Patents Examined by Kristen A. Crockford
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Patent number: 6780461Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).Type: GrantFiled: March 1, 2001Date of Patent: August 24, 2004Assignee: ASML Holding N.V.Inventors: Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Scott C. Wackerman, Reese Reynolds
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Patent number: 6696102Abstract: A method and apparatus for applying a fluid preservative to wood or wood products has a work tank for maintaining a predetermined concentration of preservative in the fluid. The work tank is equipped with a heater to keep the temperature of the fluid and the preservative in the work tank at a predetermined level. Hot fluid and preservative is drawn under a vacuum, initially from the work tank. On filling a pressure vessel, a pressure pump then supplies the preservative and fluid mixture under pressure to the pressure vessel in which the wood or wood product is being treated. As the treatment process depletes the preservative in the fluid, through absorption in the wood, the depleted fluid is circulated back to the work tank where it is heated and more preservative is added to restore the concentration of preservative in the fluid to a desired level. The fluid, replenished with preservative, is then pumped into the pressure vessel.Type: GrantFiled: January 19, 2001Date of Patent: February 24, 2004Assignee: Premier Wood Treating, L.L.C.Inventor: James N. Ray
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Patent number: 6649216Abstract: The present invention relates to a method of coating polymer film that includes the steps of extruding a cast sheet; stretching the sheet in a machine direction; applying a UV-curable coating to the sheet in-line; stretching the sheet in a transverse direction in a tenter; and exposing the coated sheet to UV radiation in-line.Type: GrantFiled: September 5, 2001Date of Patent: November 18, 2003Assignee: Mitsubishi Polyester Film, LLCInventors: Steven J. Gust, Patrick M. Smith, Jan C. Westermeier
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Patent number: 6576295Abstract: A method and apparatus for dispensing precise quantities of reagents is disclosed including a positive displacement syringe pump in series with a dispenser, such as an aerosol dispenser or solenoid valve dispenser. The pump is controlled by a stepper motor or the like to provide an incremental quantity or continuous flow of reagent to the dispenser. The pump and dispenser are operated in cooperation with one another such that the quantity and/or flow rate of liquid dispensed by the dispenser can be precisely metered substantially independently of the particular operating parameters of said dispenser to attain a desired flow rate, droplet size or mist quality, droplet frequency and/or droplet velocity.Type: GrantFiled: April 5, 1999Date of Patent: June 10, 2003Assignee: Bio Dot, Inc.Inventor: Thomas C. Tisone
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Patent number: 6207300Abstract: A process for producing, on a metallic substrate, a geometric metal structure having a precise contour, including the steps of: solder coating a solder paste onto the substrate by screen printing to create the geometric metal structure, the solder paste comprising an organic binder system, and 80 to 95 weight % of a mixture of a nickel-based solder and a pulverulent alloy of nickel with at least one member selected from the group consisting of chromium, molybdenum, tungsten, manganese and iron, provided as a higher-melting metallic filler, wherein a weight ratio of solder to filler is 2-6:1, an average grain size of the solder is between 10 and 50 &mgr;m, and a grain size ratio of solder to filler, relative to the average grain size is from 0.5-2.5:1; drying the structure; decomposing the organic binder system present in the solder paste, without leaving a reside, by a heat treatment; and raising the temperature until the resulting solder material liquifies.Type: GrantFiled: December 8, 1999Date of Patent: March 27, 2001Assignees: Federal-Mogul Sealing Systems GmbH, Degussa-Hüls AktiengesellschaftInventors: Jürgen Koch, Manfred Koschlig, Harald Krappitz, Wolfgang Weber, Klaus Lönne, Klaus Schmitt
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Patent number: 6177147Abstract: To produce a desirable amount of desirable radical and/or ion in treating a substrate such as etching the substrate, depositing a thin film on the substrate and the like by using plasma and the like. As a treating gas, a gas such as CFmIn and the like containing both a strongly bonded halogen element (F etc.) and weakly bonded halogen element (I etc.) is used. A substrate is treated by active species produced by exciting the treating gas by an excitation means capable of providing an energy which cannot dissociate the strong bond but can dissociate the weak bond. Preferable excitation means is capable of emitting a monochromatic irradiation, having a single value of excitation energy, such as electron beam, light etc., or otherwise capable of providing plasma, having a peak energy value of electrons and sharp electron energy distribution, such as UHF plasma etc.Type: GrantFiled: March 26, 1999Date of Patent: January 23, 2001Assignee: NEC CorporationInventors: Seiji Samukawa, Kenichirou Tsuda