Abstract: Disclosed is a four-in-one mini-LED module, a display screen, and a manufacturing method thereof. The four-in-one mini-LED module comprises a substrate and a plurality of RGB-LED chip sets arranged in an array on the substrate. The RGB-LED chip sets are provided with glue layers. Each RGB-LED chip set comprises an R chip, a G chip and a B chip, each chip has a first electrode and a second electrode, and the first electrode and the second electrode have opposite polarities. The first electrodes of all the chips of the same row are electrically connected, the second electrodes of all the R chips of the same column are electrically connected, the second electrodes of all the G chips of the same column are electrically connected, and the second electrodes of all the B chips of the same column are electrically connected.

Abstract: A method and system of processing a semiconductor substrate includes, in one or more embodiments, depositing a protective layer on the substrate surface comprising a conductive element disposed in a dielectric material; processing the protective layer to expose the conductive element; electrolessly depositing a metallic passivating layer onto the conductive element; and removing at least a portion of the protective layer from the substrate after electroless deposition. In another aspect, a method and system of processing a semiconductor includes depositing a metallic passivating layer onto a substrate surface comprising a conductive element, masking the passivating layer to protect the underlying conductive element of the substrate surface, removing the unmasked passivating layer, and removing the mask from the passivating layer.