Patents Examined by Kamand Cuneo
  • Patent number: 7128465
    Abstract: A clock is disclosed including a clock body, a clock drive mechanism mounted on the clock body, an hour hand and a minute hand driven by the clock drive mechanism, and a pendulum driven by the clock drive mechanism. The clock body has a front surface, a perimeter, and a back surface that are shaped to resemble a musical instrument. The pendulum resembles a feature of the musical instrument.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: October 31, 2006
    Inventors: Paul T. Neumann, James W. Woodhouse
  • Patent number: 7130194
    Abstract: A transceiver module including a primary printed circuit board and a secondary printed circuit board in an enclosure is presented. The primary printed circuit board is coupled to the secondary printed circuit board by a connector pin that protrudes out of a critical surface of the enclosure. The printed circuit boards may be positioned substantially parallel to the critical surface of the enclosure. When a transmitter is electrically connected to the primary printed circuit board and a receiver is electrically connected to the secondary printed circuit board, the transmitter and the receiver may be positioned in a plane that is also substantially parallel to the plane of the critical surface.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: October 31, 2006
    Assignee: Finisar Corporation
    Inventors: Chris K. Togami, Stephan C. Burdick, Stephen C. Gordy
  • Patent number: 7129417
    Abstract: A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: October 31, 2006
    Assignee: International Business Machines Corporation
    Inventors: Todd Arthur Cannon, William James Csongradi, Jr., Benjamin Aaron Fox, Roger John Gravrok, Mark Kenneth Hoffmeyer, David Lawrence Pease, Ryan James Schlichting
  • Patent number: 7129425
    Abstract: A vertical load measurement device and a method for measuring a load at least partially supported by an axle of a railcar are disclosed. The measurement device includes a bearing adapter sized to be mounted between a load bearing member of the railcar and an axle bearing housing of the railcar. The beam member has a first end and a second end, at least one end being secured to the bearing adapter, and a midsection extending between the ends which supports the load applied by the load bearing member of the railcar. The midsection of the beam member is vertically spaced from the bearing adapter to allow deflection of the beam member in response to the load applied by the load bearing member. The vertical load measurement device also includes a sensor secured to the beam member which measures the deflection of the beam member.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: October 31, 2006
    Assignee: ENSCO, Inc.
    Inventors: Gary A. Carr, Daniel J. Fullum, William L. Jordan
  • Patent number: 7129418
    Abstract: A suspension board with circuit permits a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and a production method thereof. After an insulating base layer is formed on a suspension board in a specific pattern in which a second opening is formed, a thin metal film is formed on the insulating base layer and on the suspension board including the second opening exposed from the insulating base layer. A conductor layer is formed in the form of a wired circuit pattern on the thin metal film. An insulating cover layer is formed with a pad opening therein, and a pad portion formed in the pad opening using the suspension board as a lead portion of the electrolysis plating. A first opening larger than the second opening is formed in the suspension board at a portion thereof corresponding to the second opening.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: October 31, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Hidenori Aonuma, Yasuhito Ohwaki
  • Patent number: 7129416
    Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: October 31, 2006
    Assignee: Apple Computer, Inc.
    Inventors: Robert Steinfeld, Cheung-Wei Lam
  • Patent number: 7129427
    Abstract: A balance (1) with a housing (3) containing the weighing mechanism and associated electronic components has at least three positioning feet (5, 5?) to stand on a supporting surface (20), at least two of the positioning feet (5) being height-adjustable for setting the balance (1) into a level position. In addition, the balance (1) has at least one stabilizer foot (6, 106) which can be locked and unlocked, so that for adjusting the level position of the balance, the stabilizer foot is released and thereby enabled to stay in contact with the supporting surface (20), and after the level adjustment of the balance has been completed, the stabilizer foot is locked in place to secure the stability of the balance (1) in its set position.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: October 31, 2006
    Assignee: Mettler-Toledo AG
    Inventors: Beat Meister, Roger Leisinger
  • Patent number: 7130198
    Abstract: A protection circuit module for rechargeable batteries includes a substrate, electronic components mounted on the obverse surface of the substrate for forming a protection circuit for rechargeable batteries, a housing mounted on the obverse surface of the substrate and including a top wall partially defining an enclosure for accommodating the electronic components, and a resin sealer loaded in the enclosure of the housing for sealing the electronic components. The top wall of the housing includes an opening for loading the resin sealer into the housing.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: October 31, 2006
    Assignee: Rohm Co., Ltd.
    Inventor: Naoya Tanaka
  • Patent number: 7130200
    Abstract: A PCI card-securing mechanism includes an external housing and a securing component. The external housing has a frame and a receiving plate extending upwardly from the frame. The frame forms with a plurality of slit ports for exposing the PCI card. The receiving plate has a pair of guiding grooves parallel to the slit ports and a pair of assembling slots formed on a top edge thereof. The securing component has a main portion forming a pair of setting bridges, a pair of pulling parts extending outwardly from a top edge of the main portion and a pressing plate bent from a bottom edge of the main portion. The pair of setting bridges are slidably assembled in the pair of guiding grooves, respectively. The pulling parts are disposed in the assembling slots, respectively. The pressing plate presses an edge of the frame to fix the PCI card.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: October 31, 2006
    Assignee: Lite-On Technology Corporation
    Inventor: Yung-Lung Liu
  • Patent number: 7126828
    Abstract: A card retention system comprises a chassis and a bracket provided to secure to the chassis by a first retention member. The first retention member is selectively oriented in one of a first position and a second position. The first position limits lateral movement of the bracket. The second position limits lateral and vertical movement of the bracket. A second retention member may also be provided on the chassis to resiliently engage the bracket to limit vertical movement of the bracket on the chassis.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: October 24, 2006
    Assignee: Dell Products L.P.
    Inventors: Christopher S. Beall, Alex Z. Rodriguez
  • Patent number: 7126881
    Abstract: The present invention relates to a timepiece device, and more particularly to a timepiece device having a customized dial. The timepiece device has a housing and a face plate attached to the housing. The face plate has a peripheral rim which has a plurality of intermittently spaced lands. Each land is configured to provide a surface for receiving customized indicia. An outer cover which can be removed or opened to provide access to customize the face plate is provided.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: October 24, 2006
    Assignee: 8 Point 5 Concepts, Ltd.
    Inventors: Martin R. Cooper, Kimberly R. Taylor
  • Patent number: 7126827
    Abstract: In some embodiments, an electronics assembly may include a frame with a motherboard and a plurality of daughterboards. The frame may have an opening opposite the motherboard to allow insertion of the daughterboards into the frame or removal of the daughterboards from the frame. An injector/ejector mechanism for each daughterboard may be located on the daughterboard or the frame. The frame may further include a flange that extends along the frame at or adjacent to the opening and on which the injector/ejector mechanism of each daughterboard is attached or engages at different locations along the length thereof. The flange may be divided into separate sections that correspond to the different locations to allow the flange to flex at any location along the frame during insertion of a daughterboard without the flexing affecting the position of any adjacent location of the flange with respect to the motherboard.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: October 24, 2006
    Assignee: Sun Microsystems, Inc.
    Inventors: Jay Kevin Osborn, Sean Conor Wrycraft
  • Patent number: 7122746
    Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: October 17, 2006
    Assignee: Fujikura Ltd.
    Inventors: Reiji Higuchi, Shouji Itou, Osamu Nakao
  • Patent number: 7121833
    Abstract: A teaching clock for teaching the concept of elapsed time includes a clock face having a minute hand and an hour hand pivotally mounted to the clock face and an elapsed time indicator having an hour hand and a minute hand that move synchronously with the movement of the clock hands. The hour hand is connected to the minute hand such that pivotal movement of the minute hand about the clock face causes the hour hand to pivot synchronously therewith to designate a progression of hours of the day. The minute hand and hour hand are selectively positionable to display a time of day. The elapsed time display may include a releasable connection connected to the minute hand such that the elapsed time display resets to an initial or zero position upon release of the releasable connection whereby an elapsed time is shown by the elapsed time display between any two selected times of day shown by the minute hand and hour hand on the clock face.
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: October 17, 2006
    Assignee: World Class Learning Materials Inc.
    Inventors: Bruce B. Brown, Pui Yan Chan
  • Patent number: 7122745
    Abstract: A circuit board includes: a metallic plate having an opening; a flexible circuit board disposed on a first surface of the metallic plate; and a printed circuit board disposed in the opening of the metallic plate. The flexible circuit board is protruded to the opening of the metallic plate so that a part of the flexible circuit board is bonded to the printed circuit board. The printed circuit board includes a first land disposed on a first surface of the printed circuit board, which is disposed on the first surface of the metallic plate. The flexible circuit board includes a second land disposed on a first surface of the flexible circuit board, which is opposite to the metallic plate. The first and second lands are electrically connected each other with a connecting member.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: October 17, 2006
    Assignee: Denso Corporation
    Inventor: Kiyoshi Nakakuki
  • Patent number: 7120034
    Abstract: A method for reducing electromagnetic radiation between devices in electrical communication, including processing signals within a first device in a manner tending to reduce EMR, and electromagnetically isolating the processed signals prior to communicating the signals to a subsequent device.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: October 10, 2006
    Assignee: Thomson Licensing
    Inventors: Brian Jonathan Cromarty, Lawrence Charles Coan, Edward Allen Hall
  • Patent number: 7119285
    Abstract: A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: October 10, 2006
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Deok-heung Kim, Bong-hui Lee
  • Patent number: 7120033
    Abstract: An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: October 10, 2006
    Assignee: Siemens Aktiengesellschaft
    Inventors: Kurt Gross, Hans Rappl
  • Patent number: 7120029
    Abstract: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: October 10, 2006
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi, Junichiro Osako, Tamaki Wada
  • Patent number: 7120030
    Abstract: A housing structure for vehicle-mounted electronic equipment according to the present invention is superior in heat dissipation, water resistance, heat resistance and vibration resistance. An electronic substrate is temporarily fixed onto an annular circumferential wall part of a cover made of fire retardant resin, and connector contact pins are soldered to the electronic substrate. The electronic substrate is fixed and held between a heat-transfer base and the annular circumferential wall part with screws, and heat generated by a heating part on the electronic substrate is transferred to the base and dissipated. The annular circumferential wall part has an annular groove in which a sealant is inserted, and the base has an annular protrusion snapped into the annular groove.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: October 10, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Isao Azumi, Tetsushi Watanabe