Abstract: A method is provided for assembling a shaft having a metal matrix composite mid shaft and monolithic high strength alloy forward and aft shafts. The forward and aft shafts are each inertia friction welded to separate annular transition pieces which include a barrier layer operative to prevent the formation of intermetallic compounds. Special tooling is used to avoid applying shear stresses to the transition piece during welding. The welded forward and aft subassemblies are subsequently heat treated before inertia friction welding them to the mid shaft.

Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).

Abstract: The high yield ratio problem intrinsic in high-strength steel pipes is solved and a method of producing a steel pipe, while securing the pipe roundness is provided. A steel pipe produced from a steel plate by forming and welding is subjected to 0.3 to 1.2% of expansion and then to 0.1 to 1.0% of reduction. The steel pipe produced by this method has a structure in which martensite and/or bainite accounts for more than 80% as expressed in terms of area percentage, and has a yield strength of not lower than 551 MPa and a yield ratio of not higher than 93%. The pipe reduction is desirably carried out at a lower work ratio as compared with the pipe expansion.

Abstract: Nonmetallic high-temperature material, such as graphite, CFC or SiC, or components produced from these materials, are joined using the two-stage process. First the structural components are canned and the canning foil is tightly pressed onto the surface contour of the structural components. Then the components are joined to a composite component by forming a material-to-material bond between the metal canning foils. This widens the hitherto highly restricted field of technical application for materials of this type.

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: A method for manufacturing valve seats using a laser cladding process is provided that includes forming a casting material on which the valve seats are to be formed; fabricating a valve seat target position on which laser cladding will be performed, the valve seat target position being provided at a location on the casting material where a valve seat is to be formed; removing an oxidation film formed on the valve seat target position; injecting a metal powder mixture on the valve seat target position, the metal powder mixture being realized through a mixture of two or more metal powders at a predetermined ratio by weight %; and irradiating a laser beam on the metal powder mixture to clad the metal powder mixture on the valve seat target position to thereby form the valve seat.

Abstract: A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced apart from the surface. There is a wire holder on the bond head, the wire holder being sized and shaped to permit a free end of the insulated wire to extend from the wire holder when the bond head is in the spaced apart position. A source of insulated wire for said bond head is provided as well as an electrical discharge wand positioned adjacent to said bond head when the bond head is in the spaced apart position. The wand directs sufficient electricity at the extending free end of the insulated wire to form a bond ball on the free end. A ground associated with the insulated wire, is provided the ground being sized and positioned to conduct electrical energy away from the insulated bond wire to prevent the insulation on the bond wire remote from the free end from being damaged.

Abstract: A friction stir rivet is rotated in a precessing motion and driven through a first fusible workpiece into an engaged second fusible workpiece, causing local portions of the first and second workpieces to plasticize. When the rivet is driven through the first workpiece and into the second workpiece, rotation is stopped and the plasticized material solidifies around the rivet creating an enlarged weld joining the metal workpiece and encompassing the rivet, which provides additional mechanical strength.

Abstract: This invention relates to a method of spatially integrating multiple pipeline datasets. The method involves weld matching multiple inline inspection datasets by selecting one dataset as master and designated the other datasets as slaves, then spatially slaving the weld positions in the slaves to the weld positions in the master. After the weld matching process is completed, the method repositions the other data in the slave datasets relative to the master datasets, and which itself was previously spatially fit against a centreline model.

Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

Abstract: A plurality of parts are brazed using an iron/chromium filler metal. The parts are preferably composed of stainless steel. The brazed assembly forms a heat exchanger characterized by good corrosion resistance and low rates of leaching of Ni, which are further improved by a post-brazing conditioning step in an oxygen-containing atmosphere at a temperature of about 150° to 600° C. The preferred brazing filler metal consists essentially of a composition having the formula FeaCrbCocNidMoeWfBgSih wherein the subscripts are in atom percent and total 100%, “b” is about 5 to 20, “c” ranges from 0 to about 30, “d” is 0 to about 20, “e” is 0 to about 5, “f” is 0 to about 5, “g” is about 8 to 15, “h” is about 8 to 15, the balance being incidental impurities of up to about 1 percent by weight of the total composition.

Abstract: A turbine blade closure system composed of a closure member capable of being friction welded in an aperture in a hollow-cast turbine blade to prevent the escape of cooling fluids from an internal cavity in the turbine blade. In one embodiment, the aperture is formed in the turbine blade during the manufacturing process as a result of one or more support projections used to position a core block in a turbine blade mold.

Abstract: A brazed product has a metal substrate, a ceramic or graphite substrate, and a brazing alloy containing one of a high nickel content and cobalt content joining the ceramic or graphite substrate to the metal substrate. A method of joining these materials include providing a metal layer coating of titanium or nickel on the surface of the ceramic or graphite substrate to be joined or using a high nickel content or high cobalt content and containing titanium. The brazing alloy contains a high nickel content 70-95% by weight, or a high cobalt content between 45-55% by weight. This brazing alloy can contain titanium in the range between 0.5-5% by weight.

Abstract: This invention relates to prospective electric energy sources to be employed in both mobile and stationery high-power electric stations. A method is disclosed for manufacturing a High Temperature Fuel Cell (HTFC), and the associated components, having a solid oxide electrolyte, and designed to transform chemical energy directly into electrical power. The disclosed method for manufacturing an HTFC and its components employs a narrow class of organic reagents which are well known, and widely used in the art. The manufacturing and assembly is performed within the framework of a single physical/chemical process and uniform technological equipment.

Abstract: A process and apparatus for manufacturing Solid Solder Deposit-Printed Circuit Board (SSD-PCB) by melting dry solder powder previously deposited on a pocketed-PCB 20. The process and apparatus utilize as heat source an electrically heated conveyor wire mesh 76 instead of a reflow oven. This invention, unlike the prior art for producing SSD-PCB, can readily utilize dry solder powder in conjunction with flux layers 116 separately deposited on top of the conveyor wire mesh 76 thereby excluding the use of solder paste and associated paste printing equipment. Specifically the invention reduces the manufacturing cost because: shortens manufacturing time, reduces manufacturing energy consumption and requires less manufacturing equipment than prior art.

Abstract: The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.

Abstract: In a wire-bonding process, a chip is provided with at least a first contact pad. A chip carrier is further provided with at least a second contact pad. A plurality of stacked conductive bumps are formed on the first contact pad. A conductive wire is formed by a reverse bonding process. The conductive wire electrically connects the second contact pad of the chip carrier to the stacked conductive bumps over the first contact pad of the chip.

Abstract: An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.

Abstract: A rivet having improved formability is provided. The rivet has a shank having a head at one end. The shank and the head have a refined grain structure. The rivet is manufactured from the region of the workpiece having a refined grain structure by first forming a region having a refined grain structure in a workpiece and then forming the rivet. The refined grain structure results in improved mechanical properties, such as formability, strength, toughness, ductility, corrosion resistance, and fatigue resistance. The improved formability of the rivet reduces the formation and propagation of cracks during the manufacture and installation of the rivets.

Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.