Abstract: A semiconductor device with repair fuses is provided, which decrease the fuse pitch and the fuse occupation area without short circuit among the adjoining repair fuses and damage to the semiconductor device itself.

Abstract: A computer enclosure (100) includes a computer housing (1) and a drive bracket (6) mounted in the housing. The computer housing has at least a front panel (10), a side panel (50) and a bottom panel (30). The front panel has at least one finger (12). The side panel (50) has two supporting plates (52) each having a plurality of cutouts (53). The bottom panel has at least one post (32). The drive bracket has a base (60), a first side wall (62), a second side wall (64) and an end wall (66) which together define a space for receiving a disk drive therein. The first side wall forms a second chamber having a pair of opposite faces (74) abuttingly secured between the supporting plates of the side panel. The second side wall forms a bent plate (82) defining at least one aperture (84) for engagement with the finger of the front panel. The end wall defines a cutout (65) to retain the post of the bottom panel.

Abstract: A lid assembly that includes a lid and a coupling mechanism for coupling the lid to a palmtop computer system. The coupling mechanism is double jointed so as to move the lid from a closed position to an open position. In one embodiment, the coupling mechanism includes a plate and two clips that attach to the plate such that the clips rotate relative to the plate. The plate couples to the lid such that the lid rotates relative to the plate. In the closed position, the lid covers the display of the palmtop computer system. The lid is movable into the open position. In the open position, the display is uncovered and the lid is disposed against the rear side of the palmtop computer system. In one embodiment, the lid includes an opaque region and a non-opaque region. The non-opaque region allows for viewing a portion of the display of the palmtop computer while the lid is in the closed position.

Abstract: A door mechanism comprises a frame having an insertion port and first and second door panels. The first and second door panels have respective pivot shafts rotatably connected to the frame. These door panels are supported by the frame such that they can swing about the respective pivot shafts between closed positions in which they close the insertion port, and open positions in which they open the insertion port. The first and second door panels are swung apart in opposite directions when they are shifted from the respective closed positions to the respective open positions. The first and second door panels are urged by a spring toward the respective closed positions.

Abstract: An electronic circuit module has at least one electronic component and a heat sink, which is thermally connected to the at least one electronic component. A thermal conduction path between the at least one electronic component and the heat sink is formed by an intermediate layer, which adjoins a surface of the heat sink. The intermediate layer is formed by an island-like structure including pillars of a flexible, thermally conductive material.

Abstract: A heat conducting apparatus includes a heat pipe and a heat pipe supporting mechanism. The heat pipe conducts heat between a first member and a second member connected by hinge sections. The heat pipe has a first end portion attached to one of the first and second members and a second end portion extending substantially along a center line of the hinge sections. A heat pipe supporting mechanism is disposed on a member different from the one of the first and the second members of the heat pipe. The heat pipe supporting mechanism supports the second end portion so that the second end portion can freely move within a given range. The heat pipe supporting mechanism forms a thermal path between the first and second members together with the heat pipe.

Abstract: A drive bracket (8) for a data storage device includes a body (10) and a lever (50). The body includes a bottom panel (12) and two side walls (14, 16) extending from opposite side edges of the bottom panel. The body has a pair of sliding slots (18) for receiving bolts (70) attached to a data storage device. The lever has a base (51) and two side plates (53) extending from opposite ends of the base. The two side plates are pivotally attached to the side walls of the body for being movable toward a closed position where the side plates engage the bolts and thus retain the data storage device in the body.

Abstract: A heat sink apparatus includes a first heat sink thermally coupled with at least a first component of a substrate, and a second heat sink thermally coupled with at least a second component of the substrate. The apparatus further includes a unitary retention module coupled with the first heat sink and the second heat sink, where the unitary retention module is also coupled with the substrate.

Abstract: A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A planar single- or multi-layer membrane structure is attached to a carrier frame, and a via pattern is formed in the membrane. Power devices are aligned and attached to the planar membrane structure; a top layer interconnect structure is formed by metalizing the vias and the film; and a circuit is formed by patterning a deposited metal layer. The carrier frame is removed, and upper and lower thermal base plate sub-assemblies are attached to the power device-on-membrane structure. The planar device-on-membrane structure accommodates different types of power devices having variations in thickness. The thermal base plate sub-assemblies may include integral, high-performance heat exchangers for providing a low thermal resistance path to the ambient.

Abstract: The conventional rails of a standard computer chassis are removed and elongated heat sink members, having substantially the same general dimensions as the rails, are substituted for the rails to provide highly conductive heat transfer from the hard disk drive to which the heat sink members are connected. Moreover, the heat sink members are provided with channels along their entire length through which air flow can be directed to provide additional heat removal by convection. Air flow is preferably facilitated by use of small fans located at the ends of the heat sink members, at least one such fan for each such heat sink member which fits within the width and height outline of the disk drive/heat sink member combination thereby requiring minimal space and no alteration to existing computer chassis dimensions.

Abstract: The invention provides for an apparatus and method for quickly attaching a disk drive to a computer chassis and for quickly removing a disk drive from a computer chassis. The sliding of a slide member that is slidably coupled to a bracket is employed to secure a disk drive in the bracket. Sliding of the slide member in an opposite direction releases the disk drive from the bracket. The bracket is coupled to the computer chassis.

Abstract: Apparatus for mounting a circuit board within the chassis of an electronic device are disclosed. The chassis of an electronic device includes a mounting panel assembly having at least one slot for receiving a standoff mounted to the circuit board. Each slot includes a first end suitable for allowing insertion and removal of the standoff through the slot and a second end suitable for engaging the standoff to retain the standoff in the slot for securing the circuit board to the mounting panel assembly. A ramp member extends beneath the slot adjacent to the first end for urging the standoff toward the second end when the standoff is inserted in the slot through the first end.

Abstract: A device housing adapted to receive a data storage device therein includes a base and a pair of grounding clips attached to the base. The base includes a pair of side walls each defining a pair of gaps. Each grounding clip forms a pair of fixing portions for engaging with the gaps of the base. A contact finger extends from each fixing portion for contacting the data storage device to form a grounding path from the data storage device internal to the housing to an outside of the side walls.

Abstract: A detachable computer mainframe and peripheral rack mounting arrangement includes a computer mainframe, and a peripheral rack detachably fastened to the top panel of the computer mainframe to hold a computer peripheral apparatus, the top panel of the computer mainframe having two parallel rows of locating holes bilaterally formed on a top panel thereof, the locating holes each having one end terminating in a reduced portion, the peripheral rack having a plurality of bottom retainers adapted for inserting into the locating holes of the top panel of the computer mainframe and engaging into reduced portion of each locating hole upon forward movement of the peripheral rack on the top panel of the computer mainframe and after insertion of the bottom retainers into the locating holes of the top panel of the computer mainframe.

Abstract: A circuit assembly includes a printed circuit board which has a plurality of copper traces formed thereon. Heat generating electronic components are surface mounted on the board in contact with parts of the traces. A heat conducting copper plate is mounted on the board adjacent to and spaced apart from the electronic components, and in contact with other parts of the traces. A silicon pad is mounted on the plate, and a heat sink member is mounted on the pad so that the pad is between the heat sink member and the traces. Heat conducting solder bridges are formed between the edges of the electronic components and the edges of the plate.

Abstract: An electronic assembly is provided. An electronic substrate of the assembly has a plurality of conductive lines to transmit signals, and a cooling opening therethrough. The cooling opening has an inlet to allow fluid into the electronic substrate, a section in the electronic substrate through which the fluid flows from the inlet, and an outlet from which the fluid flows from the section out of the electronic substrate. A semiconductor die of the assembly is mounted to the electronic substrate. The die has an electronic circuit connected to the metal lines so that signals are transmitted between the electronic circuit and the metal lines, operation of the electronic circuit causing heating of the die, heat being transferred from the die to the electronic substrate from where heat is transferred to the fluid flowing through the section.

Abstract: A hinged housing for an electronic device having a first body portion defining a first plane and having a surface with a control panel and a second body portion defining a second plane and having a mounting surface. The first and second body portions are pivotally hinged to rotate between a first position, in which said first plane and said second plane are at an obtuse angle, and a second position, in which the first plane and the second plane are oblique, such that in the second position the control panel is rotated at an angle greater than 180 degrees from the mounting surface. A hinged housing for an electronic device having a first body portion defining a first plane and having a surface with a control panel and a second body portion defining a second plane and having a mounting surface.

Abstract: A self-contained field replaceable module that is adapted for low thermal resistance slideable contact with a heat sink that does not require interface pressure to ensure the contact and that is tolerant of misalignment is presented. The invention includes an interdigitated arrangement of the heat sink and field replaceable module. The field replaceable module includes a lid which forms a sealed cavity around at least one electronic component on the printed circuit board of the field replaceable module. The lid provides spray cooling or conduction cooling to the sealed electronic components. The lid includes a major surface having digit members extending longitudinally therefrom. The heat sink includes a major surface having digit members extending longitudinally therefrom. The digit members of the heat sink and field replaceable module are arranged in interdigitated arrangement for transferring heat from the field replaceable module to the heat sink.

Abstract: A push button current cut-off safety switch comprising a housing having an opening; a push button mounted within the housing and being fitted to said opening; a push rod being mounted below said push button and including a triangular passage and an insulating element; a spring being inserted into and compressed by the push rod; an interlinking rod having one end pivotally connected to the housing and the other end being connected to the triangular passage of the push rod; a first conductive plate; a second conductive plate being connected to the first conductive plate by a resilient plate such that the downward movement of the push rod electrically connects to the first and the second conductive plates and the upward movement of the push button disconnects the first and the second conductive plates; an alloy metal made of a shape memory alloy which is thermally deformable, said alloy metal being linked to the second conductive plate and connected to the interlinking rod; a third conductive plate being connect

Abstract: A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components—namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor—are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate.