Patents Examined by Ljiljana (Lil) V Ciric
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Patent number: 7886812Abstract: A heat exchanger comprising a heat exchange core composed of tube groups in the form of rows arranged in the direction of flow of air through the exchanger, each of the tube groups including a plurality of heat exchange tubes arranged at a spacing. A refrigerant inlet header and a refrigerant outlet header are positioned at the upper end of the core and having respective groups of heat exchange tubes joined thereto. A refrigerant turn tank is disposed at the lower end of the core. The turn tank has its interior divided by a partition wall into a refrigerant inflow header and a refrigerant outflow header. The heat exchange tubes have lower end portions inserted in the headers and are joined to the headers. Refrigerant passing holes are formed in the partition wall. The heat exchange tubes have their lower ends positioned below the lower ends of the holes.Type: GrantFiled: October 29, 2004Date of Patent: February 15, 2011Assignee: Showa Denko K.K.Inventor: Naohisa Higashiyama
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Patent number: 7886815Abstract: A vehicle heating, ventilation, and air conditioning system includes front and rear HVAC systems. A controller receives data from front and rear control panels and controls the front and rear HVAC systems. Actuating a rear manual button on the front control panel allows control of the rear HVAC system via the rear control. Engine coolant temperature is used to judge if the vehicle has been inoperative for a long time. If the vehicle has not been inoperative for long, and the rear manual button was actuated prior to the vehicle shut down, rear manual control over the rear HVAC system is enabled. If the vehicle has been inoperative for a long time, or if the rear manual button was not actuated immediately prior to vehicle shut down, rear manual control is not enabled, thereby preventing operation of the rear HVAC system by the rear control panel.Type: GrantFiled: February 21, 2007Date of Patent: February 15, 2011Assignee: Honda Motor Co., Ltd.Inventors: Bradley C. Errington, Junichi Kanemaru, Trevor Burns
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Patent number: 7886808Abstract: A substrate heating chamber and a substrate cooling chamber each capable of simultaneously holding a plurality of substrates are provided in a thermally separated state in a heating and cooling apparatus with a single vacuum processing chamber. The substrate heating chamber is equipped with a plurality of communicating or non-communicating substrate holding spaces. The substrate cooling chamber is also equipped with a plurality of communicating or non-communicating substrate holding spaces. The communicating substrate holding spaces allow the batch heat treatment of substrates, while the non-communicating substrate holding spaces allow the batch or individual processing of substrates.Type: GrantFiled: December 13, 2006Date of Patent: February 15, 2011Assignee: Canon Anelva CorporationInventors: Toshiaki Koguchi, Kazuhito Watanabe, Nobuyuki Takahashi
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Patent number: 7886811Abstract: An evaporator includes a refrigerant inlet header and a refrigerant outlet header arranged side by side in a front-rear direction, and a refrigerant circulating passage holding the headers in communication. The inlet and outlet headers are provided with caps forming refrigerant inlet and refrigerant outlet, the caps are joined to a pipe joint member having refrigerant inlet and outlet portions in communication with the refrigerant inlet and outlet, the caps or the pipe joint member is provided with a positioning lug which is projecting from its side edge toward the other one and which is fitted with a positioning recess formed in the other one, and the caps and the pipe joint member have flat surfaces to be contact with each other and are brazed such that the lug is engaged with the recess and that the flat surfaces are in contact with each other.Type: GrantFiled: November 15, 2004Date of Patent: February 15, 2011Assignee: Showa Denko K.K.Inventor: Naohisa Higashiyama
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Patent number: 7886814Abstract: In an air conditioner constructed to pass an air introduced into an air conditioning unit through an evaporator and a heater core both arranged in the unit, cooler pipes for the evaporator and heater pipes for the heater core are arranged to extend from the same side wall of the air conditioning unit.Type: GrantFiled: June 8, 2006Date of Patent: February 15, 2011Assignee: Japan Climate Systems CorporationInventors: Takehiro Yamamoto, Tadashi Okamoto, Hideaki Yasuda, Hiroshi Mayumi, Morihito Tsukuda, Kenichiro Higashi, Keiji Koga, Yoshinori Aono
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Patent number: 7882891Abstract: A precision surface plate has a hollow casing with a reference plane used as a surface on which either or both of a workpiece and mechanical equipment are placed, a honeycomb structure, which is a collection of substantially identically-shaped enclosed cells disposed inside the casing, and a heat transfer device provided in the honeycomb structure to allow cells of the honeycomb structure to communicate with each other and transfer heat. The precision surface plate further includes casing ventilation openings provided in a wall of the casing to allow cells of the honeycomb structure inside the casing to communicate with the outside of the casing, and a shutter for opening and closing the casing ventilation openings. The heat is transferred effectively between the cells of the honeycomb structure through the heat transfer device.Type: GrantFiled: May 9, 2006Date of Patent: February 8, 2011Assignee: Mitutoyo CorporationInventor: Yutaka Kuriyama
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Patent number: 7882888Abstract: A two-phase heat transfer system includes an evaporator unit configured to receive heat from a source, a liquid line fluidly connected to the evaporator unit, a vapor line fluidly connected to the evaporator unit, and a condenser. The evaporation unit includes a thermal capacitance device and an evaporator integrated with the thermal capacitance device.Type: GrantFiled: February 23, 2006Date of Patent: February 8, 2011Assignee: Swales & Associates, Inc.Inventors: David C. Bugby, Edward J. Kroliczek, Jessica Maria Garzon
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Patent number: 7882889Abstract: A loop type heat dissipating apparatus with a sprayer for transferring heat between a heat source and a heat sink includes an evaporator, a condenser, and a working fluid. The evaporator contacts the heat source and includes a first chamber, a second chamber, and a sprayer disposed between therebetween. The condenser contacts the heat sink and includes a third chamber communicating with the second chamber and a wick structure disposed on one side of the third chamber. The working fluid fills the loop type heat dissipating apparatus and is turned into microdroplets via a sprayer. The sprayer impinges the microdroplets into the second chamber where the microdroplets are then evaporated by the heat source before proceeding to the third chamber for condensation, liquefaction and adhering to the wick structure. Eventually, the working fluid flows back to the first chamber under a pumping force actuated by the sprayer and completes the cycle.Type: GrantFiled: November 8, 2006Date of Patent: February 8, 2011Assignee: Industrial Technology Research InstituteInventors: Shih-Kuo Wu, Kuo-Hsiang Chien, Jinn-Cherng Yang, Chi-Ming Huang
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Patent number: 7878232Abstract: A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.Type: GrantFiled: July 9, 2004Date of Patent: February 1, 2011Assignee: GE Lighting Solutions, LLCInventors: Mehmet Arik, Stanton Earl Weaver, Jr.
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Patent number: 7878235Abstract: A vehicle rear air conditioner includes an air conditioning case connected with a blower and having a face vent, a floor vent and a vent door for controlling opening and closing of the vents. An evaporator and a heater core are embedded in the air conditioning case and a temperature control door controls opening and closing of a cold and a hot air passageway. The rear air conditioner includes a passageway member in order to discharge part of air flowing through the cold air passageway or the hot air passageway toward one of the vents. The passageway member has an inlet for inducing the part of air and an outlet for discharging the part of air and the vent door includes at least one interference preventing part.Type: GrantFiled: March 28, 2006Date of Patent: February 1, 2011Assignee: Halla Climate Control Corp.Inventors: Min-Woo Park, Hyung-Joo Kim
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Patent number: 7874347Abstract: A heat pipe (1) includes a shell (20), a protective layer (10) formed on an outer surface of the shell, a wick (30) and a hydrophilic layer (40) sequentially formed on an inner surface of the shell, and a working fluid contained in the shell. A material of the shell is metal, such as copper, aluminum, or a copper-aluminum alloy. The protective layer is formed of nanomaterials, such as carbon nanotubes, nano-sized copper particles, nano-sized aluminum particles, or nano-sized particles of a copper-aluminum alloy. The wick is made from a mixture of carbon fibers and carbon nanocapsules. The hydrophilic layer is made from nanomaterials, for example, titanium dioxide, zinc oxide, alumina, or any mixture thereof.Type: GrantFiled: May 31, 2005Date of Patent: January 25, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Ga-Lane Chen
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Patent number: 7874349Abstract: A heat exchanger includes a pair of tanks, each of the tanks having a pair of baffles sealingly engaged to a center wall, a pair of sidewalls, and a cover to form a fluid tight seal therebetween and provide a closure to the tank, wherein each of the sidewalls includes a portion of at least one of a pin and bracket for mounting the heat exchanger.Type: GrantFiled: March 16, 2006Date of Patent: January 25, 2011Assignee: Visteon Global Technologies, Inc.Inventors: David Thanh Duong, Jonathan Adam Raver, Wen Fei Yu, James Melvin Kirchoff, Chris Allen Vsetula
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Patent number: 7870888Abstract: A heat dissipation assembly for a central processing unit includes a heat radiator adapted to contact the central processing unit from above and a base adapted to support the central processing unit from below. The base includes at least a snap-on fastening mechanism adapted to snap into a through hole formed in a supporting substrate of the central processing unit. The heat radiator includes at least a fastener receiving portion for receiving an elongated fastener and aligning the elongated fastener with a matching engaging element of the snap-on fastening mechanism.Type: GrantFiled: August 25, 2006Date of Patent: January 18, 2011Assignee: Illinois Tool Works Inc.Inventors: Chunnan Zhou, Simeon Chou
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Patent number: 7866374Abstract: A heat pipe includes a cylinder-shaped casing (100) containing a working fluid therein and a capillary wick (200) arranged on an inner wall of the casing. The capillary wick encloses a vapor passage (300) in a center of the casing. The capillary wick includes a plurality of shaped foils stacked on the inner wall of the casing along a radial direction thereof. The foils are sintered to the inner wall of the casing and define a multi-channel structure for the working fluid to flow from a condensing section to an evaporating section of the heat pipe.Type: GrantFiled: August 2, 2006Date of Patent: January 11, 2011Assignee: Foxconn Technology Co., Ltd.Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun
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Patent number: 7861769Abstract: A heat sink is configured to cool at least one hot spot of an integrated circuit. The heat sink has a first pipe and a second pipe disposed interior to and concentric with the first pipe, where at least a portion of each of the first pipe and the second pipe is arranged to be disposed vertically over the hot spot. An assembly connected to the first pipe and the second pipe is arranged to generate a magnetic field and induce electrical current flow through the magnetic field. A flow of thermally and electrically conductive fluid in the first pipe and a flow of the fluid in the second pipe are dependent on the electrical current flow and the magnetic field.Type: GrantFiled: October 21, 2005Date of Patent: January 4, 2011Assignee: Oracle America, Inc.Inventor: Chien Ouyang
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Patent number: 7857037Abstract: A cooling system for removing heat from at least one heat generating component with a first low-profile phase plane heat pipe having a geometrically reoriented surface adapted for receiving heat from the at least one heat generating component along a first section of the geometrically reoriented surface, and having a plurality of micro-tubes disposed therein. A heat transfer fluid is contained with the plurality of micro-tubes and a second section of the geometrically reoriented heat pipe surface is disposed in a position geometrically offset from the first section.Type: GrantFiled: November 26, 2004Date of Patent: December 28, 2010Assignee: Thermotek, Inc.Inventors: Overton L. Parish, Tony Quisenberry, Clark R. Havis
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Patent number: 7854256Abstract: A bypass valve for a heat exchanger including a plurality of parallel tubular members comprises a housing having a hollow plug portion adjacent to an actuator portion. The actuator comprises a reciprocating plunger extending into the plug portion and a solenoid having a central actuator shaft attached to the plunger, wherein the actuator shaft extends upon energization of the solenoid so that the plunger prevents bypass flow through the valve. The valve also comprises a temperature sensor for sensing a temperature of the fluid flowing through the heat exchanger, the temperature sensor being electrically coupled to the solenoid through one or more conductors, wherein the temperature sensor is located at the first end of the actuator shaft and the conductors extend through the hollow interior of the actuator shaft to the second end thereof.Type: GrantFiled: December 15, 2008Date of Patent: December 21, 2010Assignee: Dana Canada CorporationInventors: Gregory Merle Pineo, Brian E. Cheadle, Yuri Peric
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Patent number: 7849916Abstract: An apparatus for use with a process liquid for controlling the temperature of a semiconductor-processing target comprises first and second tanks adapted for holding process liquid, at least one fluid level sensor carried by the first tank for monitoring the amount of process liquid in the first tank, and a valve coupled to one of the at least one fluid level sensor and configured to increases the flow of process liquid from the second tank to the target when the amount of process liquid in the first tank drops to a first predetermined amount. The first tank may include first and second compartments partially separated by a divider with a top whereby process liquid in the first compartment flows over the top of the divider into the second compartment.Type: GrantFiled: February 2, 2006Date of Patent: December 14, 2010Assignee: Noah Precision, LLCInventors: Boris Atlas, Yefim Bichutskiy, Boris Bruk
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Patent number: 7849915Abstract: A heat exchange tube having a flat shape includes a plurality of fluid paths having a circular cross section and extending in a longitudinal direction of the tube. Each fluid path is parallel to each other fluid path. The tube is dimensioned such that a distance between two adjacent fluid paths is defined as Wt, and a circumferential thickness between a surface of the tube and an outermost fluid path is defined as Ht. The distance Wt and the circumferential thickness Ht have a relationship as 0.42?Ht/Wt?0.98.Type: GrantFiled: May 19, 2004Date of Patent: December 14, 2010Assignee: Denso CorporationInventors: Masaaki Kawakubo, Etsuo Hasegawa, Yoshiki Katoh, Ken Muto
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Patent number: 7845188Abstract: A method and a system for the preparation of compressed air having a heat exchanger (system heat exchanger) which is in communication with a pressure source on the inlet side on the compressed air side and which is in communication with a system or unit on the outlet side on the compressed air side which is to be supplied with cooled compressed air and including at least one heat exchanger (air conditioning system heat exchanger) which is in communication with a pressure source on the inlet side on the compressed air side and which is in communication with additional components of an aircraft air conditioning system on the outlet side on the compressed air side.Type: GrantFiled: March 2, 2005Date of Patent: December 7, 2010Assignee: Liebherr-Aerospace Lindenberg GmbHInventors: Norbert Brutscher, Joachim Haas