Abstract: An NTC thermistor element includes a thermistor body and a plurality of internal electrodes disposed in the thermistor body and opposing each other. The thermistor body includes a region interposed between adjacent internal electrodes of the plurality of internal electrodes. The region of the thermistor body includes a plurality of crystal grains arranged in succession between the internal electrodes adjacent to each other. The plurality of crystal grains include a first crystal grain, a second crystal grain, and a third crystal grain. The first crystal grain is in contact with one internal electrode of the internal electrodes adjacent to each other. The second crystal grain is in contact with another internal electrode of the internal electrodes adjacent to each other. The third crystal grain is not in contact with the first crystal grain and the second crystal grain.

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

Abstract: A chip resistor includes: an insulating substrate; a pair of front electrodes; a resistor connecting between both the front electrodes; an undercoat layer provided on the resistor; an overcoat layer provided on the undercoat layer, an auxiliary film provided so as to be over a connecting portion between the front electrode and the resistor at a position away from an end face of the insulating substrate; a pair of end face electrodes; and a pair of external plating layers covering the end face electrodes, the front electrodes, and the auxiliary film, wherein the auxiliary film is formed of a resin material containing metal particles, and a portion of the auxiliary film is sandwiched between the undercoat layer and the overcoat layer.

Abstract: A shunt resistor module, which includes a shunt resistor having a resistor unit having a predetermined resistance, plate-shaped terminal units respectively configured to extend at both sides of the resistor unit, and a voltage measurement lead pin configured to protrude perpendicular to the terminal unit and having an end portion bent to be parallel to the terminal unit, and a PCB substrate having an assembly guide portion formed to be cut inward by a predetermined depth from an outermost side thereof. The voltage measurement lead pin is fit into the assembly guide portion so that the resistor unit and the terminal unit are placed on a front surface of the PCB substrate and the end portion of the voltage measurement lead pin is caught at a rear surface of the PCB substrate.

Abstract: An all-printed physically unclonable function based on a single-walled carbon nanotube network. The network may be a mixture of semiconducting and metallic nanotubes randomly tangled with each other through the printing process. The unique distribution of carbon nanotubes in a network can be used for authentication, and this feature can be a secret key for a high level hardware security. The carbon nanotube network does not require any advanced purification process, alignment of nanotubes, high-resolution lithography and patterning. Rather, the intrinsic randomness of carbon nanotubes is leveraged to provide the unclonable aspect.

Abstract: To provide a resistance device which has a small temperature dependence, in which a resistance value is adjustable in a wide range of from a high resistance value to a low resistance value, and which has a small circuit area, and to provide a current detection circuit including the resistance device. The resistance device is to be connected between two terminals, and a resistance value thereof is variable, the resistance device including: a reference resistor; a series variable resistor circuitry including at least one parallel variable resistor circuit which is connected in series to each other, and which each includes a resistor and a trimming element connected in parallel to the resistor; and a parallel variable resistor circuitry including at least one series variable resistor circuit which is connected in parallel to each other, and which each includes a resistor and a trimming element connected in series to the resistor.

Abstract: A mechatronic module includes: a hybrid circuit arrangement having at least one interrupter, which interrupter includes at least one first mechanical switch and at least one first semiconductor circuit arrangement. The hybrid circuit arrangement is situated on a first face of a ceramic substrate, a second face, opposite the first face, of the ceramic substrate being connected to a metal plate. A housing shell is fastened to the metal plate and encloses the ceramic substrate and the hybrid circuit arrangement. The metal plate and the housing shell form a housing of the mechatronic module. Interstices within the housing are filled at least in some regions with a potting compound.

Abstract: A surge protection apparatus is disclosed. The surge protection apparatus includes a housing; electronics contained in the housing; and a plurality of metal tabs electrically connected to the electronics, the metal tabs being configured to connect to a terminal block of a relay panel in a substation, the metal tabs electrically connecting the terminal block to the electronics to provide EMP surge protection to the relay panel.

Abstract: An anti-surge resistor and a fabrication method thereof are provided. The current anti-surge resistor includes a substrate made by a varistor material, a resistance layer disposed on the substrate, a first terminal electrode, and a second terminal electrode. In the fabrication method of the current anti-surge resistor, at first, the substrate made by the varistor material is provided. Then, the resistance layer is formed on the substrate to provide a main body, in which the main body includes the substrate and the resistance layer, and has two opposite terminals. Thereafter, the first terminal electrode is formed on one terminal of the main body, and the second terminal electrode is formed on the other terminal of the main body.

Abstract: An object is to provide a laminated varistor excellent in clamping voltage ratio. Laminated varistor includes at least a pair of internal electrodes provided in varistor layer containing ZnO as a main component. Internal electrode contains Ag as a main component and is made of a metal containing at least one type selected from Pt and Au. The total weight of Pt and Au with respect to the weight of the metal constituting internal electrode is set between 2% and 30% (inclusive). With such a configuration, diffusion of Ag into varistor layer can be prevented, and a laminated varistor excellent in clamping voltage ratio can be obtained.

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

Abstract: A varistor includes a sintered body, an internal electrode, an insulating layer, and an external electrode. The internal electrode is disposed in an interior of the sintered body. The insulating layer covers at least part of the sintered body and includes Zn2SiO4. The external electrode is electrically connected to the internal electrode, covers part of the sintered body and part of the insulating layer, and is in contact with the part of the insulating layer. The insulating layer has a region being in contact with the external electrode, the region having a greater average thickness than a region of the insulating layer which is out of contact with the external electrode.

Abstract: In a direct-ink-writing (DIW) method for printing a strain gauge array circuit, several insulating strips are printed on the upper layer of the first circuit layer after the first circuit layer has been printed and cured, and the second circuit layer is then printed at the insulating strips. The functional layer of a strain gauge is printed and covered thereon without contacting the insulating strips; the head and tail electrodes of the functional layer are respectively connected to two layers of circuit layers; and finally, a layer of insulating material is printed for encapsulation. DIW is used to complete the whole printing. A new insulating method is used in a cross part of two silver lines of a row-column compound circuit. The local glue dispensing is changed to printing the insulating strips in routing regions, and ensures the strain transmission efficiency from the strain gauge substrate to the functional layer.

Abstract: A disconnect has a housing defining a cavity, a busbar fixed in the housing and extending through the cavity, a piston movable in the cavity past the piston for breaking a piece out of the busbar, and a plurality of metallic filter elements exposed in the cavity below the busbar and electrically connecting with the piece on activation of the disconnect. An igniter displaces the piston in the cavity into engagement with and past the busbar so as to break the piece out of busbar and displace it past the filter elements such that an arc created by breaking out the piece is drawn by the piece away from the busbar and energy of the arc heats and is dissipated in the filter elements.

Abstract: A sensor assembly for a resistance temperature sensor element includes a substrate and a measuring structure disposed on the substrate. The substrate includes a first material and a stabilized second material. The first material is at least one of aluminum oxide, spinel (magnesium aluminate) and yttrium-aluminum-garnet. The stabilized second material is at least one of stabilized zirconium dioxide and stabilized hafnium dioxide. The stabilized second material is stabilized by containing an oxide of an element having a valence different from four. A coefficient of thermal expansion of the substrate deviates by less than 5% from a coefficient of thermal expansion of the measuring structure.

Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Abstract: In an embodiment a method for manufacturing a multilayer varistor includes providing a first ceramic powder for producing a first ceramic material and at least one second ceramic powder for producing a second ceramic material, wherein the ceramic powders differ from each other in concentration of monovalent elements X+ by 50 ppm??c(X+)?5000 ppm, wherein X+=(Li+, Na+, K+ or Ag+), and wherein ?c denotes a maximum concentration difference occurring between an active region and a near-surface region of the multilayer varistor, slicking of the ceramic powders and forming of green films, partially printing of a part of the green films with a metal paste to form inner electrodes, stacking printed and unprinted green films, laminating, decarbonizing and sintering the green films and applying outer electrodes.

Abstract: A method of fabricating resistors in igniter is provided. The method includes punching an alloy material to obtain a plurality of alloy components. The alloy components are disposed on a substrate, and electrodes are disposed on the substrate. Resistors in igniter are obtained by disposing electrodes on the substrate such that two electrically connecting regions of each alloy component are physically contacting and electrically connecting to the electrodes, respectively. The resulting resistors in igniter have uniform size and stable shape hence showing great ignition performance.

Abstract: An electrical component comprises a main body and at least one external electrode that is fastened by a connecting material to the main body. The main body and the external electrode have different coefficients of thermal expansion that determine a critical temperature which, when exceeded, results in a connection between the main body and the external electrode experiencing mechanical stresses that lead to damage to the component. The connecting material has a melting point which is lower than a critical temperature.

Abstract: A thermistor having a ceramic main body, which contains a ceramic material as the main constituent. The ceramic main body has at least one electrically insulating layer. The electrically insulating layer is arranged within the ceramic main body and contains a main component which has a composition different from the ceramic material.