Patents Examined by John S. V. Chu
  • Patent number: 5494785
    Abstract: A phenolic novolak composition prepared by a process comprising the steps of:(1) reacting a first phenolic monomer comprising a major portion of at least one trifunctional phenolic monomer with a first aldehyde source in the absence of a catalyst at a reaction temperature from about 100.degree. C. to about 200.degree. C. and at a reaction pressure of about 2 to about 15 atmospheres to form a phenolic oligomer having a weight average molecular weight from about 500 to about 2,000, having ortho-ortho bonding of about 55% to about 75% of the methylene bonds between the phenolic moieties; and having a time to clear of less than 125 seconds per micron; wherein the mole ratio of said first aldehyde source to said first phenolic monomer is from about 0.3:1.0 to about 0.55:1.0; and(2) then reacting said oligomer with an optional second phenolic source and a second aldehyde source at a temperature from about 80.degree. C. to about 150.degree. C.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: February 27, 1996
    Assignee: OCG Microelectronic Materials, Inc.
    Inventors: Joseph J. Sizensky, Thomas R. Sarubbi, Medhat A. Toukhy
  • Patent number: 5468589
    Abstract: A resist composition comprising (a) a polymer having at least repeating units of the formulae: ##STR1## (b) a photoacid generator and (c) a solvent, has high sensitivity to light, excellent heat resistance, adhesiveness to a substrate and suitable for pattern formation with high resolution.
    Type: Grant
    Filed: June 15, 1992
    Date of Patent: November 21, 1995
    Assignees: Wako Pure Chemical Industries, Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Fumiyoshi Urano, Hirotoshi Fujie, Keiji Oono, Takaaki Negishi
  • Patent number: 5456996
    Abstract: A positive resist composition which comprises, in admixture, a photosensitive 1,2-quinone diazide compound, an alkali-soluble resin to bind ingredients and polyphenol compound to control a dissolution rate in a developer having a molecular weight of not more than 550 and represented by the general formula: ##STR1## wherein a, b, c, d, e, and f are the same or different and a number of 0-3, provided that d+f is not less than 1, and provided that if b, d and f are 1, then at least one of a, c, and e is not 0; R.sub.1, R.sub.2 and R.sub.3 are the same or different and a C.sub.1 -C.sub.18 alkyl group, a C.sub.1 -C.sub.18 alkoxy group, a carboxyl group or a halogen atom; R.sub.4 is a hydrogen atom, a C.sub.1 -C.sub.
    Type: Grant
    Filed: April 7, 1994
    Date of Patent: October 10, 1995
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Haruyoshi Ozaki, Fumio Oi, Yasunori Uetani, Makoto Hanabata, Takeshi Hioki
  • Patent number: 5447825
    Abstract: A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, as the main components, wherein the alkali-soluble resin is a polycondensation product of 1 at least one phenolic compound of the following formula (A) and 2 (a) formaldehyde and (b) at least one ketone or aldehyde of the following formula (B), and the mixing ratio of the formaldehyde (a) to the ketone or aldehyde (b) is within a range of from 1/99 to 99/1 in terms of the molar ratio of (a)/(b): ##STR1## wherein R.sup.1 is a group of the formula R.sup.2,OR.sup.3,COOR.sup.4 or CH.sub.2 COOR.sup.5,wherein R.sup.2 is a C.sub.1-4 alkyl group, each of R.sup.3,R.sup.4 and R.sup.5 which are independent of one another, is a hydrogen atom or a C.sub.1-4 alkyl group, n is an integer of from 0 to 3, provided that when n is 2 or 3, a plurality of R.sup.1 may be the same or different, and each of R.sup.6 and R.sup.7 which are independent of each other, is a hydrogen atom, a C.sub.
    Type: Grant
    Filed: August 31, 1994
    Date of Patent: September 5, 1995
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Mineo Nishi, Koji Nakano, Yoshihiro Takada