Abstract: A sealed container containing a foodstuff or beverage has a lid that includes a heat-sealable, composite film that includes a polymeric substrate layer having a first and second surface, a primer layer that includes PVdC disposed on the first surface, and a heat-sealable polymeric layer extrusion coated on the primer layer. The heat-sealable polymeric layer is 12 ?m thick or less and includes a copolymer having repeating monomeric units of ethylene and at least a second type of repeating monomeric unit having the formula [—CH2C(R1)(X)—] wherein: X is selected from —COOR2 and —OC(O)CH3; R1 =H or methyl; and R2 is H, C1-10 alkyl or a counterion M.

Abstract: An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part.

Abstract: In one aspect is a film comprising: (a) within the range of from 50 to 99 wt % linear low density polyethylene based on the weight of the core composition; and (b) within the range of from 1 to 50 wt % propylene-?-olefin copolymer based on the weight of the core composition, wherein the propylene-?-olefin copolymer possesses: (i) a melting temperature (Tm) of less than 105° C., and (ii) a heat of fusion (Hf) of less than 75 J/g; wherein the film is a cast or blown film. The films have excellent strength and elasticity and are ideal for such applications as stretch wrap.

Abstract: An intermediate transfer member that includes a mixture of a polyamideimide, an ammonium alkylphosphate, an optional polysiloxane, and an optional conductive filler.

Abstract: A catalyst for olefin polymerization, comprising: (A-1) a bridged metallocene compound represented by the following Formula [1-1], and (b) at least one compound selected from: (b-1) an organoaluminum oxy compound, (b-2) a compound which forms an ion pair, and (b-3) an organoaluminum compound: wherein in Formula [1-1], R1, R2, R3, R4, R5, R8, R9, and R12 are each selected from a hydrogen, a hydrocarbon group and a silicon-containing group; the four groups of R6, R7, R10, and R11 are not hydrogen atoms, and are each selected from a hydrocarbon group or a silicon-containing group; R13 and R14 are each a hydrocarbon group or the like, excluding a hydrogen atom and a methyl group; M is Ti, Zr or the like; Y is carbon or the like; Q is a halogen or the like; and j is an integer from 1 to 4.

Abstract: The present invention provides a resin composition which is excellent in gas-barrier properties after a hot-water treatment and excellent in handling properties without increasing viscosity of the resin composition in a melt-kneading step at forming. The invention provides a resin composition containing a thermoplastic resin (A) and a partially dehydrated product or completely dehydrated product (B) of hydrated carboxylic acid salt.

Abstract: Anticorrosive coating compositions comprise a binding polymer and an amorphous aluminum phosphate corrosion inhibiting pigment dispersed therein. The coating composition comprises 1 to 25 percent by weight aluminum phosphate. The binding polymer can include solvent-borne polymers, water-borne polymers, solventless polymers, and combinations thereof. The aluminum phosphate is made by combining an aluminum source with a phosphorous source to form an amorphous aluminum phosphate solid condensate. The coating composition is specially engineered to provide a controlled delivery of phosphate anions of 50 to 500 ppm, and has a total solubles content of less than 1500 ppm. The amorphous aluminum phosphate is preferably free of alkali metals and alkaline earth metals. The amorphous aluminum phosphate has an oil absorption of less than 50, and a surface area of less than about 20 m2/g, The coating composition has a water adsorption potential of up to 25% by weight water.

Abstract: A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.

Abstract: Provided is a low-cost polyimide, containing cyclohexane diamine as a diamine unit, that has a low thermal expansion coefficient. Said block polyimide contains blocks having the repeating structural unit shown in formula (1A) and blocks having the repeating structural unit shown in formula (1B). This block polyimide is preferably obtained by imidizing a block polyamide acid imide that contains blocks having the repeating structural unit shown in formula (2A) and blocks having the repeating structural unit shown in formula (2B).

Abstract: The objective of the present invention is to provide a resin composition for direct plating whose plating performance such as depositibility and appearance after forming a metal film including copper film and the like by electroplating in direct plating method is excellent, a molded article comprising this composition, and a plated article having a metal film or an alloy film, formed by direct plating. The present composition is a thermoplastic resin composition containing a rubber-reinforced vinyl-based resin and the rubber-reinforced vinyl-based resin comprises a diene-based rubbery polymer [a1] and an ethylene•?-olefin-based rubbery polymer [a2], the total amount of the diene-based rubbery polymer [a1] and the ethylene•?-olefin-based rubbery polymer [a2] is from 3 to 30% by mass based on the thermoplastic resin composition, and the ratio of the ethylene•?-olefin-based rubbery polymer [a2] to the total amount is from 0.01 to 0.4.

Abstract: A modified medical device substrate surface designed to improve adhesion of biomimetic surfactants to the medical device surface, thus reducing the risk of thrombosis is described. The surface modification is accomplished through either an application of a tie layer of a hydrophobic material on the substrate surface intermediate the biomimetic coating or through incorporation of a hydrophobic dopant in the polymeric substrate prior to extrusion or molding. Either method creates a hydrophobically modified surface that enhances the biomimetic surfactant bonding strength.

Abstract: An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.

Abstract: A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraft construction, for example.

Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.

Abstract: A composite includes a substrate, a binder layer disposed on a surface of the substrate; and a nanofiller layer comprising nanographene and disposed on a surface of the binder layer opposite the substrate. In addition, a nano-coating layer for coating a substrate includes multiple alternating layers of the binder layer and the nanofiller layer. Articles coated with the nano-coating layer prepared from alternating layers of nanofiller layer and binder layer have improved barrier properties, and may be used in down-hole applications.

Abstract: A coating/sealant system that includes a coating and a sealant deposited over at least a portion of the coating, in which the coating includes a reaction product formed from reactants comprising a phosphated epoxy resin and a curing agent, and the sealant includes a sulfur-containing polymer.

Abstract: Provided is a cyanate ester polymer having excellent flame retardance, low dielectric constant, low dielectric loss tangent and high heat resistance. Specifically provided is a cyanate ester polymer obtained by polymerizing a cyanate ester compound represented by the following general formula (1). (1) In the formula, X represents OCN or OH, and 10-100% by mol of X is composed of OCN.

Abstract: Disclosed is a biaxially stretched polyamide resin film which is a biaxially stretched film having a layer of a polyamide resin with caproamide as a repeating unit thereof and has an amount of the caprolactam monomer extracted from the biaxially stretched polyamide resin film of 0.1% by mass or less, and also disclosed is a packaging material including the biaxially stretched polyamide resin film.

Abstract: Laminate structures comprising one or more sheets of material bonded together with an adhesive polymer. The adhesive polymer is a polyester amide, polyester urethane, or polyester urea.

Abstract: Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured adhesive compositions can be used as structural adhesives.