Patents Examined by Kazi S Hossain
  • Patent number: 11978581
    Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: May 7, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Lee Francis, William Jarvis, Takayuki Tange, Shouhei Hirose
  • Patent number: 11972891
    Abstract: An inductor component includes a lamination of an insulating layer and a conductive layer. The insulating layer includes a base made of glass and inorganic particles dispersed in the base. Some of the inorganic particles partially project through the surface of the base into the conductive layer.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: April 30, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromi Miyoshi, Yasuo Matsumoto, Kenta Kondo
  • Patent number: 11967448
    Abstract: A planar transformer may include a primary printed circuit board (PCB) having at least a hole in which a first core and a second core are inserted and including a coil pattern, a secondary PCB having at least a hole in which the first core and the second core are inserted and including a coil pattern, and a heat dissipation plate disposed between the primary PCB and the secondary PCB and including at least a hole in which the first core and the second core are inserted.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: April 23, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Dae Woo Lee
  • Patent number: 11955262
    Abstract: An inductor includes a first magnetic body having a toroidal shape and having a ferrite; and a second magnetic body configured to be different from the first magnetic body and including a metal ribbon, wherein the second magnetic body includes an outer magnetic body disposed on an outer circumferential surface of the first magnetic body and an inner magnetic body disposed on an inner circumferential surface of the first magnetic body, and each of the outer magnetic body and inner magnetic body is wound in a plurality of layers in a circumferential direction of the first magnetic body.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: April 9, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Mi Jin Lee, Ji Yeon Song, Yu Seon Kim, Jong Wook Lim, Seok Bae, Sang Won Lee
  • Patent number: 11942252
    Abstract: A magnetic base body in one embodiment of the invention includes first metal magnetic particles having a first average particle size, and second metal magnetic particles having a second average particle size smaller than the first average particle size. In the embodiment, a first insulating layer having a first thickness is provided on surfaces of the first metal magnetic particles, and a second insulating layer having a second thickness smaller than the first thickness is provided on surfaces of the second metal magnetic particles.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: March 26, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Hitoshi Matsuura
  • Patent number: 11942262
    Abstract: In an inductor component, an inductor wire is in an element body and extends on a virtual flat plane passing inside the element body. A wire main body of the inductor wire has an oblong rectangular shape elongated in a length direction in the top view, and thus, a wire width perpendicular to the extending direction is constant. From each edge of the wire main body in a width direction, protrusions having an oblong rectangular shape in the top view protrude and extend, from a center of the wire main body in the extending direction of the wire main body, in a direction perpendicular to the extending direction, on both sides in the width direction of the wire main body, with the extending direction sandwiched between the protrusions. An area ratio of a protrusion area of the protrusions to an area of the wire main body is within 7.2%.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 26, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Isamu Miyake, Yoshimasa Yoshioka
  • Patent number: 11942248
    Abstract: A common-mode choke coil includes a multilayer body, and first and second coils incorporated in the multilayer body. The multilayer body is a cuboid shape including plural stacked non-conductor layers. The first coil includes a first coil conductor. The second coil includes a second coil conductor. With the common-mode choke coil, in a frequency region greater than or equal to 0.1 GHz and less than or equal to 100 GHz (i.e., from 0.1 GHz to 100 GHz), the Sdd21 transmission characteristic is less than or equal to ?3 dB at or above 30 GHz, and in a frequency region greater than or equal to 10 GHz and less than or equal to 60 GHz (i.e., from 10 GHz to 60 GHz), the Scc21 transmission characteristic is minimum at or above 20 GHz, and the Scc21 transmission characteristic has a minimum value of less than or equal to ?20 dB.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: March 26, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kouhei Matsuura, Atsuo Hirukawa, Hiroshi Ueki
  • Patent number: 11942258
    Abstract: An inductor device includes a first and a second inductor and a first and a second connection member. A first and a second trace of the first inductor is located on a first and a second layer respectively. The second trace is coupled to the first trace located at a first and a second area. The first connection member is coupled to the second trace. A third and a fourth trace of the second inductor is located on the first and the second layer respectively. The first trace and the third trace are disposed in turn at the first area and the second area. The fourth trace is coupled to the third trace located at the first and the second area. The second and the fourth trace are disposed in turn at the first and the second area. The second connection member is coupled to the fourth trace.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: March 26, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Ting-Yao Huang, Ka-Un Chan
  • Patent number: 11935678
    Abstract: An inductive device may be provided, including a first winding layer, a second winding layer arranged over the first winding layer and connected to the first winding layer to form a plurality of turns around a first axis, and a magnetic core arranged vertically between the first winding layer and the second winding layer. The magnetic core may include a portion entirely over the first winding layer and entirely under the second winding layer, where this portion may include a magnetic segment and a non-magnetic segment arranged laterally adjacent to each other along the first axis.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 19, 2024
    Assignee: GLOBALFOUNDARIES SINGAPORE Pte. Ltd.
    Inventors: Zishan Ali Syed Mohammed, Lulu Peng, Chor Shu Cheng, Yong Chau Ng, Lawrence Selvaraj Susai
  • Patent number: 11935687
    Abstract: A reactor including a coil and a magnetic core, the magnetic core including a first inner core portion, a second inner core portion, a first outer core portion, and a second outer core portion. The reactor includes an inner resin portion and an outer resin portion, and the first outer core portion includes a first inner face that faces the coil, a first outer face on the opposite side to the first inner face, and an outward protruding portion protruding from the first outer face. When viewed from the first outer face side, the outer circumferential contour line of the outward protruding portion is located inside the outer circumferential contour line of the first outer face, and the end face of the outward protruding portion is exposed from the outer resin portion and is flush with the surface of the outer resin portion.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: March 19, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Kazuhiro Inaba
  • Patent number: 11929201
    Abstract: A surface mount inductor includes a coil including a wound portion and a feeder end portion drawn out from the wound portion, a compact that contains a magnetic powder and that encapsulates the coil, and an external terminal disposed on the compact and connected to the coil. The compact has surfaces including two pressed surfaces, opposing each other in a direction of an axis of the wound portion and formed by being pressed in the direction of the axis, and a non-pressed surface, adjacent to the two surfaces and not pressed. The coil is disposed so that the axis of the wound portion is parallel to a mount surface of the compact. The mount surface is included in the non-pressed surface, the feeder end portion is exposed from the mount surface, and the external terminal is formed on only the non-pressed surface and connected to the feeder end portion.
    Type: Grant
    Filed: March 7, 2023
    Date of Patent: March 12, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yuki Kitashima, Masaki Kitajima, Takeo Ohaga, Takeshi Shimada, Yoshiaki Hirama, Daigo Mizumura, Ryota Watanabe, Masato Koike, Yuusuke Morita
  • Patent number: 11929200
    Abstract: A coil component includes a body; first and second coil portions spaced apart from each other in the body; first and second external electrodes disposed on the body to be spaced apart from each other and connected to both ends of the first coil portion; and first and second ground electrodes spaced apart from each other on the body and connected to both ends of the second coil portion.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hwan Lee, Sang Soo Park, Chan Yoon, Dong Jin Lee, Hwi Dae Kim, Hye Mi Yoo
  • Patent number: 11923126
    Abstract: Provided is a coil component and a method of manufacturing the coil component less prone to aggregation of metal fillers contained in an external electrode. The coil component includes: a base body; a conductor wound around a coil axis; and an external electrode provided on a surface of the base body and electrically connected to an end portion of the conductor, wherein the external electrode includes an electrode layer containing a plurality of first fillers, a plurality of second fillers, and a resin, wherein at least a part of the plurality of second fillers is bonded by metallic bond to at least adjacent one of the plurality of first fillers and/or at least adjacent one of the others of the plurality of second fillers, and wherein each of the plurality of second fillers has a flat shape.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Hirotaka Wakabayashi
  • Patent number: 11915851
    Abstract: An inductor includes an external terminal and an element body that includes a magnetic portion containing a magnetic powder and a coil embedded in the magnetic portion. The magnetic powder has a particle size D50 at 50% of the cumulative volume of 5 ?m or less, a D90/D10 of 19 or lower, and a Vickers hardness of 1000 (kgf/mm2) or lower, the D90/D10 being the ratio of particle size D90 at 90% of the cumulative volume to particle size D10 at 10% of the cumulative volume in the cumulative particle size distribution by volume. In the magnetic portion, the packing density of the magnetic powder by volume is 60% or higher.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: February 27, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yuichi Tsuchiya, Takumi Arai, Motoki Toyama, Ryuta Uematsu
  • Patent number: 11908607
    Abstract: A multilayer coil component includes a multilayer body that includes insulating layers that are stacked; a coil disposed in the multilayer body; and outer electrodes disposed on surfaces of the multilayer body and electrically connected to the coil. The coil includes at least two coil conductor groups that each include at least two coil conductors connected to each other in parallel through two coupling conductors. The at least two coil conductor groups are connected to each other in series through a connecting conductor. The connecting conductor connects the coil conductor between the two coupling conductors in one of the at least two coil conductor groups to the coil conductor between the two coupling conductors in another one of the at least two coil conductor groups.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: February 20, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Hiraki, Ryohei Kawabata, Katsuhisa Imada
  • Patent number: 11908603
    Abstract: An inductor which avoids heat generation and heat dissipation problems, and has a reduced resistance component, when used in a voltage converter. An inductor is configured with a pair of outer electrodes disposed on both end portions of an element assembly and electrically connected to end portions of conductors. The conductors are made of a flat-type wire having a rectangular cross section, are placed side by side between the end portions, and include cylindrical winding sections, respectively, in which the flat-type wire in a long side direction of the rectangular cross section is wound the number of turns less than one about a thickness direction intersecting with a length direction connecting the pair of end portions along the thickness direction. A heat-dissipating member includes a portion being a partition between the conductors and a portion exposed on the top of an outer surface of the element assembly.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: February 20, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Norimichi Onozaki
  • Patent number: 11901105
    Abstract: A highly reliable multilayer coil component in which the internal stress is further alleviated, and a method for producing the same. The method produces a multilayer coil component that includes an insulator portion, a coil that is embedded in the insulator portion and includes a plurality of coil conductor layers electrically connected to one another, and an outer electrode that is disposed on a surface of the insulator portion and is electrically connected to an extended portion of the coil. The method includes forming a conductive paste layer by using a conductive paste; forming an insulating paste layer by using an insulating paste; forming a multilayer compact that includes the conductive paste layer and the insulating paste layer; and firing the multilayer compact, in which the conductive paste has a PVC of 60% or more and 80% or less (i.e., from 60% to 80%).
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: February 13, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Hiraki, Katsuhisa Imada, Morihiro Hamano, Ryouji Mizobata
  • Patent number: 11901110
    Abstract: A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: February 13, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromitsu Yamanaka, Masayuki Oishi
  • Patent number: 11901111
    Abstract: An inductor device includes a first wire, a second wire, at least one first connector, at least one second connector, and a first center-tapped terminal. The first wire includes a plurality of first sub-wires. The second wire includes a plurality of second sub-wires. The first sub-wires and the second sub-wires are disposed in an interlaced manner. The at least one first connector couples the first sub-wire that is disposed on an outer side and the first sub-wire that is disposed on an inner side in the first sub-wires. The at least one second connector couples the second sub-wire that is disposed on the outer side and the second sub-wire that is disposed on the inner side in the second sub-wires. The first center-tapped terminal is coupled to the first sub-wire that is disposed on the outer side in the first sub-wires.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: February 13, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Kuan-Yu Shih, Ka-Un Chan
  • Patent number: 11901108
    Abstract: A power module includes a printed circuit board (PCB), a magnetic element, primary and secondary winding circuits and a regulator. The magnetic element is disposed on the PCB and has first to fourth sides. The second side is opposite to the first side, the fourth side is opposite to the third side. The primary winding circuit is disposed on the PCB and positioned in a vicinity of the first or second side. The secondary winding circuit is disposed on the first PCB and positioned in a vicinity of the third or fourth side. The regulator includes a switch disposed on the PCB, and coupled to the primary winding circuit. The at least one switch, the primary winding circuit, and the magnetic element are arranged in a first direction in order. A power device is also disclosed herein.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: February 13, 2024
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Jin-Fa Zhang, Hai-Jun Yang, Zhong-Wei Ke, Kai Dong, Shuai-Lin Du