting apparatus for the first module being able to be actuated independently of the wetting apparatus for the second module.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: December 25, 2018
    Assignee: A-HEAT Allied Heat Exchange Technology AG
    Inventor: Michael Kloeppner
  • Patent number: 10151542
    Abstract: According to an embodiment of the disclosure, an encapsulated phase change material (PCM) heat sink is provided. The encapsulated PCM heat sink includes a lower shell, an upper shell, an encapsulated phase change material, and an internal matrix. The internal matrix includes a space that is configured to receive the encapsulated phase change material. Thermal energy is transferrable between the encapsulated phase change material and at least one of the lower shell and the upper shell. For a particular embodiment, the upper shell is coupled to the lower shell at room temperature and room pressure.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: December 11, 2018
    Assignee: Raytheon Company
    Inventor: Adam C. Wood
  • Patent number: 10139147
    Abstract: A refrigerator with an ice container is provided, and more particularly, a refrigerator with an ice container, in which ice stored in an ice container may be transferred by gravity, and the ice thus transferred may be discharged in a cubic ice state or a broken ice state.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: November 27, 2018
    Assignee: LG ELECTRONICS INC.
    Inventor: Sungsik Kang
  • Patent number: 10126004
    Abstract: The present disclosure provides: a method for recycling waste-heat from a heat-dissipation facility, the method comprising: (a) collecting hot waste air generated in the heat-dissipation facility; (b) changing the hot air to cool air to change cool water to hot water; (c) feeding the cool air to the heat-dissipation facility to cool air in the heat-dissipation facility; and (d) increasing a humidity in the heat-dissipation facility using the hot water.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: November 13, 2018
    Inventor: Gun Tag Kim
  • Patent number: 10119736
    Abstract: A condenser includes a condensation section, a super-cooling section located above the condensation section, and a liquid receiver. The liquid receiver has a first space communicating with the condensation section through a refrigerant inlet and a second space located above the first space and communicating with the super-cooling section through a refrigerant outlet. A suction pipe which is open at upper and lower ends thereof and which establishes communication between the first space and the second space is disposed in the first space. A tubular flow control member whose upper end is open is disposed around the suction pipe such that the refrigerant having flowed into the first space through the refrigerant inlet hits against the flow control member and changes its flow direction. Since the refrigerant inlet is located within the vertical range of the flow control member, the refrigerant hits against the flow control member.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: November 6, 2018
    Assignee: KEIHEN THERMAL TECHNOLOGY CORPORATION
    Inventor: Teruyuki Nagafuji
  • Patent number: 10119774
    Abstract: The invention discloses instantaneous cooler/freezer using orbital shake method. The instantaneous cooler/freezer using orbital shake method includes a cooling liquid, a flow pump, a reserve tank, a plate heat exchanger, a liquid entrance hole, a cooling chamber, an exit hole, a cooling gas entrance, a gas exit hole, a plurality of cooling liquid distribution channels, an expandable envelope with pockets, a valve, a flat inner cover, a cooling chamber cover having led lights placed at sides for each bottle to inform a user in case of a problem, a rakor, a plurality of conical springs, a laser thermometer, a reduced motor, an eccentric bearing, is used to enables the cooling chamber to be in orbital shake motion, a plurality of roller ball bearings, a plurality of horizontal guide bearings. The instantaneous cooler/freezer using orbital shake method specifically build for packaged beverages, food, and similarly all packaged objects.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: November 6, 2018
    Inventors: Umit Kosa, Kerem Erhan
  • Patent number: 10123459
    Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are assembled and disposed in the receiving space. At least one protrusion section protrudes from one side of the first radiating fin assembly. The protrusion section is formed with a first slope and a second slope. The second radiating fin assembly is assembled with the first radiating fin assembly. At least one notch is formed on one side of the second radiating fin assembly corresponding to the protrusion section. The notch is formed with a third slope and a fourth slope. The third slope is in contact with the first slope. A gap is defined between the fourth and second slopes. An open space is defined between the first and second radiating fin assemblies in communication with the gap.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: November 6, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Wen-Ji Lan
  • Patent number: 10113772
    Abstract: A ground circuit in a low-energy system includes a connection pipeline (3), collection pipe system (2) and a return pipeline(4) for circulating a transfer fluid. The ground circuit is utilized for transferring thermal energy recovered from its surroundings, for instance, to a heat pump (5). The ground circuit collection pipe system (2) consists of a hollow profile (6) arranged to be a coil, whereby the hollow profile is connected at its first end to a connection pipeline (3) for conveying the transfer fluid along the hollow profile from the first coil end to the second, and at the second end of the coil, the second end of the hollow profile is connected to the return pipeline (4) for conveying the transfer fluid from the hollow profile towards the place where it is used. At the opposite ends of the hollow profile, means for controlling the fluid flow are arranged.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: October 30, 2018
    Inventor: Mauri Antero Lieskoski
  • Patent number: 10107561
    Abstract: A heat pipe suited for thinning, and achieving high heat transport performance is provided. A heat pipe 1 according to the invention includes working liquid, a container 2 into which the working liquid is sealed, and a mesh member 3 disposed in such a position as to come into contact with at least two inner surfaces of the container, the two surfaces facing to each other. The mesh member 3 is formed by a plurality of meshes 31 and 32 laminated on each other. The porosity in the portion where the respective meshes 31 and 32 contact each other is lower than the porosity in the portion where the meshes 31 and 32 contact the container 2.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: October 23, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Hiroshi Sakai, Hirofumi Aoki, Masanobu Sugimura
  • Patent number: 10107569
    Abstract: A U-bend pipe type heat exchanger includes: a heat exchanger main body surrounded by a front side plate, a back side plate, a left side plate, and a right side plate, and having open upper and lower portions through which a heat source passes; a plurality of U-bend pipes inserted between the left side plate and the right side plate, each of the plurality of U-bend pipes including two heat exchange pipes arranged in parallel with each other and a U-shaped pipe connecting one end portions of the two heat exchange pipes; and a plurality of water jackets attached to at least one of outward surfaces of the left side plate and the right side plate, and connecting open end portions of two adjacent heat exchange pipes such that a low-temperature water circulates along the plurality of U-bend pipes.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: October 23, 2018
    Assignee: KITURAMI BOILER CO., LTD.
    Inventors: Sung-Hwan Choi, Youn-cheol Shin, Tae-young Kim, Young-Hyo Jeon, Hae-Young Jung
  • Patent number: 10104807
    Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are disposed in the receiving space. At least one first protrusion section protrudes from the first radiating fin assembly. A top end of the first protrusion section is formed with a first apex. Two sides of the first apex are formed with a first slope and a second slope. At least one second protrusion section protrudes from the second radiating fin assembly corresponding to the first protrusion section. A top end of the second protrusion section is formed with a second apex. Two sides of the second apex are formed with a third slope and a fourth slope. The second apex abuts against the first apex to define an open space between the first and second radiating fin assemblies.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: October 16, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10091909
    Abstract: The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: October 2, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joseph Linderman, Bruno Michel, Hugo E. Rothuizen, Reio Waelchli
  • Patent number: 10086675
    Abstract: A bodywork structure for controlling or modifying the temperature of a passenger compartment of an electric or hybrid motor vehicle is provided. The bodywork structure includes at least one interior and exterior panel and one intermediate layer between the panels, each panel being based on a thermally conducting and electrically insulating material. The intermediate layer has at least one phase change material PCM and electric components coupled to it and is configured to be connected to an accumulator battery and which are able to convert the electrical energy available when the battery is being recharged into thermal energy stored by the PCM, so that the stored thermal energy is then transmitted to the interior of the vehicle when the latter is in use thanks to crystallizing of the at least one PCM, which is conversely able, by melting, to absorb an excess of heat inside the vehicle when this PCM is not recharged.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: October 2, 2018
    Assignee: Hutchinson
    Inventors: Benjamin Swoboda, Christophe Dominiak, Simon Karam, Nadine Poupa-Parsigneau
  • Patent number: 10077948
    Abstract: A heat storage apparatus includes: a first tank; a second tank that is provided above the first tank; an on-off valve; and a heat storage solution that is accommodated in the first tank and the second tank. The heat storage solution has a characteristic of absorbing heat and separating into a first liquid and a second liquid having a lower density than the first liquid at a lower critical solution temperature or higher, the first liquid and the second liquid have a characteristic of releasing heat and mixing with each other at a temperature lower than the lower critical solution temperature, and when the heat storage solution separates into the first liquid and the second liquid, the first liquid is accommodated in the first tank and the second liquid is accommodated in the second tank.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: September 18, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yoshio Ohashi, Masaki Watanabe
  • Patent number: 10068833
    Abstract: A heat module includes a fan, a heat sink, a heat transfer member, and a plurality of connection portions. The heat transfer member includes a lower surface capable of being in thermal contact with a heat source, and an upper surface thermally connected to the heat sink, and is arranged to overlap with at least a portion of the fan in a plan view. The plurality of connection portions are arranged between the heat transfer member and the housing to define an axial gap between an upper surface of the heat transfer member and a lower surface of the lower plate portion. The heat transfer member includes a heat source contact portion arranged on a side, closer to the fan, of an end portion of the fan at which the air outlet is defined.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: September 4, 2018
    Assignee: NIDEC CORPORATION
    Inventors: Takehito Tamaoka, Koji Hatanaka, Kiyoto Ida
  • Patent number: 10060686
    Abstract: A passive radiative cooling system in which an ultra-black emitter includes metamaterial nanostructures disposed on the top surface of a metal sheet, and a conduit structure channels the flow of coolant against a bottom surface of the metal sheet. The metamaterial nanostructures (e.g., tapered nanopores) are configured to dissipate heat from the coolant in the form of emitted radiant energy having wavelengths/frequencies that fall within known atmospheric transparency windows (e.g., 8-13 ?m or 16-28 ?m), the emitted radiant energy being transmitted through a reflective layer into cold near-space. The ultra-black emitter is formed using a modified Anodic Aluminum Oxide (AAO) self-assembly technique followed by electroless plating that forms metal-plated tapered nanopores, and the reflective layer includes a distributed Bragg reflector.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: August 28, 2018
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Victor Liu, Bernard D. Casse, Armin R. Volkel
  • Patent number: 10059191
    Abstract: The present teachings provide for a flow restrictor for a coolant line of an internal combustion engine coolant system. The flow restrictor can include a restrictor element and a biasing member. The restrictor element can include a restrictor plate and a tab non-rotatably coupled at an angle. The biasing member can rotationally bias the restricting element to a first position where the restricting plate is substantially parallel to the flow of fluid. The tab can be configured to create a torque on the restricting element to overcome the biasing member and rotate the restricting plate to block a portion of the fluid flow path when the flow exceeds a predetermined flow rate.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: August 28, 2018
    Assignees: DENSO International America, Inc., DENSO CORPORATION
    Inventor: Jacob Wright
  • Patent number: 10052932
    Abstract: An adsorption based system is provided for the selective cooling and heating of a vehicle compartment using by-product water collected from a power generating unit of a vehicle. The system may include a fuel cell stack and an exhaust conduit configured to transfer an exhaust stream from the fuel cell stack. A water reservoir stores by-product water collected from the exhaust stream. The system may include a coolant loop configured to circulate a coolant fluid. A detachable adsorption subsystem is in thermal communication with the coolant loop and the exhaust conduit, and may include an evaporator and an adsorbent bed. The adsorption subsystem is configured to: vaporize water from the water reservoir using the evaporator; adsorb the vaporized water, thereby cooling a portion of the coolant fluid; regenerate the adsorbent bed using heat from the exhaust stream to release water vapor; and direct the water vapor into the exhaust conduit.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: August 21, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Feng Zhou, Gaohua Zhu
  • Patent number: 10041740
    Abstract: A heat exchanger is formed by a plurality of heat exchanger units each including a respective small tank at each end of a core, the units being stacked in a thickness direction of the cores, and oil is supplied to finned tubes constituting the core of each of the units via a header. Each of the tanks has an opening for communicating with the header which opening is at a position on the length of the tank different from that of each of the adjacent tanks.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: August 7, 2018
    Assignee: T.RAD Co., Ltd.
    Inventor: Masaaki Takase
  • Patent number: 10040334
    Abstract: The invention relates to an air conditioning system for a motor vehicle, with at least two coolant circuits as well as a refrigerant circuit. The refrigerant circuit comprises a compressor for the compression of the refrigerant, a heat exchanger for the cooling and liquefying of the compressed refrigerant, an expansion device, and a heat exchanger for the evaporation of the two-phase refrigerant. The heat exchangers are designed as coolant-refrigerant heat exchangers in each case for the heat transfer between the refrigerant circuit and at least one of the coolant circuits. The refrigerant circuit is moreover constructed with a heat exchanger for the heat exchange between the refrigerant and an air mass flow to be supplied to the passenger compartment of the motor vehicle as well as with an element, arranged downstream of the heat exchanger in the flow direction of the refrigerant, for changing the throughflow cross section.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: August 7, 2018
    Assignee: HANON SYSTEMS
    Inventors: Marc Graaf, Navid Durrani, Roberto Della Rovere