Abstract: After a development liquid on a substrate is washed away with a rinse liquid, the rotational speed of the substrate is reduced, so that a liquid layer of the rinse liquid is formed over a top surface of the substrate. Thereafter, the rotational speed of the substrate is increased. The increase in the rotational speed of the substrate causes a centrifugal force to be slightly greater than tension, thereby causing the liquid layer to be held on the substrate with the thickness thereof in its peripheral portion increased and the thickness thereof at the center thereof decreased. Then, gas is discharged toward the center of the liquid layer from a gas supply nozzle, so that a hole is formed at the center of the liquid layer. This causes tension that is balanced with a centrifugal force exerted on the peripheral portion of the liquid layer to disappear. Furthermore, the rotational speed of the substrate is further increased while the gas is discharged. Thus, the liquid layer moves outward from the substrate.

Abstract: A cold spray apparatus for applying a coating of particles to a substrate includes a nozzle assembly having a plurality of inner passages terminating at a common exit. The nozzle assembly includes a particle supply members in communication with the inner passages. The particle supply members supply the particles to flow and accelerate through the inner passages and out of the nozzle assembly via the common exit toward the substrate to be coated thereon. Furthermore, each inner passage includes a laser that emits a laser beam that is transmitted through the inner passage. The laser heats at least one of the particles and the substrate to promote coating of the substrate with the particles.

Abstract: At the time of initiating coating, when a first end of an ejecting port of a coating nozzle is located at one end of a peripheral edge of a wafer, the wafer and the coating nozzle are relatively moved by a moving mechanism while exposing a coating liquid from the ejecting port. During the coating, the wafer and the coating nozzle are relatively moved by the moving mechanism while the coating liquid ejected from the ejecting port is in contact with the wafer, to coat the coating liquid on the wafer. At the time of finishing the coating, when a second end of the ejecting port is located at the other end of the peripheral edge of the wafer, the wafer and the coating nozzle are relatively moved by the moving mechanism while exposing the coating liquid from the ejecting port.

Abstract: An apparatus and a method for controlling critical dimension (CD) of a circuit is provided. An apparatus includes a controller for receiving CD measurements at respective locations in a circuit pattern in an etched film on a first substrate and a single wafer chamber for forming a second film of the film material on a second substrate. The single wafer chamber is responsive to a signal from the controller to locally adjust a thickness of the second film based on the measured CD's. A method provides for etching a circuit pattern of a film on a first substrate, measuring CD's of the circuit pattern, adjusting a single wafer chamber to form a second film on a second semiconductor substrate based on the measured CD. The second film thickness is locally adjusted based on the measured CD's.

Abstract: The invention relates to a susceptor which is for the processing chamber of protective gas and vacuum high-temperature processing installations and consists of graphite or CFC, has a tunnel-like design, and can be closed by a cover at both its ends. The invention should allow the provision of a flexibly and modularly extendable susceptor that has a material-saving design and, in particular, uniform thermal expansion. This is achieved by virtue of the fact that said susceptor (1) consists of a plurality of modules (2) aligned one next to the other along a continuous tunnel, that each module (2) consists of a tubular section (3) and a base panel (4) fixed thereto, and that the end faces (5) between each pair of modules (2) are interconnected in a form-fitting manner.

Abstract: A coat forming apparatus 100 includes a droplet supply unit 110 and an active species supply unit 120. The droplet supply unit 110 is adapted to spray or drop a droplet for coat forming toward an object 116. The active species supply unit 120 is adapted to supply an active species to be brought into contact with the droplet moving from the droplet supply unit 110 toward the object 116. The coating is formed on a surface of the object 116 by the droplet that has been brought into contact with the active species.

Abstract: Disclosed is a method of providing a constant concentration of a metal-containing precursor compound in the vapor phase in a carrier gas. Such method is particularly useful in supplying a constant concentration of a gaseous metal-containing compound to a plurality of vapor deposition reactors.

Abstract: Apparatus for the production of an electric conductor provided with at least a layer of coating plastic material. The apparatus comprises: a head for the extrusion of an electric conductor; at least a main extruder having a first supply duct; at least an auxiliary extruder having a second supply duct; and a device for the selection and the diversion of the flows of coating plastic material. The selection and diversion device is provided, in turn, with at least a device for the exclusion of the auxiliary extruder; with a bypass duct between the first duct and the second duct; and with a flow-regulating diverter valve arranged in the intersection point between the first supply duct and a bypass duct connecting the first duct to the second duct.

Abstract: The present invention provides a deposition mask for forming a thin-pattern by depositing a deposition material on a substrate, the deposition mask includes: a thin plate-shaped magnetic metal member 1 in which a through-hole 4 having shape and dimensions greater than those of the thin-film pattern is provided at a position corresponding to the thin-film pattern; and a resin film 2 which is provided in close contact with one surface of the magnetic metal member 1 and in which an opening pattern 5 having shape and dimensions identical to those of the thin-film pattern is formed at a position corresponding to the thin-film pattern in the through-hole 4, the resin film 2 being permeable to visible light. The opening pattern 5 is provided within an opening pattern formation region 7 surrounded by a deposition shadow region 6 defined by the thickness of the magnetic metal member 1 and the maximum angle of incidence of the deposition material to the film surface in the through-hole 4.

Abstract: A powder coating apparatus includes an applying device that includes a charging and fluidizing unit charging and fluidizing a thermosetting powder coating material and applies the thermosetting powder coating material to a surface to be coated of an object to be coated while charging and fluidizing the powder coating material, a regulating device that regulates a thickness of a particle layer of the powder coating material applied to the surface to be coated of the object to be coated, and a heating device that heats the particle layer of the powder coating material to thermally cure the particle layer.

Abstract: A machine for dusting a shape with particulate matter, the shape being a profiled roof tile including raised patterns extending in the lengthwise direction thereof, and including raised portions laterally separated from hollow portions by sloped portions, the tile having a predetermined width, and being preferably corrugated, the machine including a dusting element forming a homogeneous linear curtain of particulate matter falling across the width of the tile, the tile travelling longitudinally under the linear curtain. Deflectors of the curtain are arranged above the tile to intercept the particulate matter above the areas at the bottom of the sloped portions and redistribute the intercepted particulate matter towards an intermediate level of each corresponding sloped portion in order for the amount of particulate matter on the surface of the plate ultimately to be substantially homogeneous after a portion of intercepted particulate matter has slid towards the bottom of the sloped portion.

Abstract: The invention relates to a changeover device for coating media having a plurality of supply units, each of which has at least one inlet, which can be connected to a reservoir, and an outlet, wherein a flow channel extends between the inlet and the outlet. At least one coupling unit which can be moved relative to the supply units has an entry and an exit which can be connected to an application device, wherein a through channel extends between the entry and the exit. The entry of the coupling unit is complementary to the outlets of the supply units so that the entrance of the coupling unit can be coupled to the outlet of one of the supply units and can be separated again therefrom. The coupling unit is designed as a pigging station. The invention further relates to a coating system for coating objects having such a changeover device.

Abstract: One embodiment of the invention provides an apparatus for dispensing conductive paste on photovoltaic structures during manufacturing of a solar panel. The apparatus includes a cartridge for holding the conductive paste, a jet-dispensing module coupled to the cartridge, and a robotic arm coupled to the jet-dispensing module. The jet-dispensing module is configured to dispense a predetermined amount of the conductive paste on busbars of a respective photovoltaic structure in a non-contact manner, and the robotic arm is configured to adjust a position of the jet-dispensing module, thereby facilitating alignments between the jet-dispensing module and the busbars of the photovoltaic structure.

Abstract: Provided are methods and systems for applying materials at interface areas formed by fasteners and parts. Specifically, a material is delivered to an interface area such that at least a portion of a fastener remains free from this material. The interface area may be sealed such that the material is contained within that area. As such, a controlled amount of the material is dispensed in a precise location. An applicator used for this process may include a housing and inner guide slidably disposed within this housing. The material may be delivered through an annular flow channel between the housing and inner guide. The inner guide may be sealed against and, in some embodiments, centered with respect to the fastener. The housing may be sealed with respect to the part and, in some embodiments, may be rotated with respect to the part to redistribute the material at the interface area.

Abstract: Provided are a substrate processing apparatus, a method of manufacturing a semiconductor device, and a non-transitory computer-readable recording medium, which are capable of reducing an effect on a substrate, which is caused by a change in an atmosphere in a substrate storage container, by appropriately supplying an inert gas into the substrate storage container.

Abstract: An electronic component mounting machine is provided with a film thickness gage. The film thickness gage is provided with measurement sections. The mounting head moves to a position above the storage section and lowers the film thickness gage to cause the film thickness gage to come into contact with the flux film. In the film thickness gage, the measurement sections form measurement marks corresponding to the film thickness in the flux film. The electronic component mounting machine images the measurement marks using a mark camera, and determines the film thickness of the flux film which is actually formed based on imaging data.

Abstract: The present invention relates to a coating device for small parts, in particular for lacquering mass produced small parts, like e.g. bolts, small plastic parts and similar, and it relates to a method for this purpose with a movable receiver element for receiving and moving the small parts, and a dispenser device, located at the receiver element for continuous or portioned dispensing the coating material into the receiver element, wherein a radiation emitter device is provided in the receiver element for emitting radiation for drying and/or hardening the coating material.

Abstract: A liquid compound dispensing apparatus for dispensing a controlled amount of liquid compound onto a workpiece is described. The apparatus comprises a cartridge system. The cartridge system may accept a liquid compound cartridge containing liquid compound. The apparatus also comprises a plate, having a threaded bore, positioned above the cartridge system that is movable in a first and second direction, at least one plunger attached to the plate at a first end and attached to a piston at a second end. The piston is dimensioned to move within the liquid compound cartridge to displace liquid compound when the plate is moved in the second direction. A driving mechanism moves the plate in the first and the second directions to dispense product and comprises a motor, a threaded rod disposed through the threaded bore of the plate that is driven by a driving belt attached to the motor.

Abstract: A mask assembly includes a frame with an opening, at least one support stick in the frame and extending in a first direction to traverse the opening of the frame, the support stick including a communication pattern above the opening of the frame, and a mask positioned on the frame and the at least one support stick, the mask extending in a second direction perpendicular to the first direction to traverse the opening of the frame, and the mask being exposed to the opening of the frame through the communication pattern.

Abstract: A sealing blade includes opposite elongated edges (30, 31) and between them a flat (32) and which is adaptable to a blade holder (17) arranged in a coating applicator (25) of a coating device (21) and into contact with a moving surface (11?). The sealing blade has a contact surface (33), which may be arranged against the moving surface and which is 5-15% of the width (W) of the sealing blade (10).