Patents Examined by Lynette T. Umez-Erononi
  • Thinner composition and methods and systems for using the thinner composition
    Patent number: 6261970
    Abstract: Thinner compositions for effectively removing photoresist. The thinner compositions may be used in reworking a semiconductor substrate or in rinsing semiconductor devices. The thinner composition may be a mixture of n-butyl acetate (n-BA) and ethyl acetate (EA), a mixture of n-butyl acetate (n-BA) and methyl methoxy propionate (MMP), or a mixture of n-butyl acetate (n-BA) and methyl ethyl ketone (MEK).
    Type: Grant
    Filed: June 23, 1999
    Date of Patent: July 17, 2001
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Mi-sook Jeon