Abstract: A populated printed wiring board (PWB) (100) and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB (102, 402) with exposed copper pads (302), coating the copper pads with an organic solderability preservative (OSP) (404), depositing a solder paste that includes lead-free solder on the OSP covered copper pads (406), placing components (408) and heating the PWB above a liquidous temperature of the lead-free solder in an air atmosphere (410). The process allows very close spacing of components and component leads while forming reliable solder joints to components that are mechanically stressed and components that have non-negligible planarity or coplanarity tolerances.

Abstract: In an electronic watch containing an electric battery assembly of large size, particularly a battery assembly including several batteries or accumulators (41, 42), the diameter of a removable cover (20) closing a large bottom opening of the back cover (14) of the watchcase is limited by the fact that the cover is provided with a bayonet fitting device having locking members (56) radially directed towards the interior. These locking members catch on a fixed support (22) having one or more housings for the battery assembly. They are arranged at the top of a substantially cylindrical annular portion (50) of the cover. A sealing gasket (52) is placed around this annular portion and compressed radially against a cylindrical surface (16) of the periphery of the opening in the back cover, which ensures water-resistance even if the bayonet fitting is not screwed all the way in. According to a variant, the cover can form the entire back cover of the case.

Abstract: The invention relates to a wrist device, particularly to a fastening mechanism of a cover part and a plastic body part of the wrist device. The fastening mechanism comprises a fastening structure, which in turn comprises a projecting grip structure extending at least partly into the body part, setting against a positioning surface of the body part, and blocked in relation to the mounting direction of the cover part to prevent the fastening structure from moving in a direction opposite to the mounting direction once the fastening structure has been pressed into the body part.

Abstract: The device for adjusting a time indicator includes a gear train (1), the kinematic chain of which includes a sliding pinion (2) driven by a driving wheel set (3). The sliding pinion drives a driven wheel set (4) when the driving wheel set rotates in a first direction (A) and disconnects from said driven wheel set when said driving wheel set (3) rotates in a second direction (B), opposite to the first direction. The shaft (6) that the sliding pinion (2) includes is engaged in a groove (7) having first (9) and second (12) end portions, at least the first end portion (9) of which is directed radially (R) to the driven wheel set (4).

Abstract: An adjustable watch crystal apparatus includes a watch body, a flexible lens having a changeable amount of curvature, and means for adjusting the amount of curvature of the flexible lens. The flexible lens is positioned upwardly adjacent a watch face for adjustably refracting light to make the watch face legible for a user with farsighted vision. The flexible lens includes top and bottom sides having convex configurations, an outer edge, and a center. The adjusting means includes a collar member attached to the watch body for retaining the flexible lens outer edge. In one embodiment, an adjustment screw controls the curvature of the flexible lens by moving the flexible lens center between adjacent-center and displaced-center configurations. In another embodiment, the collar member moves perpendicularly to the watch face to control the curvature of the flexible lens by moving the flexible lens outer edge between displaced-edge and adjacent-edge configurations.

Abstract: A high-frequency circuit comprises a substrate having an electronic component on an obverse side thereof, a first ground pattern formed on almost an entire reverse side of the substrate, a microstrip line formed on the obverse side of the substrate, and a bias line connected to the electronic component on the obverse side of the substrate and formed continuously on the obverse side and the reverse side of the substrate so as to cross the microstrip line on the reverse side of the substrate in plan view so as to supply a bias voltage to the electronic component, wherein the first ground pattern is formed so as to circumvent the bias line formed on the reverse side of the substrate, a portion of the first ground pattern that circumvents the bias line on the reverse side of the substrate is continuously formed on the obverse side of the substrate as a second ground pattern so as to divide the microstrip line in two parts, and a chip jumper is arranged to bridge the two divided parts of the microstrip line over t

Abstract: A computer system includes a chassis and a motherboard support system including a motherboard carrying at least one daughter card and slidably supported within the chassis. In one embodiment, the motherboard has a first connector and the system further includes a printed circuit board having a second connector, wherein the motherboard support system slides between a first position in which the connectors are connected and a second position in which the connectors are disconnected. In another embodiment, the system includes a component mounted to the chassis, wherein the motherboard support system is slidably supported within a plane between the component and the chassis. In one embodiment, an actuator is provided to slide the motherboard support system.

Abstract: An electronic circuit board having an optical wiring layer sandwiched between two electrical wiring layers. The optical wiring layer is structured to be a two-dimensional optical waveguide. An E/O device and an O/E device are provided in the optical wiring layer or at an interface between the optical wiring layer and the electrical wiring layer. A via piercing the optical wiring layer connects the two electrical wiring layers. It is possible to efficiently input and output light to and from an optical wiring layer.

Abstract: A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.

Abstract: An audio sound quality enhancer which provides a transparent sound quality, using solid-state devices, which has previously been available only in vacuum tube audio systems. The invention comprises at least one solid-state component in the audio signal path of an audio circuit, and at least one heat source configured to heat the solid-state components. The invention increases the sound quality of solid-state audio systems by increasing the temperature of the semiconductor components involved in sound production. By intentionally heating the semiconductor components of an audio system above standard operating temperatures, the invention delivers sound quality levels normally only associated with vacuum tube sound systems.

Abstract: A circuit arrangement (100) for controlling a first terminal and a second terminal of a preferably contactless integrated circuit, particularly for testing a CMOS circuit, tests a multitude of intergrated circuits simultaneously while using a low-cost structure. The circuit arrangement permits a simple write/read unit assigned to the integrated circuit, and enables the simultaneous testing of a multitude of integrated circuits using a low-cost structure.

Abstract: A non-contact type IC card includes an insulating film having first and second surfaces. A plane coil is arranged on the first surface of the film. A semiconductor element is arranged on the first surface of the film. The film has through holes which expose terminals of the plane coil and electrode terminals of the semiconductor element to the second surface of the film. A wiring pattern consisting of conductive paste is filled in the through holes and extends therebetween along the second surface of the film so that the terminals of the plane coil are electrically connected to the electrode terminals of the semiconductor element by means of the wiring pattern.