Patents Examined by Joselito S. Baisa
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Patent number: 10930422Abstract: A power electronics device includes one or more electrical windings included in an insulating substrate. A cavity and a channel connected to the cavity are also included in the insulating substrate, and a magnetic core is located in the cavity. The device also includes primary and secondary side electrical components located on first and second regions of a principal surface of the insulating substrate. An isolation region is located on the principal surface of the insulating substrate between the first and second regions, and the channel extends from the cavity to a first channel opening at an outside edge of the insulating substrate such that, when viewed along a thickness direction of the insulating substrate, the isolation region completely overlaps the first channel.Type: GrantFiled: April 27, 2017Date of Patent: February 23, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Lee Francis
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Patent number: 10930425Abstract: An inductor may include a body and external electrodes on respective external surfaces of the body. The body may include a support member, an insulator on the support member and including a first opening, a coil in the first opening, and a thin film conductor layer between the coil and the support member. The thin film conductor layer may include a second opening, and one or both of its end portions may be between the support member and the insulator.Type: GrantFiled: May 7, 2018Date of Patent: February 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Young Sun Kim
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Patent number: 10930420Abstract: A coil component includes a magnetic body part and a coil part. The magnetic body part has first and second magnetic layers stacked together alternately in one axis direction, and cover parts covering the first and second magnetic layers from the one axis direction. The coil part has conductor patterns provided on the second magnetic layers. The magnetic body part includes: oblate soft magnetic grain-containing layers extending over the entire range of the magnetic body part in the direction perpendicular to the one axis direction, exposed in the direction perpendicular to the one axis direction, and formed by oblate soft magnetic grains whose thickness direction is oriented in the one axis direction; and spherical grain-containing layers adjoining the oblate soft magnetic grain-containing layers in the one axis direction, and formed by insulative spherical grains.Type: GrantFiled: November 30, 2017Date of Patent: February 23, 2021Assignee: TAIYO YUDEN CO., LTD.Inventors: Masahiro Hachiya, Hitoshi Matsuura, Takayuki Arai, Shuhei Kurahashi, Hideo Machida, Hidekazu Teshigawara, Naoya Honmo
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Patent number: 10923259Abstract: A coil component includes a body, a coil disposed inside of the body and forming one coil track when being viewed in a laminated direction, external electrodes disposed on an outer surface of the body. The coil track includes corner portions and linear portions connecting the respective corner portions to each other, and a line width of the corner portion is greater than that of the linear portion.Type: GrantFiled: April 21, 2017Date of Patent: February 16, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Ki Jung, Su Bong Jang, Sang Jong Lee
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Patent number: 10923267Abstract: An electrical transformer comprises a primary circuit extending between two ends. The primary circuit has at least one of the ends thereof connected with a power supply so that a first electrical current from the power source flows through the primary circuit. A secondary circuit is connected with an electrical load. The first and second circuits each have a respective plurality of wire segments having a length and being connected in series. The wire segments are supported so as to extend in pathways adjacent and parallel to each other over the length thereof so that, when viewed in cross section, the wire segments are arranged around a first point with the wires of the primary circuit alternating with the wires of the secondary circuit. The current in the first circuit causes formation of a second electrical current in the secondary circuit that is transmitted to the load.Type: GrantFiled: April 7, 2015Date of Patent: February 16, 2021Inventors: Yaroslav Andreyevitch Pichkur, Dmytro Pichkur
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Patent number: 10910138Abstract: The present invention relates to gas-insulated electrical apparatuses, in particular gas-insulated transformers or reactors, comprising a housing enclosing an interior space, in which an electrical component comprising a winding is arranged, at least a portion of the interior space defining an insulation space which is filled with an insulation fluid electrically insulating at least a part of the electrical component from the housing. According to the invention, the electrical apparatus further comprises a cooling element comprising a condenser, an evaporator and a cooling fluid to be circulated between the condenser and the evaporator. The evaporator is designed such that at least a part of the electric component is immersed in the cooling fluid in its liquid state, thus being in direct contact with the cooling fluid.Type: GrantFiled: June 9, 2017Date of Patent: February 2, 2021Assignee: ABB Power Grids Switzerland AGInventors: Stephan Schnez, Vincent Dousset, Roberto Zannol, Rebei Bel Fdhila
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Patent number: 10910143Abstract: A winding-type coil component includes a first wire and a second wire having a twisted wire portion where the first wire and the second wire are twisted together. Switching positions of the first wire and the second wire in the twisted wire portion are shifted in a circumferential direction of a winding core portion every turn.Type: GrantFiled: December 4, 2017Date of Patent: February 2, 2021Assignee: Murata Manufacturing Co., Ltd.Inventors: Kohei Kobayashi, Ryota Hashimoto, Hiroyuki Tei, Chihiro Yamaguchi
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Patent number: 10892085Abstract: According to some aspects of the present disclosure, circuit board assemblies and methods of circuit board assembly are disclosed. Example circuit board assemblies include a circuit board and a magnetic component coupled to the circuit board. The magnetic component includes a primary winding and a secondary winding. The assembly also includes a winding interconnect terminal electrically coupled to the magnetic component. The winding interconnect terminal is disposed on the circuit board remote from the magnetic component, and the circuit board defines an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the magnetic component. Corresponding methods of assembling circuit boards and magnetic components are also disclosed.Type: GrantFiled: December 5, 2017Date of Patent: January 12, 2021Assignee: Astec International LimitedInventor: Kwong Kei Chin
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Patent number: 10878992Abstract: The electronic component includes an element body having a mounting surface, an upper surface opposing the mounting surface, a first side surface, and a second side surface adjacent to the first side surface, and an outer conductor including a first portion extending along the first side surface and embedded in the element body so as to be exposed from the first side surface. The element body has a first chamfered portion at a corner portion connecting the upper surface and the first side surface, and a length of the first chamfered portion is longer than a thickness of the first portion of the outer conductor in a direction substantially orthogonal to the first side surface.Type: GrantFiled: July 21, 2017Date of Patent: December 29, 2020Assignee: Murata Manufacturing Co., Ltd.Inventor: Yasunari Nakashima
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Patent number: 10854383Abstract: A coil electrode component includes a body including magnetic metal material, a coil disposed in the body and having first and second lead parts respectively outwardly exposed through first and second surfaces of the body. A first plating electrode is formed on the first surface of the body and a further surface of the body connected to and extended from the first surface of the body, and connected to the first lead part. A second plating electrode is formed on the second surface of the body and a further surface of the body connected to and extended from the second surface of the body, and connected to the second lead part.Type: GrantFiled: October 30, 2015Date of Patent: December 1, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Min Sung Choi
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Patent number: 10847299Abstract: A structure comprises a first portion of a winding having a first almost enclosed shape, a second portion of the winding having a second almost enclosed shape and a connection element between the first portion and the second portion, wherein the first portion and the second portion are arranged in a symmetrical manner and the first portion, the second portion and the connection element form a first air core inductor.Type: GrantFiled: October 26, 2016Date of Patent: November 24, 2020Assignee: Quanten Technologies LimitedInventors: Hengchun Mao, Bo Yang
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Patent number: 10840003Abstract: The present disclosure envisages an arrangement for maintaining desired temperature conditions on and within a transformer housing of an encapsulated transformer. The arrangement comprises at least one insulation plate disposed proximal to a transformer core and coil assembly of the encapsulated transformer such that the insulating element is in surface contact with a potting compound of the encapsulated transformer and adapted to substantially contain the heat emanating from the transformer core and coil assembly, thereby maintaining desired temperature conditions on and within the transformer housing.Type: GrantFiled: September 14, 2015Date of Patent: November 17, 2020Assignee: Appleton Grp LLCInventors: Ajit Dilip Athavale, Dale Charles Corel
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Patent number: 10825598Abstract: A planar magnetic element includes a pair of cores, a first winding layer disposed between the pair of cores and including a first winding coupled between a first terminal and a second terminal, and a plurality of second winding layers disposed between the pair of cores and including second windings coupled between a third terminal and a fourth terminal, wherein the first winding layer may be disposed between the plurality of second winding layers.Type: GrantFiled: May 3, 2016Date of Patent: November 3, 2020Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Bonggeun Chung, SangCheol Moon, Gwanbon Koo
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Patent number: 10748700Abstract: A coil structure has a coil 150 including conductors, and insulating sheets 100 provided between the conductors included in the coil 150. Two or more insulating sheets 100 are provided. The two or more insulating sheets 100 have two or more types of insulating sheets 100 having at least different thermal conductivity or different permittivity.Type: GrantFiled: May 31, 2016Date of Patent: August 18, 2020Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.Inventors: Kosuke Ikeda, Yoshiaki Hiruma
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Patent number: 10734152Abstract: A coil component includes a body having a coil part disposed therein and an external electrode connected to the coil part. The body includes magnetic particles, and the magnetic particles include first magnetic particles, second magnetic particles, and third magnetic particles. A diameter of each of the first, second, and third magnetic particles is different from each other.Type: GrantFiled: January 13, 2016Date of Patent: August 4, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han Wool Ryu, Byoung Hwa Lee
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Patent number: 10650959Abstract: A magnetic component has a variable inductance over a range of DC bias currents. The component includes a bobbin with a coil positioned around a passageway between first and second end flanges. First and second E-cores (either conventional or EFD E-cores) have respective middle legs positioned in the passageway with end surfaces of the middle legs juxtaposed within the passageway and spaced apart by a first magnetic gap. An I-bar is positioned in the passageway parallel to and spaced apart from respective first longitudinal surfaces of the middle legs to form a second magnetic gap between the I-bar and the longitudinal surface of the middle leg of the first E-core and to form a third magnetic gap between the I-bar and the longitudinal surface of the middle leg of the second E-core. The magnetic component provides higher inductances for lower bias currents and provides lower inductances for higher bias currents.Type: GrantFiled: October 24, 2017Date of Patent: May 12, 2020Assignee: Universal Lighting Technologies, Inc.Inventors: Donald Folker, Mike LeBlanc, Thomas M. Poehlman
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Patent number: 10600555Abstract: A device is provided that includes a core having a first end and a second end, and first and second wires wound around the core so as to cross each other on the core to form a cross point. The a winding structure of an ith turn of the first and second wires counting from the cross point toward the first end, and a winding structure of an ith turn of the first and second wires counting from the cross point toward the second end, are substantially symmetrical about the cross point.Type: GrantFiled: April 14, 2017Date of Patent: March 24, 2020Assignee: TDK CORPORATIONInventors: Toshio Tomonari, Tsutomu Kobayashi, Kazunori Arimitsu, Yuma Komaya
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Patent number: 10553338Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: GrantFiled: December 6, 2018Date of Patent: February 4, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Patent number: 10531573Abstract: An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.Type: GrantFiled: October 28, 2016Date of Patent: January 7, 2020Assignee: XFMRS, Inc.Inventors: Tung Kong Luk, Yu kun Liao
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Patent number: 10529483Abstract: A resonant transformer with adjustable leakage inductance includes a secondary winding group, a primary winding group, a magnetic sheet and a core group. The primary winding group is provided on a bobbin of the secondary winding group, and the magnetic sheet is provided in the bobbin. The secondary winding group, the primary winding group and the magnetic sheet include a first through hole, a second through hole and a through hole, respectively. The core group includes a first core and a second core symmetrically disposed, which are disposed on top of and at the bottom of the primary winding group, respectively. During operation of the resonant transformer, the degree of coupling between the primary and secondary sides can be changed using the magnetic sheet. This allows the native leakage inductance to be altered to satisfy demands for various different resonant frequencies.Type: GrantFiled: April 26, 2017Date of Patent: January 7, 2020Assignee: Yujing Technology Co., Ltd.Inventor: Sen-Tai Yang