Patents Examined by John W Hatch
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Patent number: 11981073Abstract: The present invention addresses the problem of providing a powder material that has good wettability with respect to an aqueous solvent and that can be applied to a method for producing a three-dimensional molded object in which a bonding fluid and a peeling fluid are applied. In order to solve the abovementioned problem, a powder material according to the present invention is used in a method for a producing a three-dimensional molded object that includes formation of a thin layer containing the powder material, application of a bonding fluid containing an aqueous solvent and an energy-absorbing agent to the thin layer, and irradiation of the thin layer with energy. The powder material contains molding particles comprising: resin particles containing a thermoplastic resin; and an organic resin layer that is arranged around the resin particles and that contains an organic resin having a surface tension of 30-45 mN/m.Type: GrantFiled: December 6, 2018Date of Patent: May 14, 2024Assignee: KONICA MINOLTA, INC.Inventor: Kazuya Isobe
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Patent number: 11982938Abstract: The present disclosure provides an imprint template, including: a base substrate, a pattern layer for imprinting and a planarization layer; wherein the planarization layer is located on a surface of the pattern layer facing away from the base substrate, and a surface of the planarization layer facing away from the base substrate is a plane; and the planarization layer and the pattern layer are configured such that under a specific film removing process, the planarization layer is removed while the pattern layer remains. The present disclosure further provides a preparation method of an imprint template, and an imprint method.Type: GrantFiled: October 17, 2019Date of Patent: May 14, 2024Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Wei Tan, Kang Guo, Xin Gu
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Patent number: 11969946Abstract: An additive manufacturing system comprising: an additive manufacturing device, said device including: a resin vessel for containing a material which is polymerisable on exposure to radiation; a build platform having a build surface arranged to have an object manufactured thereon; a radiation source; said radiation source positioned to irradiate uncured material on said build surface to manufacture the object; said device in wireless communication with a central station; said central station arranged to process data to create manufacturing files; said central station arranged to communicate said files to said device such that the device manufactures the object based upon said files.Type: GrantFiled: February 12, 2019Date of Patent: April 30, 2024Assignee: Structo Pte. Ltd.Inventors: Hubertus Theodorus Petrus Van Esbroeck, Boyle Suwono, Harsh Gupta
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Patent number: 11897187Abstract: A method of additive manufacturing of a three-dimensional object includes sequentially dispensing and solidifying a plurality of layers. The plurality of layers may be formed with a plurality of different colored model materials, a flexible material arranged in a configured pattern to form a sacrificial structure at least partially encompassing the object, and a soft material. The soft material is arranged in a configured pattern to provide separation between the model material and the sacrificial structure. The plurality of different colored model materials is arranged in a configured pattern corresponding to the shape and color definition of the object.Type: GrantFiled: June 28, 2020Date of Patent: February 13, 2024Assignee: Stratasys Ltd.Inventors: Mayan Rumbak, Eduardo Napadensky, Gavish Mida
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Patent number: 11899360Abstract: An imprinting method includes placing a template onto non-solidified resin that is applied onto a surface of a substrate, such that the non-solidified resin extends into a pattern of the template in a surface direction of the substrate, starting first alignment operation to align the template with the substrate using a first alignment mark at a first timing, and starting a second alignment operation to align the template with the substrate using a second alignment mark at a second timing after the first timing. The first timing is when the non-solidified resin has extended into the first alignment mark and not yet into the second alignment mark. The second timing is when the non-solidified resin has extended into the first and second alignment marks.Type: GrantFiled: March 3, 2020Date of Patent: February 13, 2024Assignee: Kioxia CorporationInventors: Masaki Mitsuyasu, Kazuya Fukuhara
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Patent number: 11886110Abstract: An imprinting apparatus includes a silicon master and an anti-stick layer coating the silicon master. The silicon master includes a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features comprises a depression having an opening with its largest opening dimension being less than about 300 nm. The anti-stick layer includes a crosslinked silane polymer network.Type: GrantFiled: March 23, 2021Date of Patent: January 30, 2024Assignee: Illumina, Inc.Inventors: Timothy J. Merkel, Ruibo Wang, Daniel Wright, Danny Yuan Chan, Avishek Aiyar, Tanmay Ghonge, Neil Brahma, Arthur Pitera
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Patent number: 11874599Abstract: Provided is a method of providing a patterned layer (50). The method comprises providing (2, 3A, 3B) a substrate (10) having a surface (11) to which a compound is applied. The compound has at least one condensable group which is reactive with surface groups on the surface of the substrate by condensation reaction. The compound also has a basic group for accepting protons. A layer of a polycondensable imprinting composition (30) is applied (4) onto the layer of the compound. The imprinting composition layer is imprinted (5A, 5B, 5C) with a patterned stamp. During the imprinting, polycondensation of the imprinting composition leads to forming of the patterned layer. Further provided is the patterned layer itself, as well as an optical element and an etch mask, each of which comprises the patterned layer.Type: GrantFiled: June 16, 2021Date of Patent: January 16, 2024Assignee: Koninklijke Philips N.V.Inventor: Marcus Antonius Verschuuren
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Patent number: 11833722Abstract: A resin molding apparatus includes: a first molding mold provided with a first member and a second member configured to move relative to the first member, and configured to form a cavity by the first member and the second member; a second molding mold configured to hold a substrate; and a mask member so as to be relatively immovable with respect to the first member, configured to make contact with a portion of the substrate when the first molding mold and the second molding mold are clamped, and formed with a flow portion through which a resin material existing in the cavity and pressurized by the second member is capable of flowing.Type: GrantFiled: August 20, 2021Date of Patent: December 5, 2023Assignee: Towa CorporationInventors: Hayato Yasui, Yohei Onishi, Hitoshi Okazaki
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Patent number: 11833719Abstract: An imprint apparatus that performs an imprint process for bringing a protruding portion of a mold into contact with a composition on a substrate is provided. The apparatus comprises a first illuminator configured to emit light for curing the composition, a second illuminator including a scanner configured to scan beam-like light for curing the composition, and a controller configured to control exposure such that in a state where the composition and the protruding portion are in contact with each other, the light from the first illuminator is emitted to the composition at a position corresponding to a first region of the protruding portion, and control the scanner such that the light from the second illuminator is emitted to the composition at a position corresponding to a second region different from the first region of the protruding portion.Type: GrantFiled: October 20, 2020Date of Patent: December 5, 2023Assignee: Canon Kabushiki KaishaInventor: Kenji Yoshida
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Patent number: 11835854Abstract: An imprint device includes a load port for receiving a substrate to be processed, a sensor that acquires information from the substrate about a film on the substrate, and a primer forming unit configured to receive the substrate from the load port. A controller is configured to select primer process conditions corresponding to the film information. The primer forming unit receives primer process conditions from the controller and forms a primer layer on the substrate over the film. The primer layer is formed according to the selected process conditions. An imprinting unit of the imprint device is configured to receive the substrate from the primer forming unit and perform imprint lithography on the substrate.Type: GrantFiled: February 18, 2020Date of Patent: December 5, 2023Assignee: KIOXIA CORPORATIONInventors: Kasumi Okabe, Hirokazu Kato, Kei Kobayashi, Daizo Muto
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Patent number: 11835855Abstract: An imprint apparatus that performs an imprint process of forming a pattern on a shot region of a substrate using a mold is provided. The apparatus comprises a mold holder for holding the mold, and a deformation mechanism for deforming a pattern region of the mold held by the mold holder. Based on a response property of the mold when the force is applied to the mold by the deformation mechanism, a setting load is applied to the mold by the deformation mechanism before the mold and the imprint material are brought into contact with each other, and the pattern region of the mold is deformed by the deformation mechanism, after the mold and the imprint material have been brought into contact with each other, so as to reduce an overlay error between the shot region and the pattern region.Type: GrantFiled: August 2, 2021Date of Patent: December 5, 2023Assignee: CANON KABUSHIKI KAISHAInventor: Satoshi Iino
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Patent number: 11822234Abstract: The present invention provides an imprint apparatus for performing imprint processing of forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus including a forming unit including an outlet configured to blow out a gas towards the substrate side from the mold side and configured to form, by the gas, an air flow that surrounds a space between the mold and the substrate, and a control unit configured to control the forming unit when the imprint processing is consecutively performed on a plurality of shot regions on the substrate after an uncured imprint material has been supplied thereto.Type: GrantFiled: July 14, 2020Date of Patent: November 21, 2023Assignee: CANON KABUSHIKI KAISHAInventors: Shinichi Shudo, Toshiaki Suzuya
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Patent number: 11822236Abstract: The present invention provides a mold including a pattern to be transferred to an imprint material on a substrate using an imprint apparatus, the mold including: a pattern region in which the pattern is arranged; and a peripheral region surrounding the pattern region and configured to shield light, wherein the pattern region includes a first portion, which is arranged with a mark used to measure a relative position with respect to a substrate mark provided on the substrate and through which an image of the substrate mark passes, and a second portion through which an image of a stage mark provided on a stage holding the substrate passes.Type: GrantFiled: May 12, 2022Date of Patent: November 21, 2023Assignee: CANON KABUSHIKI KAISHAInventors: Tomomi Funayoshi, Atsushi Kimura, Hiroshi Sato
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Patent number: 11813775Abstract: This concerns a screw pump for the extrusion of plastic materials, which is extremely compact and so it can be inserted in-line in a plastic material filtration system, encapsulating within it a duct parallel to the axis of the screw.Type: GrantFiled: July 16, 2021Date of Patent: November 14, 2023Inventor: Erica Canaia
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Patent number: 11780115Abstract: Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.Type: GrantFiled: November 24, 2020Date of Patent: October 10, 2023Assignee: Corning IncorporatedInventors: Samir Biswas, Memduh Volkan Demirbas, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller
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Patent number: 11752679Abstract: A honeycomb extrusion die (120) includes a die body (302) including an inlet face (306) and an exit face. The die body (302) has slot inlets (309) and a plurality of pins (320, 500) disposed between the slot inlets (309) and the exit face. The plurality of pins (320, 500) include side surfaces (322, 500B) configured to define a matrix of intersecting slots (324), wherein the matrix of intersecting slots (324) has slot exit (509) widths at the exit face. Divots (526) extend into a plurality of the side surfaces (322, 500B) between the slot inlets (309) and the exit face. Each individual divot (526) has a divot depth (D55) extending into a side surface (500A, 500B, 502A, 502B) of the side surfaces (322, 500B). A ratio between a slot exit width (W53) W53 of an individual slot (324) and the divot depth (D55) of an individual divot (526) extending into a side surface (500A, 500B, 502A, 502B) of the individual slot (324) is greater than 1.2.Type: GrantFiled: May 30, 2019Date of Patent: September 12, 2023Assignee: Corning IncorporatedInventors: Thomas William Brew, Yuehao Li, Min Shen
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Patent number: 11669010Abstract: An ejection material ejecting device includes: an ejection unit including an ejection opening configured to eject an ejection material; an electric substrate configured to control ejection of the ejection material; a first flexible cable connected to the ejection unit; a second flexible cable connected to the electric substrate; and a joint at which the first flexible cable and the second flexible cable are joined by an anisotropic conductive film, wherein the joint is covered with a sealant resistant to the ejection material.Type: GrantFiled: March 18, 2020Date of Patent: June 6, 2023Assignee: CANON KABUSHIKI KAISHAInventors: Masahiro Kuri, Noriyasu Hasegawa
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Patent number: 11654606Abstract: The invention relates to a cooling apparatus and a method for cooling a continuous strip, wherein the cooling apparatus comprises a cooling drum and a guiding device for guiding the strip in a plurality of windings around the cooling drum, wherein the guiding device comprises first and second guiding elements, wherein each one of the first guiding elements forms a set with one of the second guiding elements, wherein the first guiding element of the set receives the strip from a first winding in a first winding direction and directs the strip in a first transition direction towards the second guiding element which receives the strip in a second transition direction and directs the strip into a consecutive winding in a second winding direction, wherein the first transition direction is different from the first winding direction and the second transition direction is different from the second winding direction.Type: GrantFiled: November 19, 2018Date of Patent: May 23, 2023Assignee: VMI HOLLAND B.V.Inventors: Theodorus Gijsbertus Gerardus Teunissen, Willen Marinus Van Beek
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Patent number: 11590688Abstract: An imprinting apparatus includes an imprinting platform, an imprinting roller, a transfer module and a lifting and pressing mechanism. The imprinting roller is disposed above the imprinting platform. The transfer module includes a transfer film, wherein the transfer film is located between the imprinting roller and the imprinting platform. The lifting and pressing mechanism is linked with the imprinting roller, wherein the lifting and pressing mechanism drives the imprinting roller to move along a normal direction of the imprinting platform and selectively pressurizes the imprinting roller.Type: GrantFiled: August 29, 2021Date of Patent: February 28, 2023Assignee: HIMAX TECHNOLOGIES LIMITEDInventors: Ruei Yu Weng, Han-Yi Kuo, Yin-Tung Lu, Jui Pin Tsai
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Patent number: 11584095Abstract: This flexible mandrel for molding a composite material containing a thermosetting resin includes: a main body containing a first material; and a thermally conductive layer containing a second material having a higher thermal conductivity than the first material, the thermally conductive layer being formed so as to cover at least a portion of the main body. The thermally conductive layer extends from a contacting surface of the flexible mandrel, which comes into contact with the composite material during molding, to a non-contacting surface which does not come into contact with the composite material.Type: GrantFiled: July 13, 2018Date of Patent: February 21, 2023Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Takayuki Shimizu, Akihisa Okuda, Ryota Ozaki, Shoya Mano, Masahiko Shimizu