Patents Examined by Leonard R. Leo
  • Patent number: 11713926
    Abstract: Provided is a heat exchanger, including a plurality of heat exchange members arranged in a first direction so as to be spaced apart from each other. Each of the plurality of heat exchange members includes: a heat transfer pipe extending in a second direction intersecting with the first direction; and a heat transfer plate provided to the heat transfer pipe along the second direction. The heat transfer plate includes extending portions extending away from the heat transfer pipe in a third direction intersecting with each of the first direction and the second direction. The heat transfer plate is formed separately from the heat transfer pipe.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: August 1, 2023
    Assignees: Mitsubishi Electric Corporation, The University of Tokyo
    Inventors: Yuta Komiya, Shinya Higashiiue, Tsuyoshi Maeda, Ryota Akaiwa, Shigeyoshi Matsui, Akira Ishibashi, Eiji Hihara, Chaobin Dang, Jiyang Li
  • Patent number: 11686532
    Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: June 27, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chi-Chuan Wang, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
  • Patent number: 11683917
    Abstract: In a housing of a vehicle control device are formed a suction port for taking outdoor air and a discharge port for discharging air taken in through the suction port. A flow passage that connects the suction port and the discharge port is formed inside the housing. A blocking member, a radiator, and a blower are provided in the flow passage. The blocking member is provided at a position where the blocking member faces at least a portion of an opening face of the suction port in the flow passage and a distance between the blocking member and the suction port is in a predetermined range.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: June 20, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kentaro Yano, Morito Oh
  • Patent number: 11662148
    Abstract: In a heat exchanger, each of a plurality of heat exchange members includes: a flat pipe; and a heat transfer plate integrated with the flat pipe along a longitudinal direction of the flat pipe. A width direction of each of the flat pipes intersects with a direction in which the plurality of heat exchange members are arranged side by side. Each of the heat transfer plates includes an extending portion extending outward in the width direction of each of the flat pipes from at least one of one end of a corresponding one of the flat pipes in the width direction and another end of the corresponding one of the flat pipes in the width direction. Each of the flat pipes has one or more flat pipe bent portions, each forming a groove extending along the longitudinal direction of the flat pipes.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: May 30, 2023
    Assignees: Mitsubishi Electric Corporation, The University of Tokyo
    Inventors: Akira Ishibashi, Tsuyoshi Maeda, Shinya Higashiiue, Daisuke Ito, Shin Nakamura, Ryota Akaiwa, Akira Yatsuyanagi, Ryuichi Nagata, Eiji Hihara, Chaobin Dang, Jiyang Li
  • Patent number: 11665858
    Abstract: An apparatus includes multiple thermal interface segments collectively forming a discontinuous thermal interface configured to contact a curved surface of an object. The discontinuous thermal interface is configured to transfer thermal energy to or receive thermal energy from the curved surface of the object. Each of the thermal interface segments includes a major surface that is curved. The curved major surface of each of the thermal interface segments is configured to register with the curved surface of the object and has a specified area that is based on a Hertzian contact area defined partially by the curved surface of the object. The apparatus can also include a thermal gap pad configured to be compressed between the thermal interface segments and the object.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: May 30, 2023
    Assignee: Raytheon Company
    Inventor: Dominic R. Gooden
  • Patent number: 11658096
    Abstract: A floating heat sink includes an elastic support and a heat dissipating piece. The elastic support is integrally formed and includes at least two fasteners and at least two elastic arms. The fasteners are configured to mount the heat dissipating piece. All the fasteners and all the elastic arms are arranged around the heat dissipating piece. Two ends of the elastic arm are both connected to the fastener, and the two ends of the elastic arm are arranged in a circumferential direction of the heat dissipating piece. A middle part of the elastic arm is configured to be connected to a board in a fastened manner, and the middle part of the elastic arm is bent toward the board.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: May 23, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jingfeng Yang, Yehua Zhang, Yanghao Sun, Jiping Peng, Baojian Du, Yi Zheng
  • Patent number: 11644254
    Abstract: A thermal transfer device has a body and a fluid conduit defined in the body. The body has a thermal transfer surface configured to be placed in contact with a target component. The fluid conduit is configured for conveying fluid through the body and is thermally coupled to the thermal transfer surface.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: May 9, 2023
    Assignee: OVH
    Inventors: Henri Klaba, Ali Chehade, Hadrien Bauduin, Angelos Lyris
  • Patent number: 11614288
    Abstract: A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: March 28, 2023
    Assignee: NEC CORPORATION
    Inventors: Koichi Todoroki, Minoru Yoshikawa, Masaki Chiba
  • Patent number: 11573054
    Abstract: Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: February 7, 2023
    Assignee: CommScope Technologies LLC
    Inventor: Kevin E. Craig
  • Patent number: 11541716
    Abstract: Disclosed herein is an air conditioner for a vehicle, which can prevent reduction of an air volume by reducing a back-and-forth width of the vehicle and sufficiently securing the degree of opening of a warm air bypass door, and control an efficient linkage between the warm air bypass door and a defrost door. The air conditioner includes: an air-conditioning case having an air passageway formed therein; a heat exchanger for cooling and a heat exchanger for heating which are disposed in the air passageway of the air-conditioning case to exchange heat with air passing the air passageway; a warm air bypass passageway for directly discharging the air passing the heat exchanger for heating to a front seat floor vent; and a warm air bypass door for adjusting the degree of opening of the warm air bypass passageway, wherein the warm air bypass door includes a rotary shaft and a plate, and the plate has a bent portion to have at least two sides.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: January 3, 2023
    Assignee: Hanon Systems
    Inventors: Tae Wan Kim, Yong Eun Seo, Jeong Hun Seo, Jong Gon Lee, Myoung Jun Kim, Tae Gun Lee
  • Patent number: 11493280
    Abstract: A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: November 8, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Te-Hsuan Chin
  • Patent number: 11486654
    Abstract: An arrangement for storing thermal energy, which has a three-dimensionally configured heat accumulator is provided. The latter contains a solid natural material for heat storage. The heat-storage material is enclosed by a fluid-impermeable, flexible layer such that the heat-storage material is insulated at least in a pressure-tight manner with regard to the environment of the heat accumulator. A flexible cover layer is provided, which is coupled to the fluid-impermeable flexible layer such that the flexible cover layer applies a surface force to the fluid-impermeable flexible layer. As a result, the fluid-impermeable flexible layer is pressed areally onto the heat-storage material. The flexible cover layer (i) has the form of a mesh or (ii) is configured in the form of sheet-metal plates overlapping one another in an imbricated manner.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: November 1, 2022
    Inventor: Patrick Inhetveen
  • Patent number: 11473855
    Abstract: Passive radiative cooling structures and apparatus manufactured with such cooling structures conserve energy needs. A flexible film transparent to visible light incorporates particles at a volume percentage larger than 25% so as to absorb and emit infrared radiation at wavelengths where Earth's atmosphere is transparent. Another film transparent to visible light is thin and flexible and configured to absorb and emit infrared radiation at wavelengths where Earth's atmosphere is transparent, wherein etchings or depositions are present on one or both surfaces. A high efficiency cooling structure has an emissive layer sandwiched between a waveguide layer and a thermal conductive layer. A solar cell panel is covered by a transparent passive radiative cooling film. A container housing an active cooling unit incorporates passive radiative cooling structures on one or more exterior surfaces.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: October 18, 2022
    Inventor: Romy M. Fain
  • Patent number: 11458810
    Abstract: Provided is an air-conditioning device for a vehicle, including: a cooling device configured to cool air passing through a duct; a heater core, which is arranged in the duct on a downstream side of airflow with respect to the cooling device, and is configured to use an engine coolant as a heat source to heat the air; a water valve provided in a coolant circulation system on an upstream side of the heater core; and a controller configured to control those components, in which the controller is configured to decrease an opening amount of the water valve in a predetermined cooling mode. The control is configured to, when the opening amount of the water valve is decreased, decrease a rotational speed of a compressor of the cooling device, and increase a target evaporator temperature of an evaporator of the cooling device, thereby decreasing cooling performance of the cooling device.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: October 4, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Takayuki Shimauchi
  • Patent number: 11428479
    Abstract: Embodiments are disclosed of a thermal control plate including a cooling layer and a heating layer. The cooling layer includes a thermally conductive base adapted to be thermally coupled to one or more heat-generating electronic components, cooling fins thermally coupled to the base, and a cooling cover plate coupled to the ends of the plurality of cooling fins. The thermally conductive base, the cooling cover plate, and the plurality of cooling fins form a plurality of cooling channels through which a working fluid can flow. The heating layer includes a heater, heating fins thermally coupled to the heater, and a heating cover plate coupled to the ends of the plurality of heating fins. The heater, the heating cover plate, and the heating fins form a plurality of heating channels through which the working fluid can flow. A fluid distribution can distribute the working fluid into the heating channels and cooling channels.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: August 30, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11428476
    Abstract: The invention provides, in some aspects, a thermal storage system that has one or more fluid-transport vias that contain a heat transfer fluid and that are disposed in thermal coupling with a form of graphite, e.g., expanded graphite. The graphite form is, in turn, disposed in thermal coupling with a bonded aggregate material.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: August 30, 2022
    Inventor: Kentwell Lee McCormick
  • Patent number: 11421939
    Abstract: An inlet distributor for a plate heat exchanger is disclosed. The plate heat exchanger includes a plate set. A fluid channel is formed between each two adjacent plates of the plate set, and each plate has first fluid openings and second fluid openings to form inlet channels and outlet channel for fluid to alternatively flow into and out of the fluid channels. The inlet distributor includes a collecting pipe, and at least one horizontal partition plate disposed on the inner wall of the collecting pipe. The collecting pipe can be mounted on an inlet end of the inlet channel, and the horizontal partition plate is coaxially extended into the inlet channels. When the fluid flows into the collecting pipe, the horizontal partition plate separates liquid and vapor of the fluid and guides the vapor to fluid channel in different position away from the inlet end, along the horizontal partition plate.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: August 23, 2022
    Assignees: NATIONAL CENTRAL UNIVERSITY, WROCLAW UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Chien-Yuh Yang, Fu-Chen Lin, Ziemowit Malecha, Pawel Pluszka
  • Patent number: 11407279
    Abstract: A vehicular air conditioner includes an air conditioning, a heater core, a heat pump cycle unit, a temperature detector, and a controller. The heat pump cycle unit includes a first inside heat exchanger disposed downstream of the heater core in a flow direction of a conditioning air, a second inside heat exchanger disposed upstream of the heater core in the flow direction of the conditioning air, and an outside heat exchanger. The temperature detector is configured to detect a passage air temperature, the passage air temperature being a temperature of the conditioning air that has passed through the heater core. The controller is configured to selectively switch a circuit layout of the heat pump cycle unit between a cooling circuit, a heating circuit, and a dehumidifying-heating circuit based on the passage air temperature.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: August 9, 2022
    Assignee: DENSO CORPORATION
    Inventors: Akira Yamaguchi, Yoshiharu Endo, Tetsuya Takechi, Terukazu Higuchi
  • Patent number: 11412636
    Abstract: A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, and at least a second conduit. The at least a first and second conduits have first and second modifiable portions comprising first and second openings submerged within the dielectric thermally conductive fluid, respectively. The at least one of the first conduit or second conduit circulates dielectric thermally conductive fluid from a heat exchanger outlet into the fluid-tight containment vessel and the other, circulates dielectric thermally conductive fluid from the fluid-tight containment vessel to a heat exchanger inlet via the pump. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: August 9, 2022
    Assignee: Cooler Master Co., Ltd.
    Inventors: Sy chi Kuo, Yu lun Huang
  • Patent number: 11378340
    Abstract: A heat transfer device includes a storage chamber, a coolant housed within the storage chamber, a cooling chamber, one or more heat transfer components, a fluid passage between the storage chamber and the cooling chamber, and a barrier element. The one or more heat transfer components facilitate heat transfer from a heat source outside of the cooling chamber to the cooling chamber. The barrier element may have (i) a closed configuration, and (ii) an open configuration in which the barrier element is configured to allow the coolant in the storage chamber to flow from the storage chamber into the cooling chamber. The barrier element may reconfigure from the closed configuration to the open configuration in response to a trigger condition, such as the coolant housed within the storage chamber reaching a trigger temperature and/or the initial pressure of the coolant housed within the storage chamber reaching a trigger pressure.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: July 5, 2022
    Assignee: The Boeing Company
    Inventors: Ernest E. Bunch, Christopher C. Veto, James J. Lucas, Garrett W. Ek, Douglas H. Van Affelen, Michael F. Stoia