Abstract: The invention relates to producing continuous organic fibers by stretching from molten minerals. These fibers can be used for producing heat resistant threads, rovings, cut fibers, fabrics, composite materials and products based thereon. The inventive glass has the following chemical composition in mass percentage: 15.9-18.1 Al2O3, 0.75-1.2 TiO2, 7.51-9.53 Fe2O3+FeO, 6.41-8.95 CaO, 2.5-6.4 MgO, 1.6-2.72 K2O, 3.3-4.1 Na2O, 0.23-0.5 P2O5, 0.02-0.15 SO3, 0.12-0.21 MnO, 0.05-0.19 BaO, impurities up to 1.0, the rest being SiO2. The inventive method consists in loading a ground composition in a melting furnace, in melting said composition, in homogenizing a melt, in consequently stabilizing the melt in the melting furnace feeder, in drawing and oiling the fiber and in winding it on a spool. Prior to loading, the composition is held in an alkali solution for 15-20 minutes, and is then washed with flowing water for 20-30 minutes and dried.

Abstract: A double-sided adhesive tape dispenser available for diverse width includes a main body and a winding mechanism installed inside the main body. The winding mechanism has a driving gear and a recycling gear fitted with a recycling wheel. The driving gear and the recycling gear are respectively mounted with a first adjusting member and a second adjusting member that have a certain height. A tape disk is fitted on the first adjusting member. With or without the first adjusting member and the second adjusting member, adhesive tapes with diverse widths can be applied by the adhesive tape dispenser of the invention without using an additional conventional adhesive tape dispenser.

Abstract: One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.

Abstract: In a method for labeling, a label strip (20) is moved by means of an electric motor (80). Arranged on this label strip are labels (26) of predetermined length (EL) with uniform interstices (SB). The motor has associated with it a position controller (218), also a sensor (44) for sensing a predetermined position of a label (26) when the latter is moved on the label strip (20) relative to the sensor (44). The method has the following steps: in accordance with a stored profile, the label strip (20) is set in motion beginning from a start position (A), a first target position (Z) of the label strip being specified to the position controller (218); during the motion of the label strip (20), a predetermined position (M) of the label strip (20) is sensed; and subsequently thereto, a revised target position (Z) is specified to the position controller (218). This makes possible fast and precise labeling, since the target position can be reached very accurately. A corresponding device has a compact design.

Abstract: The invention relates to a method for producing oriented slit film tapes, comprising the following steps: extruding melt polymer through a die (2); simultaneous quenching and melt-drawing of the molten polymer in the cooling device to form a film sheet (3); slitting the initial film sheet into a plurality of relatively narrow slit film tapes (4); stretching (8) at elevated temperature, by passing the slit film tapes through a heating medium (7) at a temperature just below the softening temperature of the slit film tapes; y annealing and cooling the oriented slit film tapes (10, 11); winding the slit film tapes (13); characterized in that before the stretching step, it has a stage of pre-stretching (108) made by passing the slit film tapes through one set of heated holding rollers (107) turning at a given speed and one set of cooled pre-stretch rollers (109) turning faster than the heated holding rollers, wherein at least one of the rollers of the set of holding rollers is heated and at least one of the roller

Abstract: A method relaxing a strained thin film, secured via a first main face of an initial support, the second main face of the thin film being a contact face. The method supplies an intermediate support including a polymer layer having a main free contact face, the polymer's thermal expansion coefficient being greater than that of the thin film, adhesively brings into contact the contact face of the strained thin film with the contact face of the polymer layer, eliminates the initial support, realizing relaxation of the thin film through formation of wrinkles and revealing the first main face of the thin film, increases the polymer layer temperature to stretch the relaxed thin film and eliminate the wrinkles, secures the first main face of the thin film with one face of a receiving substrate, and eliminates the intermediate support to obtain a relaxed thin film integral with the receiving substrate.

Abstract: In order to provide a good transferable and extremely usable transfer tool in which consumable supplies can be easily replaced while increasing rigidity in use and case assembling procedure is also simple, the transfer tool (A) includes a case body (1) which incorporates a transfer material (T), the case body (1) having a first case (2) for holding replacement parts including at least the transfer material (T); and a second case (3) engageable with and disengageable from the first case (2), for holding unchangeable parts constituting at least a part of feeding mechanism parts which feeds out the transfer material (T) to a transferred object, wherein a holding portion (K) for holding the case body (1) to a base (4) in a state where the first case (2) and the second case (3) are engaged, and a pivoting support portion (L) for pivotably supporting the second case (3) to the base (4) between a use position (P) in which the case body (1) is held to the base (4) by the holding portion (K) and a releasing retention

Abstract: One embodiment of the invention includes a method of joining two substrates with multilayer thermo-reversible dry adhesives and separating the two bonded substrates by completely thermally reversing the adhesion via heating.

Abstract: An apparatus for automatically peeling a removal tape from a removal-tape-attached adhesive tape and affixing the adhesive tape to a battery module. A removal-tape-attached adhesive insulation tape supplied from an uncoiler is held in a folded state by means of a carrier plate. The carrier plate reciprocates between a first position and a second position. When the carrier plate has moved from the first position to the second position, a tape holding unit holds the tape by means of suction. Subsequently, as a result of movement of the carrier plate from the second position to the first position, the removal tape is peeled from the removal-tape-attached adhesive insulation tape T, thereby uncovering an adhesive surface of the adhesive tape. The battery module is dropped toward the adhesive tape at an inclination with reference to the vertical direction, whereby the adhesive tape is affixed to the battery module.

Abstract: A process and implementing apparatus are disclosed by which the curing time of a water-based adhesive is shortened as applied to the bonding of two fibrous substrates, such as paperboard or corrugated fiberboard.

Abstract: When a synthetic quartz glass substrate is prepared from a synthetic quartz glass block, (I) the block has a hydrogen molecule concentration of 5×1017-1×1019 molecules/cm3, (II) the substrate has a hydrogen molecule concentration of 5×1015-5×1017 molecules/cm3, (III) the substrate has an in-plane variation of its internal transmittance at 193.4 nm which is up to 0.2%, and (IV) the substrate has an internal transmittance of at least 99.6% at 193.4 nm. The synthetic quartz glass substrate has a high transmittance and a uniform transmittance distribution, and is adapted for use with excimer lasers, particularly ArF excimer lasers.

Abstract: The present invention relates to a partial painting method, and more particularly, to a painting method wherein a printing layer is completely transferred onto a base material surface by attaching a hologram transfer film on the base material surface subjected to transparent painting, heat-treating it to transfer a printing portion and then removing a base material film. Since the printing layer is completely transferred onto and impregnated into the transferred surface of the present invention, there occurs no step and the printing layer is not erased due to a solvent. Further, the present invention relates a method of preparing a painting composition using a hologram transfer film and a painting method using the painting composition.

Abstract: The invention relates to a method for producing a component for connecting a fuselage cell skin to an annular rib of an aircraft, wherein the component is formed by bending of a flat blank along at last two edge lines and wherein the blank is formed by a CFRP. According to the invention the interlaminar sliding of the fiber layers is largely completed in a first forming step, while in a second forming step a consolidation of the component takes place by the use of pressure from the press on all sides by means of an upper tool and a lower tool. This enables complex components with at least two edge lines to be produced, which edge lines run at angles of approximately, preferably at angles of 309° to 90°, to each other, and which edge lines also lie in at least two different planes.

Abstract: A method of making a golf ball including the steps of providing a preform including an uncured polybutadiene composition; coating the preform with a cure-altering material including a hydroquinone compound, a benzoquinone compound, a resorcinol compound, or a quinhydrone compound; curing the coated preform at a predetermined temperature to form a crosslinked golf ball core having an outer surface having a first hardness and a geometric center having a second hardness greater than the first to define a negative hardness gradient; and forming a cover layer about the core to form the golf ball.

Abstract: An apparatus affixes an adhesive tape to a workpiece having a cylindrical portion and an outer peripheral surface. The apparatus comprises a tape-feeding device for feeding an adhesive tape below the outer peripheral surface such that the adhesive surface faces upwardly in a direction approximately perpendicular to an axis of the cylindrical portion, a tape-cutting device for cutting the adhesive tape fed from the tape-feeding device in a predetermined length, and a tape-affixing device for thrusting and affixing the adhesive surface of the adhesive tape which was cut by the tape-cutting device to the outer peripheral surface of the cylindrical portion such that the tape-affixing device passes through both sides of the outer peripheral surface of the cylindrical portion from below thereof so as to elevate the adhesive tape.

Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: Wettability of a PBN material surface with respect to a metal is improved to expand use applications. Hydrogen ions are implanted into a surface of a silicon substrate 10 to form an ion implanted region 11 at a predetermined depth near a surface of the silicon substrate 10, and a plasma treatment or an ozone treatment is performed with respect to a main surface of the silicon substrate 10 for the purpose of surface cleaning or surface activation. The main surfaces of the silicon substrate 10 and a PBN substrate 20 subjected to the surface treatment are appressed against each other to be bonded at a room temperature, and an external impact shock is given to the bonded substrate to mechanically delaminate a silicon film 12 from a bulk 13 of the silicon substrate to be transferred. An obtained PBN composite substrate 30 is diced to form a chip having a desired size, and a refractory metal is metallized on the silicon film 12 side to be connected with a wiring material.

Abstract: Electromagnetic (EM) drying of a plugged ware is provided that includes subjecting the ware to an axially non-uniform EM radiation field that causes more EM radiation to be dissipated in either of the plugged regions than in the unplugged region. The EM radiation field is provided by a configurable applicator system that includes a feed waveguide and a conveyor path. The feed waveguide includes configurable slots. The configurable applicator system can be set to selectively vary the amount of EM radiation dissipated by each ware along the longitudinal axis of each ware as a function of ware position along the conveying path, thereby enhancing the EM drying process.

Abstract: An injection-foaming method for a thermoplastic resin comprising using an injection unit 30 provided with a hopper 35, a plasticizing cylinder 31 and a screw 32, and a mold 10 having a mold cavity 10a of changeable capacity; filling the mold cavity 10a with a foaming-agent-containing melted resin injected from the injection unit 30; and then enlarging the mold cavity 10a for allowing the foaming-agent-containing melted resin to expand, wherein inclusion of a foaming agent into a thermoplastic resin is done by using a mixture of a foam nucleating agent and a foaming gas as foaming agent, feeding the mixture to hopper 35 or plasticizing cylinder 31 and screw 32 of injection unit 30 at a pressure of 0.1 MPa or more and less than 1.0 MPa, and contacting the mixture with a pre- or post-plasticized thermoplastic resin present in hopper 35 or plasticizing cylinder 31 and screw 32.