Abstract: A vehicle window with an anisotropic light sensor, has a first glass layer and a second glass layer, wherein an arrangement of light-sensitive elements is arranged, substantially parallel to the first glass layer, between the first glass layer and the second glass layer, wherein the pane furthermore has an aperture such that light can shine through the second glass layer and the aperture onto at least one of the light-sensitive elements, wherein, depending on the direction of incident light, the sensor provides a signal that is indicative of the direction, wherein the arrangement of light-sensitive elements has a camera chip and wherein the arrangement of light-sensitive elements is arranged on a flexible film.

Abstract: A metal stem includes a cylindrical portion in which an FPC inserting portion is formed, and a base standing upright from one plane of the cylindrical portion. A tubular lens cap with one open end is fixed to a peripheral portion of the one plane of the cylindrical portion, and has a lens mounted on a bottomed portion. A substrate mounted on one plane of the base includes a signal wiring layer and a ground wiring layer. An optical semiconductor element is mounted on the substrate and has a signal terminal connected to the signal wiring layer of the substrate, and a ground terminal connected to the ground wiring layer of the substrate. An FPC substrate is disposed so as to pass through the FPC inserting portion and to face the one plane of the base. The FPC substrate includes a signal wiring layer connected to the signal wiring layer of the substrate with a metal wire.

Abstract: A time-resolving sensor includes a single-photon avalanche diode (SPAD), a logic circuit and differential time-to-charge converter (DTCC) circuit. The SPAD is responsive to a shutter signal to generate an output signal based on detecting an incident photon. The logic circuit generates first and second enable signals. The DTCC includes a capacitor device, first and second switching devices, and an output circuit. The first switching device is responsive to the first enable signal to transfer a charge on the capacitor device to the first floating diffusion. The second switching device is responsive to the second enable signal to transfer a remaining charge on the capacitor device to the second floating diffusion. The output circuit outputs a first voltage that is based on the first charge on the first floating diffusion and a second voltage that is based on the second charge on the second floating diffusion.

Abstract: Provided are a light detection element, a receiving device, and a light sensor device. The light detection element includes a magnetic element that includes a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer interposed between the first ferromagnetic layer and the second ferromagnetic layer, wherein the first ferromagnetic layer is irradiated with light in a direction intersecting a stacking direction of the magnetic element.

Abstract: A detector (110, 1110, 2110) for determining a position of at least one object (112) is proposed. The detector (110, 1110, 2110) comprises: at least one transfer device (128, 1128), wherein the transfer device (128, 1128) has at least one focal length in response to at least one incident light beam (116, 1116) propagating from the object (112, 1112) to the detector (110, 1110, 2110); at least two optical sensors (113, 1118, 1120), wherein each optical sensor (113, 1118, 1120) has at least one light sensitive area (121, 1122, 1124), wherein each optical sensor (113, 1118, 1120) is designed to generate at least one sensor signal in response to an illumination of its respective light-sensitive area by the light beam (116, 1116), at least one evaluation device (132, 1132) being configured for determining at least one longitudinal coordinate z of the object (112, 1112) by evaluating a quotient signal Q from the sensor signals.

Abstract: A radiation imaging apparatus is provided. The radiation imaging apparatus comprises a plurality of pixels used to acquire a radiation image, and a readout circuit configured to read out a signal from each of the plurality of pixels. Correction image data used for performing offset correction is acquired from the plurality of pixels in an acquisition mode associated with an estimated value of the signal and system noise generated when the readout circuit reads out the signal, the estimated value and the system noise being set according to an imaging mode by a user.

Abstract: Apparatus and methods relating to photonic bandgap optical nanostructures are described. Such optical nanostructures may exhibit prohibited photonic bandgaps or allowed photonic bands, and may be used to reject (e.g., block or attenuate) radiation at a first wavelength while allowing transmission of radiation at a second wavelength. Examples of photonic bandgap optical nanostructures includes periodic and quasi-periodic structures, with periodicity or quasi-periodicity in one, two, or three dimensions and structural variations in at least two dimensions. Such photonic bandgap optical nanostructures may be formed in integrated devices that include photodiodes and CMOS circuitry arranged to analyze radiation received by the photodiodes.

Abstract: A semiconductor image sensor includes a plurality of pixels. Each pixel of the sensor includes a semiconductor substrate having opposite front and back sides and laterally delimited by a first insulating wall including a first conductive core insulated from the substrate, electron-hole pairs being capable of forming in the substrate due to a back-side illumination. A circuit is configured to maintain, during a first phase in a first operating mode, the first conductive core at a first potential and to maintain, during at least a portion of the first phase in a second operating mode, the first conductive core at a second potential different from the first potential.

Abstract: To obtain an imaging device that can improve temperature detection accuracy. An imaging device of the present disclosure includes a processing unit formed on a first semiconductor substrate and capable of performing predetermined image processing on the basis of image data obtained by an imaging unit, a temperature sensor formed on the first semiconductor substrate and capable of generating a detection signal according to a temperature, and a first pad electrode formed on the first semiconductor substrate and electrically insulated from a circuit formed on the first semiconductor substrate.

Abstract: A power beaming system includes a power beam transmitter arranged to transmit the power beam, and a power beam receiver arranged to receive the power beam from the power beam transmitter. A power beam transmission source is arranged to generate a laser light beam for transmission by the power beam transmitter from a first location toward a remote second location. A beam-shaping element shapes the laser light beam, at least one diffusion element uniformly distributes light of the shaped laser light beam, and a projection element illuminates a power beam receiving element of predetermined shape with the shaped laser light beam. At the power beam receiver, a diffusion surface diffuses a portion the power beam specularly reflected from the power beam receiver.

Abstract: An image sensor for recording incident radiation may include a first layer for filtering the incident radiation by attenuating incident radiation with a frequency below a cutoff frequency and a second light-sensitive layer for absorbing radiation passing through the first layer. The first layer may precede the second light-sensitive layer in a direction of propagation of the incident radiation and the first layer includes at least one aperture passing through the first layer to the second light-sensitive layer for propagating radiation therethrough. The cross sectional size of the at least one aperture may be configured to provide a cutoff frequency so that incident radiation with a frequency below the cutoff frequency is attenuated inside the at least one aperture and incident radiation with a frequency above the cutoff frequency propagates through the at least one aperture.

Abstract: A high dynamic range sensing device is disclosed. The device includes an array of Bayer pattern units. Each of the Bayer pattern units comprises a plurality of pixels and each of the plurality of pixels comprises a plurality of photodiodes. At least one of the plurality of photodiodes in each pixel is configured to detect near infrared (NIR) light and at least one of the plurality of photodiodes in each of the plurality of pixels is configured to detect visible light.

Abstract: An action recognition system is illustrated. The action recognition system has an annular body, at least one light emitting unit, at least one light sensing unit and an action recognition module. The annular body is worn on a movable part of a user. One end of the light emitting unit is exposed on an inner side of the annular body, wherein the light emitting unit emits a first light beam illuminating at least a portion of the movable part. One end of the light sensing unit is exposed on the inner side of the annular body. The light sensing unit operatively senses a second light beam reflected by the at least portion of the movable part and generates a light sensing signal. The action recognition module is configured to operatively determine an action of the user according to the light sensing signal.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC comprises a first phase detection autofocus (PDAF) photodetector and a second PDAF photodetector in a substrate. A first electromagnetic radiation (EMR) diffuser is disposed along a back-side of the substrate and within a perimeter of the first PDAF photodetector. The first EMR diffuser is spaced a first distance from a first side of the first PDAF photodetector and a second distance less than the first distance from a second side of the first PDAF photodetector. A second EMR diffuser is disposed along the back-side of the substrate and within a perimeter of the second PDAF photodetector. The second EMR diffuser is spaced a third distance from a first side of the second PDAF photodetector and a fourth distance less than the third distance from a second side of the second PDAF photodetector.

Abstract: This application provides a structure of the optical sensor, in which a photosensitive element is arranged on a substrate, a colloid layer is arranged on the upper part of the substrate and covers the photosensitive element, and a thin film is further arranged. The device includes an adhesive layer and a light-transmitting layer, the adhesive layer is disposed above one of the colloid layers, the light-transmitting layer is disposed above one of the adhesive layers, and the structure can be used to provide the film member that can be changed according to requirements The optical design reduces the production cost of the optical sensor; this application further provides a shielding layer between the film member and the colloid layer to improve the photosensitive efficiency of the optical sensor.

Abstract: A light sensor module includes a substrate. A first detection region is provided on the substrate. At least one photosensitive device is provided inside the first detection region. The at least one photosensitive device is adapted to collecting first light sensor data from the first detection region under current incident light. The first light sensor data are used for determining whether light sensor data collected by the light sensor module under the current incident light are to be compensated.

Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member. The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.

Abstract: An optical filter (1a) includes a light-absorbing layer (10). The light-absorbing layer absorbs light in at least a portion of the near-infrared region. When light with a wavelength of 300 nm to 1200 nm is incident on the optical filter (1a) at incident angles of 0°, 30°, and 40°, the optical filter (1a) satisfies given transmittance requirements. IE?1/?2?1 to ?2, IAE?1/?2?1 to ?2, and ISE?1/?2?1 to ?2 defined by the following equations (1) to (3) for two incident angles ?1° and ?2° (?1<?2) selected from 0°, 30°, and 40° satisfy given requirements in a given domain of a wavelength ?.

Abstract: Systems, methods, and apparatus for determining a volume of remaining liquid in a container are disclosed. A container profile can first be developed using image analysis to determine a maximum liquid level in the container. The profile can then be broken into divisions, each corresponding to an equal volume. When real-world measurements of a liquid level in a real-world container are made, these can be translated to one of the divisions, which can be summed with all underlying divisions to estimate a volume of remaining liquid in the real-world container.

Abstract: Methods, systems, and apparatus, for a stray-light testing station. In one aspect, the stray-light testing station includes an illumination assembly including a spatially extended light source and one or more optical elements arranged to direct a beam of light from the spatially extended light source along an optical path to an optical receiver assembly including a lens receptacle configured to receive a lens module and position the lens module in the optical path downstream from the parabolic mirror so that the lens module focuses the beam of light from the spatially extended light source to an image plane, and a moveable frame supporting the optical receiver assembly including one or more adjustable alignment stages to position the optical receiver assembly relative to the illumination assembly such that the optical path of the illumination assembly is within a field of view of the optical receiver assembly.