Abstract: A TAB device (10) is coupled to a circuit board (12). The TAB device (10) includes a semiconductor die (11) having leads (18) extending therefrom. A material layer (30), typically a polyimide layer, covers the inward portion of the leads (18) to maintain leading position during attachment of the TAB device (10) to the circuit board (12). Prior to attachment, a backside encapsulation region (40) is applied to the backside of the TAB device (10), sealing the backside of the leads (18). The backside encapsulation material is selected to have a coefficient of thermal expansion similar to the coefficient of thermal expansion of the first material layer (18). The backside encapsulation material is selected to have a coefficient of thermal expansion similar to the coefficient of thermal expansion of the first material layer (30), to prevent excessive warpage.

Abstract: An method for cleaning and disinfecting a soft contact lens, characterized by immersing the soft contact lens in a treating solution which does not generate any hypohalite during electrolysis, supplying a direct current, and raising the temperature of the treating solution; and a treating solution for a soft contact lens, characterized by containing a treating agent mainly composed of boric acid and borax in a concentration of at most 2.2 w/v % and having an electrical conductivity of at most 8 mS/cm are disclosed.