Abstract: The copper alloy of the present invention contains 5% by mass to 25% by mass of Ni, 5% by mass to 10% by mass of Sn, 0.005% by mass to 0.5% by mass of element A (element A being at least one selected from the group consisting of Nb, Zr and Ti), and 0.005% by mass or more of carbon. In the copper alloy, the mole ratio of the carbon to the element A is 10.0 or less. The copper alloy may further contain 0.01% by mass to 1% by mass of Mn. In this copper alloy, the element A may be present as carbide.

Abstract: This copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which is composed of Mg at a content of 3.3 to 6.9 atomic %, and a remainder of Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic %, and/or an average number of intermetallic compounds having grain sizes of 0.1 ?m or more is in a range of 1/?m2 or less, ??{1.7241/(?0.0347×A2+0.6569×A+1.7)}×100.

Abstract: A method for treating high-strength, low-alloy steel includes controlling material responses, such as the crystal structure of the steel, through various processing steps. More specifically, the method includes cold treating the steel to achieve predictable increases in a minimum ultimate tensile strength or desired changes in the crystal structure of the steel. In one embodiment, cold treating the steel operates to controllably increase the minimum ultimate tensile strength of the steel within increasing a specified maximum ultimate tensile strength of the steel. Stated otherwise, cold treating the steel may reduce or narrow a minimum-to-maximum ultimate tensile strength range such that the minimum ultimate tensile strength is closer to the specified maximum ultimate tensile strength.