Abstract: A wiring substrate includes: a base material; a first through-hole and a second through-hole that are formed in the base material; magnetic material that is filled in the first through-hole; a third through-hole that is formed in the magnetic material; a first plating film that covers an inner wall surface of the third through-hole; and a second plating film that covers an inner wall surface of the second through-hole and the first plating film. The first plating film includes a first electroless plating film that is in contact with the inner wall surface of the third through-hole, and a first electrolytic plating film that is laminated on the first electroless plating film.

Abstract: A FPCB/FCCL replacing a tinned-copper welding strip as a photovoltaic module bus bar is a composite material including an insulating base material and a conductive layer, and the insulating base material is made from PI or PET, and the conductive layer is generally the copper foil. According to the present invention, when the flexible solar module adopts the FPCB/FCCL to replace the tinned-copper welding strip as the photovoltaic module bus bar, the product quality and product stability are greatly improved, and the FPCB/FCCL bus bar is also suitable for the double-glass solar module and the single-glass solar module. The copper foil of FPCB/FCCL may be integrated with circuits, or be the complete copper foil (without circuits), or the copper foil of FPCB/FCCL may simultaneously has the part with circuits and the part without circuits.

Abstract: A junction assembly is disclosed herein. The junction assembly includes a junction housing configured to support a phase bar assembly. A heatsink contacts at least a portion of the junction housing and a busbar is arranged adjacent to the junction housing. At least one fastener attaches the junction housing, the heatsink, and the busbar to each other. At least one heatsink seal is provided at an interface defined between the heatsink and the junction housing.

Abstract: A device includes a head having a material having a plurality of pores, wherein at least some of the pores from the plurality of pores each have a size that is smaller than a water molecule and larger than an air molecule such that the air molecules can pass through the pores and the water molecules are prevented from passing through the pores; and an elongated body extending from the head and having a thread on an outer surface thereof and having a conduit extending longitudinally through the elongated body to the head. The device is configured to fasten a first surface to a second surface using the thread of the elongated body.

Abstract: A duct-bank stub-up assembly includes a first pre-formed stub-up module that comprises a first plurality of conduits and a first encasing body. For each of the first conduits, a first end of the conduit provides a mating end on a mating side of the first encasing body and a second end of the conduit provides a mating end on a top surface of the first encasing body. The assembly further includes a second pre-formed stub-up module that comprises a second plurality of conduits and a second encasing body formed to have a stub-up section and a footer section. For each of the second conduits, a first conduit end provides a mating end on a mating side of the footer section and a second conduit end provides a mating end on a top surface of the stub-up section. The first module is positioned on the footer of the second module.

Abstract: The present disclosure relates to a charging cable having a protective sleeve which extends to an extended position to protect the charging end of the cable. The protective sleeve may be retracted to a retracted position to reveal the charging end and allow the cable to be plugged into an electronic device. Various embodiments are disclosed in which the protective sleeve may be spring loaded by a single spring, by a plurality of springs, or it may be manually operated.

Abstract: A wiring board includes an insulating layer; an insulating oxide film that is formed by forming a film of metal oxide or semimetal oxide on a surface of the insulating layer; a seed layer that is made of metal and that is stacked on the insulating oxide film; and an electrode that is made of metal and that is formed on the seed layer, wherein the insulating oxide film and the seed layer are removed from an area not overlapping the electrode to expose the insulating layer.

Abstract: A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

Abstract: A wiring board includes an insulating base including a first principal surface, a second principal surface opposite to the first principal surface, and a first through hole penetrating the insulating base from the first principal surface to the second principal surface, a functional material provided inside the first through hole, a first insulating layer covering the first principal surface, and a first surface of the functional material, and a second insulating layer covering the second principal surface, and a second surface of functional material. A second through hole is formed in the first insulating layer, the functional material, and the second insulating layer, and a conductive layer is formed on a wall surface of the second through hole.

Abstract: A circuit board includes a first metal layer; a second metal layer that is arranged on the first metal layer; and a sealing resin with which a space between the first metal layer and the second metal layer is filled, wherein the second metal layer includes an electrode that protrudes from an upper surface of the sealing resin and that has an end face on which an electronic part is mountable; and an interlayer connector whose upper surface is exposed in a position lower than the end face of the electrode from the upper surface of the sealing resin and that makes contact with the first metal layer.

Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures.

Abstract: A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.

Abstract: Proposed is an anodic aluminum oxide structure made of anodic aluminum oxide and, more particularly, is an anodic aluminum oxide structure that minimizes damage to a material in the vicinity of a conductor and prevents a problem of delamination between the conductor and a member existing thereon.

Abstract: The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

Abstract: An adapter assembly including a power box that has a housing containing internal components, a longitudinal axis and a storage portion. The adapter assembly also includes a first cord coupled to and extending from the housing, an adapter including an engagement portion that is removably coupled to the storage portion of the housing and that selectively engages a power source-receiving portion of a tool, and a second cord having a first end coupled to the adapter and a second end coupled to the housing.

Abstract: A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.

Abstract: A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.

Abstract: The present invention can provide a twisting antigalloping device for securing to a span of a cable for torsionally twisting the cable, and includes a grip or clamp portion having a grip or clamp axis for gripping or clamping to the cable along the clamp axis. A variable weight portion can be connected to the clamp portion and extend along a variable weight axis offset from the clamp axis. The variable weight portion can include an elongate member with a plurality of individual weights secured on the elongate member.

Abstract: In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Abstract: An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section (223) and a constant longitudinal structure (227) along a conductive column support (255) journaled through the layers in the via. The principal section (221) comprising a first tuning sub-assembly (229 A) in a first portion of the RE via above the longitudinal structure (227) and at an entrance of the primary longitudinal structure (221) and comprising a first set of pad, anti-pad pairs (445, 545, 645) tuned to receive an RE band. A second principal tuning sub-assembly (229B) in a second portion of the via below the longitudinal structure (227) and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs (445, 545, 645) tuned to receive the band and mirroring the first set of pairs.