Patents Examined by Linda Gray
  • Patent number: 7138030
    Abstract: An in-line system for fabricating a liquid crystal display-includes a sealer coating unit for coating a sealer onto a first substrate with a plurality of liquid crystal display cell regions, a liquid crystal injection unit for dropping a liquid crystal onto the first substrate coated with the sealer, and an assembly unit for assembling the first substrate with the second substrate. A sealer hardening unit hardens the sealer interposed between the first and the second substrate to thereby assemble the first and the second substrate with each other. A substrate cutting unit cuts the first and the second substrates along cutting lines through illuminating a laser beam along the cutting lines such that the first and the second substrates are severed into the liquid crystal display cell regions.
    Type: Grant
    Filed: January 22, 2004
    Date of Patent: November 21, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae-Ho Choo, Sang-Jun Lee, Yong-Joon Kwon
  • Patent number: 7135083
    Abstract: An apparatus for feeding and cutting lengths of tape and advancing the lengths to a vacuum wheel applicator, the feed section of the apparatus comprising a feed roll, an anvil vacuum roll, and a rotary knife adjacent to the anvil vacuum roll, and means for adjusting the speed of the feed roll and the speed of the anvil vacuum roll to vary the length of the tape advanced to the applicator, and a tape roll splicing assembly to provide a continuous supply of tape to the apparatus.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: November 14, 2006
    Assignee: Adalis Corporation
    Inventors: Scott K. Middelstadt, James N. Hartman, Peter M. Downie
  • Patent number: 7132031
    Abstract: In a process for making disposable diapers, a first web is continuously fed in its longitudinal direction. Tape fastener members extending in the longitudinal direction are fed to the first web so as to straddle respective lines corresponding to the side edges of the respective backsheets. Each of the tape fastener members has its longitudinally opposite end portions folded in a Z-shape or an inverted Z-shape. Top sections of these Z-shape and inverted Z-shape are coated on their undersides with a first self adhesive and bottom sections of these Z-shape and inverted Z-shape are coated on their undersides with a second self-adhesive. The tape fastener member is bonded to the first web by means of the second self-adhesive. The first web and the tape fastener members are simultaneously cut along the lines.
    Type: Grant
    Filed: January 6, 2004
    Date of Patent: November 7, 2006
    Assignee: Uni-Charm Co., Ltd.
    Inventors: Masaya Ohiro, Akihisa Shiomi, Kyoko Ito, Kyota Saito, Akihide Ninomiya
  • Patent number: 7125468
    Abstract: Method of making a gas matrix composite ultrasound transducer comprises aligning piezoelectric rods or fibers substantially parallel to each other on an adhesive side of a plurality of curable adhesive-faced sheets, stacking the sheets so as to maintain the gaps between the rods or fibers, curing the adhesive, cutting the cured structure perpendicular to the rods or fibers into narrow slices, and applying a conductive layer to each cut face to form electrical contacts with both ends of the rods or fibers.
    Type: Grant
    Filed: May 6, 2004
    Date of Patent: October 24, 2006
    Assignee: The Ultran Group
    Inventor: Mahesh C. Bhardwaj
  • Patent number: 7125454
    Abstract: This invention relates to a device for moistening envelope flaps, comprising a reservoir of liquid, means for pumping this liquid and, disposed transversely with respect to a direction of advance of the envelopes and inclined with respect to a horizontal plane for supporting these envelopes, means for spraying on the envelope flaps a part of the liquid pumped from the reservoir of liquid. This inclination of the spray means corresponds to the angle of inclination of the flaps of envelopes with folded down flaps.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: October 24, 2006
    Assignee: Neopost Industrie
    Inventors: Jean-Pierre Gregoire, Alain Philippe
  • Patent number: 7118645
    Abstract: A method for joining a protective tape to a semiconductor wafer includes the steps of: mounting a semiconductor wafer, which has a surface with a pattern formed thereon, on a holding member; joining a protective tape, which protects the pattern, to the surface of the semiconductor wafer and, also, to a surface of an outer peripheral member disposed around the holding member; and cutting out the protective tape along an outer circumference of the semiconductor wafer. The holding member and the outer peripheral member are disposed on a holding table, which holds the semiconductor wafer, so as to be adjacent to each other, and the outer peripheral member is formed from a member which is different from that of the holding table.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: October 10, 2006
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Yamamoto
  • Patent number: 7108763
    Abstract: A method for manufacturing multi-laminar wood sheets by slicing from a flitch of natural and/or laminated wood sheets glued and pre-printed with a basic pattern. A basic pattern is printed on one or both faces of wood sheets obtained by rotary cutting or slicing a natural log or a multi-layered flitch; the printed sheets are subsequently used to form a final flitch from which multi-laminar wood sheets are then sliced having a pattern designed to simulate different types of natural or fancy woods. The basic pattern is printed while maintaining process conditions designed to control the penetration into the thickness of the wood sheet and surface diffusion of the colouring agent during printing step. The penetration and diffusion of the colouring agent is controlled by maintaining process parameters and conditions at an established value.
    Type: Grant
    Filed: July 3, 2002
    Date of Patent: September 19, 2006
    Inventor: Giovanna Senzani
  • Patent number: 7096914
    Abstract: In an embodiment of the invention an apparatus is configured to stack a plurality of semiconductor chips having the same or similar size. The apparatus includes a tape providing unit for providing an insulating adhesive tape, a tape attaching device for attaching the insulating adhesive tape to an area between electrode pads of a first chip, and a chip attaching device for attaching a second chip to the insulating adhesive tape.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: August 29, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Kuk Kim, Min-Il Kim, Sang-Yeop Lee, Chang-Cheol Lee
  • Patent number: 7094305
    Abstract: A method of producing batches of micro particles includes affixing a substrate sheet to a support and cutting the substrate sheet with a laser device to define a plurality of micro particles. Before, after or during the cutting of the substrate sheet, the region of the substrate sheet defining each micro particle is marked with a code or other identifying marking using a laser device. The code or other identifying marking is unique to the particular batch of micro particles to uniquely identify that batch. The micro particles are removed from the support by a solvent. Preferably, a single laser device is used for cutting the substrate sheet and marking the micro particles. Alternatively, separate laser devices may be used for cutting the substrate sheet and marking the micro particles.
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: August 22, 2006
    Inventor: Michael Cleary
  • Patent number: 7086926
    Abstract: A shoulder strap pad assembly is provided that includes: a top cover, a bottom cover, and a cushion filler. The bottom cover is laminated to the top cover to form an enclosure in which the cushion filler is secured. The top cover has a top fabric layer, a first adhesive web layer positioned below the top fabric layer and a first base layer positioned below the first adhesive layer on a side opposite that of the top fabric layer. The bottom cover has a second base layer, a second adhesive web layer positioned above the second base layer. The cushion filler has a cushion layer, a third adhesive web layer positioned above the cushion layer, a fourth adhesive web layer positioned below the cushion layer, and a third base layer positioned below the fourth adhesive web layer. In a preferred embodiment, the pad assembly is attached to a piece of fabric to form a channel in which a brassiere shoulder strap is positioned.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: August 8, 2006
    Assignee: Playtex Products, Inc.
    Inventor: Gloria Falla
  • Patent number: 7083699
    Abstract: Methods and apparatus for masking a selected portion of a workpiece are disclosed. A method in accordance with an exemplary embodiment of the present invention may include the steps of providing a workpiece having a shape, providing a mask having a similar shape, and urging an adhesive side of the mask against a first surface of the workpiece. A cutter may be used to form a plurality of cuts in the sheet without contacting the workpiece with the cutter. The plurality of cuts may be arranged to define a mask having a desired shape. The mask may be centered on the workpiece.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: August 1, 2006
    Assignee: Cardinal IG Company
    Inventor: Paul Trpkovski
  • Patent number: 7077928
    Abstract: A process for the manufacture of a label stock carrier from a multi-layer structure having a carrier strip covered on its two faces by respective first and second adhesive films designed to be cut to form a first and second series of labels respectively. The second adhesive film is temporarily separated from the carrier strip during the cutting operation on the first adhesive film to form the first series of labels. In accordance with another aspect, the labels of the first series of labels are superposed and disposed within corresponding peripheries of the second series of labels.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: July 18, 2006
    Assignee: L'Oreal
    Inventor: Alain Bethune
  • Patent number: 7074296
    Abstract: A method of manufacturing a hearing device including providing a hearing aid housing having an opening, providing an electric/acoustic transducer, providing a support plate forming a blind hole having a membrane as a base, inserting the transducer into the blind hole, bringing the housing and support plate together such that a portion of the transducer enters through the opening in the housing, bonding the housing to the support plate, and trimming excess portion of the support plate.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: July 11, 2006
    Assignee: Phonak AG
    Inventor: Andi Vonlanthen
  • Patent number: 7070672
    Abstract: A process (100) for forming an article (20) includes delivering an article web (120) which provides an interconnected plurality of article-segments (104). At least one selected article-segment (104) can include at least one wing-panel component or member (142), which has been operatively joined to its corresponding, selected article-segment (104) and configured to extend beyond at least one laterally-opposed side edge of said article web (120) in an intermediate portion (76) of the corresponding article-segment (104). The process (100) can also include a substantially continuous severing of the article web (120) and the at least one wing-panel member (142) to provide a contoured composite web. The contoured composite web can include at least one contoured wing-panel (142). In addition, a contoured side-edge (64) of the contoured wing-panel (142) can be configured to extend substantially continuously from a cooperatively contoured side-edge (74) of the article web.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: July 4, 2006
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Glory Framary Alcantara, David Joseph Nickel, Arthur Wesley Leiphart
  • Patent number: 7067031
    Abstract: Disclosed is a process for making a ceramic armor plate. A backing element having a known two-dimensional size is provided. A plurality of ceramic armor tiles are placed side by side to form a layer of ceramic armor tiles on a front surface of the backing element, and the layer of ceramic armor tiles is affixed to the backing element. An abrasivejet cutter is used to cut continuously through at least two adjacent ceramic armor tiles of the affixed layer of ceramic armor tiles, and through a corresponding portion of the backing element affixed thereto, so as to delineate a portion of a ceramic armor plate.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: June 27, 2006
    Assignee: DEW Engineering and Development Limited
    Inventor: Fabio deWitt
  • Patent number: 7067030
    Abstract: A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: June 27, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Kazuyuki Kiuchi, Toshiyuki Oshima, Akihisa Murata, Yukio Arimitsu
  • Patent number: 7063118
    Abstract: A fully automated method and apparatus is disclosed to laminate various structural articles with a layer of resin impregnated fiber tape. The tape laying member removes a releasable backing layer from the tape being employed, then deposits the unbacked tape on the surface of the structural article, and finally severs the end of the tape being deposited. An automated cut and restart procedure is employed in the present tape laying member to increase tape throughput.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: June 20, 2006
    Assignee: ADC Acquisition Company
    Inventors: David E. Hauber, Rob J. Langone, James P. Martin, Scott F. Miller, Michael J. Pasanen
  • Patent number: 7045033
    Abstract: In a system for constructing a three-dimensional object by selective attachment of a plurality of sheets of flexible material, each sheet being cut along at least one contour line so as to subdivide the sheet into at least one object forming region corresponding to the shape of a layer of the object bounded by a corresponding contour of the object and at least one residue region not required in the constructed object, at least part of each object forming region being attached to object forming regions of adjacent layers, a method for facilitating the removal of the residue regions including producing selective attachment of at least part of a plurality of the residue regions to the residue regions of adjacent sheets in such a manner as to form, from at least part of the residue regions of a plurality of the sheets, a plurality of residue elements non-rigidly interconnected such that manual removal of each of the residue elements initiates removal of a subsequent one of the residue elements.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: May 16, 2006
    Assignee: Solidmension Ltd.
    Inventors: Yossi Bar-Erez, Eyal Bar-Erez
  • Patent number: 7033457
    Abstract: Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: April 25, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Woo Kim, Young-Sang Cho, Dek-Gin Yang, Kyu-Hyok Yim
  • Patent number: 7025849
    Abstract: Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: April 11, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Woo Kim, Young-Sang Cho, Dek-Gin Yang, Kyu-Hyok Yim