Abstract: A process and apparatus for providing microperforations in a zippered film useful for manufacturing reclosable zippered produce bags including(a) providing a web of thermoplastic film with zipper profile members on at least one side of the web, the zipper profile members spaced apart on the web forming a central web area between the profiles;(b) feeding the web between the nip of a cylinder having a plurality of heated pins and a pressure roller such that a plurality of microholes are formed in the central web area between the zipper profile members; and(c) maintaining the web in feeding alignment between the pin cylinder and the pressure roller such that uniform sized microholes are perforated in the web area between the profile members.

Abstract: An apparatus for supplying particles and/or granules to form a layer of prescribed thickness onto a given surface includes an endless pattern-forming device having a plurality of spaces, a device for supplying particles and/or granules into the spaces via a control member provided on the particle or granule-supplying device, a device for temporarily retaining the supplied particles and/or granules in the spaces and for releasing the temporarily retained particles and/or granules onto the given surface. A patterned shaped article is produced by a method using the apparatus. The method includes supplying dry particles and/or granules for a pattern course into the spaces, temporarily retaining the supplied particles and/or granules in the spaces, releasing the temporarily retained particles and/or granules onto the given surface, and allowing the released particles and/or granules to set on the given surface.

Abstract: An aligning and positioning system for a bonder including a bond sensor for sensing the X, Y and .theta. coordinates of a substrate at the bonding location and a die sensor for sensing the X, Y and .theta. coordinates of the die on a die transport. A controller correlates the sensed coordinates from the sensors and adjusts the X, Y and .theta. of the die and the substrate relative to each other to place the die at a preselected bond site on the substrate. The Z coordinate of the surface of the substrate, as well as its planarity, may be sensed by a Z optical sensor. The X and Y coordinates of the substrate are adjusted and the .theta. coordinate of the die on the die transport is adjusted.A pattern recognition system is used with the die and bond sensors to determine the coordinates as well as quality control of the substrate prior to bonding, the quality of paste pattern on the die or the substrate prior to bonding and the quality of the bond and the coordinates of the die after bonding.

Abstract: The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.

Abstract: A method for manufacturing an optical fiber (11), wherein the fiber (11) is drawn from one end of a preform (9) which is heated to above the glass softening temperature. The preform (9) is surronded by a protective gas (14) whose flow direction corresponds to the fiber drawing direction. The flow of the gas surrounding the preform (9) in the drawing area (10) is stabilized by an additional flushing gas (16).

Abstract: An integrated circuit connecting method that includes connecting electrode pads on an integrated circuit device to electrode terminals on a base with metal bumps interposed, the electrode terminals being formed in registry with the electrode pads.

Abstract: Method of manufacturing a sidewall actuator array for an ink jet printhead in which a series of longitudinally extending, generally parallel grooves are formed in a body portion of the ink jet printhead. In various embodiments thereof, the body portion may be comprised of a lower body portion formed of an inactive material and an intermediate body portion formed of an active material, a lower body portion formed of active material poled in a first direction and an intermediate body portion formed of active material poled in a second, opposite direction, a lower body portion formed of active material poled in a first direction, a insulative spacing portion and an intermediate body portion formed of active material poled in a second, opposite direction, or a single body portion formed of an active material. After forming grooves therein, a layer of conductive material is deposited on inner side surfaces exposed during the grooving step.

Abstract: A protective coating for an electronic assembly on a circuit board is made from a pre-fabricated, roll-flattened plastic ribbon having desired pre-determined thickness. From the ribbon, a suitably shaped membrane piece is produced, e.g., by stamping or by water-jet cutting, with openings as may be desired for circuit components to be left uncovered. The membrane is placed onto the circuit board, softened by heating, and pressed on by means of a silicone stamp, for close contact with electronic modules to be protected. The membrane is then adhered to the circuit board by further heating. The starting material for the membrane is a mixture of a thermoplastic material and of a wax including a significant amount of branched-chain and cycloaliphatic hydrocarbons.

Abstract: Apparatus for applying powdered coating to a workpiece--particularly to electric motor armatures and stators--including features relating to handling and masking of workpieces before, during and after coating, is provided. A first feature of the invention is the inclusion of all coating steps--e.g., coating, cleaning and precuring--as modules in a single treatment station on the production line. The treatment station can also be enclosed in a single housing to contain excess powder from both the coating and cleaning processes, so that a single powder recovery system can be used to recover the excess powder from both processes. The invention also includes a handling system for removing the workpiece from the production line, inserting it into the treatment station and moving it past the various modules in the treatment station, withdrawing it from the treatment station, and returning it to the armature production line.

Abstract: The present invention relates generally to a new method for forming cavities without using an insert. More particularly, the invention encompasses method for fabricating cavities in MLC (multi-layer ceramic) without using inserts.

Abstract: The invention concerns a process for manufacturing natural stone-type panel-shaped construction and decoration materials of high strength for facing facades, walls and floors in indoor and outdoor areas, consisting of stacked individual layers of crushed glass, charge materials, in particular sand, and mixtures thereof.

Abstract: In order to suppress deviation of conductor films and to effectively remove voids when a laminate obtained by stacking a plurality of ceramic green sheets provided with the conductor films is pressed in the direction of stacking, a pressing step is divided into a preliminary pressing step and a main pressing step which is carried out subsequently thereto. In the preliminary pressing step, a temperature of at least 40.degree. C. is applied to the laminate of the plurality of ceramic green sheets by a heater, while a press head is driven toward the laminate, thereby applying a pressure of not more than 50 kgf/cm.sup.2 to the same. The preliminary pressing step may be further divided into first and second preliminary pressing steps. In the first preliminary pressing step, the laminate is pressed by a press surface having projections on regions corresponding to those provided with the conductor films, so that voids are removed from the regions provided with the conductor films.

Abstract: A method and apparatus for impermeably sealing microencapsulated or other scent slurry during the printing process. The method comprises the application of an impermeable overlay sheet over the scent slurry on a continuous web of material, using double-sided tape or other adhesive means along the periphery of the overlay sheet. Preferably an impermeable metallic foil is used for the overlay, but other impermeable sheet material (e.g., plastic sheet) may be used. The apparatus continually feeds and applies the impermeable overlay sheet also disclosed. A second, similar apparatus may be provided to mirror the first apparatus, in order to apply a second impermeable overlay sheet to the opposite surface of the scent slurry coated web, thereby preventing bleed through of the scent and/or other chemicals.

Abstract: An apparatus and method for supplying a graphic label that is readable with a light scanning device with such label placed on a rubber article. The graphic bar code label is optically interpreted with a bar code reader.Thus, the cured substrate with the label with the graphic message is produced by using thermal transfer techniques. For this purpose, the ribbon in contact with the substrate passes by a print head and the ink can be selectively heated with this operation being synchronized by computer operation. When the ribbon is stripped away, the ink is left where heating occurred on the substrate material. The printed substrate exits and is cut to produce labels of desired length. The label is placed on a curable article and the label and substrate are subjected to curing conditions to effect transfer of the label to the cured substrate which may now contain the message in solely, alphanumeric, bar codes, human readable characters, and logos or mixtures of them.

Abstract: A monolithic capacitive pressure transducer is shown composed of ceramic material having a closed cavity formed near a surface thereof and having capacitor plates formed on two opposed surfaces defining the cavity. Vias are formed extending from the capacitor plates to permit electrical connection therewith. The transducer is made by separately forming under pressure a diaphragm and a base having a recess in the top surface using ceramic powder coated with an organic binder. A metal layer is deposited on the two pieces and the pieces are then joined together to form a single unit. A spacer may be inserted in the recess to ensure that a predetermined gap is maintained between the two parts during the joining operation. The parts are then debinderized by heating in air to a first temperature level to allow the binder organics, as well as the spacer organics if a spacer is employed, to be vaporized and/or decomposed and removed through the open pores of the diaphragm and base.

Abstract: The present invention relates to a method for manufacture of ceramic parts used for protecting semiconductor devices such as IC, LSI, etc. against anomalous high voltages such as noise, pulse, static electricity, etc. and the object of the present invention is to provide ceramic parts capable of removing or restraining high-frequency noises on signal lines by reducing the impedance of the devices.In order to attain the above object, according to the present invention, a pulse voltage of 50 kV in maximum value which requires a time of 200 nanoseconds or less for reaching the maximum value from an initial value and a time of 1 microsecond or less for returning to the initial value through the maximum value and which has an energy of 0.5 joule or lower is applied at least once between the electrodes (2).

Abstract: Preexisting elements are bonded by placing a sol-gel solution between juxtapositioned surfaces of the elements and sintering a gel formed from the solution at a temperature, which does not damage the elements, to form a sol-gel derived bonding material. The elements may be constructed of glasses, metals, infrared transmissive materials, or diamond, and bonded by sintering at about 300.degree. C. The bonding material may be resistant to high temperature and may have properties, such as refractive index, selected by varying the composition of the sol-gel solution. Optical and electronic articles are constructed by preparing a mandrel conforming to a substrate, which may be of arbitrary shape; depositing a coating on the mandrel; bonding the coating to the substrate with a sintered sol-gel; and removing the mandrel, as by etching.

Abstract: The invention relates to a method for incorporating a carrier element or module in a card body. The card body is provided with a recess shaped accordingly for incorporating the carrier element. The carrier element comprises a substrate on which an integrated circuit is disposed. Before the carrier element is incorporated a contact adhesive element is first introduced into the recess by means of a suitable tool. The carrier element can then be connected firmly and permanently with the card body with the aid of the contact adhesive element under the action of pressure.

Abstract: A coating system for detecting the presence of contaminants carried by a fluid that is applied as a coating on a workpiece. A tube guides the fluid along a flow path to the workpiece. A light source illuminates the fluid along at least a portion of the flow path, and this light is scattered by any contaminants present in the fluid. Light scattered by the contaminant particles is more intense than light scattered by the other fluid particles, and this brighter scattered light is detected by a light detector positioned adjacent to the fluid flow path. If one or more contaminant particles is detected in the fluid, a warning signal can be given and/or the flow of fluid can be stopped. This coating system is particularly well suited for use in a spin-on coating process that applies a liquid, such as a photoresist material or a dielectric material, to a semiconductor wafer or other workpiece that is secured to a rotating turntable.

Abstract: The invention comprises a method for manufacturing a laminated pad in a cost-efficient manner. In one embodiment, the method comprises the steps of applying strips of adhesive to a first substrate and mounting the first substrate to a second substrate. Next, adhesive is applied to the entire width of a third substrate which is in turn mounted to the laminated first and second substrates to create a laminated sheet. The laminated sheet can be slit and then die cut into individual laminated pads. The pads which result from this process have a base pad, an intermediate layer which is adhered to the base pad and a top layer in which only a portion of the top layer is mounted to the intermediate layer.