Patents Examined by Louis R. Huynh
  • Patent number: 6101785
    Abstract: Method and device for sealing closure clips between a stamp and a bottom tool, wherein the sealing distance between stamp and bottom tool is monitored by a sensor.
    Type: Grant
    Filed: September 1, 1998
    Date of Patent: August 15, 2000
    Assignee: Poly-Clip System GmbH & Co. KG
    Inventors: Olaf Bienert, Detlef Ebert, Manfred Gerheim