Patents Examined by Kishor Mayeka
  • Patent number: 8802018
    Abstract: An apparatus, system, and method of irradiating fluent food products. The present invention utilizes a transmissive wall having a convex surface. A source of radiation is positioned on a side of the transmissive wall that is opposite the convex surface so that when the radiation source is emitting radiation energy, the radiation energy passes through the transmissive wall, thereby irradiating fluent food product that is flowing in contact with the convex surface.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: August 12, 2014
    Assignee: Nestec S.A.
    Inventors: Shekhar Patel, Laurence J. Kiely
  • Patent number: 5268088
    Abstract: Improved methods for electroplating non-conducting substrates are disclosed utilizing aqueous alkali metal containing adhesion promoter solutions to enhance the surface deposition of colloidal metal activating catalysts to form conducting layers capable of direct electroplating. The adhesion promoter solutions contain sufficient alkali metal ions to deposit trace amounts of metal ions onto the substrate surface to be plated. Copper ions may be incorporated into the adhesion promoters to enhance this effect. These adhesion promoter solutions eliminate the swelling and related problems associated with the direct electroplating of acrylic and epoxy containing substrates. Following adhesion promoter treatment, the substrates are conditioned with a cleaner/conditioner solution and catalytically activated with a colloidal catalyst of palladium and tin forming a highly conductive catalytically treated surface which will support subsequent direct electroplating in conventional plating baths.
    Type: Grant
    Filed: January 31, 1992
    Date of Patent: December 7, 1993
    Assignee: Eric F. Harnden
    Inventor: Kiyoshi Okabayashi