Abstract: A polyquinoxaline polymer is prepared by self condensation of a monomer having both a 1,2-diketone and a 1,2-primary diamine in the molecule. The resultant polymers can be used as dielectric films, adhesions, varnishes and membranes.

Abstract: Polyimides which essentially consist of 0.1 to 100 mol % of at least one structural element of the formula I ##STR1## and 99.9 to 0 mol % of at least one structural element of the formula II and/or III ##STR2## in which Z and Z' are a tetravalent aromatic radical, Q' is a trivalent aromatic radical, X and X' are a divalent radical of an organic amine, are autophotocrosslinkable. They are suitable for the production of protective films and photographic relief images.

Abstract: In one embodiment this invention provides injection moldable polyimides, as exemplified by the condensation and imidization product of a aromatic dianhydride such as 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride with a novel aromatic diamine such as 2,2-bis[p,p'-(m-aminophenoxy)phenylsulfonyl(p-phenyleneoxy)phenyl]propane.

Abstract: Polyimides which essentially consist of 0.1 to 100 mol % of at least one structural element of the formula I ##STR1## and 99.9 to 0 mol % of at least one structural element of the formula II and/or III ##STR2## in which Z and Z' are a tetravalent aromatic radical, Q' is a trivalent aromatic radical, X and X' are a divalent radical of an organic amine, are autophotocrosslinkable. They are suitable for the production of protective films and photographic relief images.

Abstract: Highly soluble, optically transparent to clear aromatic polyimides in the visible range are disclosed. The dianhydrides from which the polyimides are prepared are 4,4'-[2,2,2-trifluoro-1-(trifluoromethyl) ethylidene] bis(1,2-benzenedicarboxylic anhydride) which can be partially replaced with either pyromellitic dianhydride or 3,3',4,4'-benzophenone tetracarboxylic dianhydride. The diamines from which the polyimides are prepared are m- or p- phenylene diamines which are substituted ortho to the amino groups with primary or secondary alkyl groups having 1 to 6 carbon atoms preferably methyl or ethyl.

Abstract: An improved solution polymerization process for the preparation of polyetherimides comprises prereacting an aromatic bis(ether anhydride) with an aromatic diamine, followed by the addition of phthalic anhydride end capping agent and further reaction to form an end capped prepolymer. The prepolymer is converted to polyetherimide. The improved process advantageously greatly reduces the formation of PAMI, an undesired byproduct.

Abstract: Described herein are miscible poly(aryl ether ketone) blends possessing increased crystallization rates. The novel compositions contain (a) from about 98 to about 99.9 percent by weight of a miscible poly(aryl ether ketone) blend, and (b) from about 0.1 to about 2 percent by weight of a poly(phenylene sulfide) or a copolymer thereof. The compositions of the instant invention retain their attractive crystallization behavior even after prolonged treatment in the melt. Moreover, these compositions display excellent mechanical properties as well as excellent chemical and heat resistance.

Abstract: A polymer composition containing a polyaryletherketone and a polysulphone, where the polysulphone contains the repeating units--Ph--SO.sub.2 --Ph--Ph--SO.sub.2 --Ph--and--Ar--linked through ether linkages. The polysulphone contains 50 to 75% molar of the units --Ar--, and Ar may contain more than one aromatic group linked by aliphatic hydrocarbon groups, or by --SO--, --SO.sub.2 -- or --CO--.A composition containing a high proportion of the polyaryletherketone shows a reduced shrinkage compared to the polyaryletherketone alone. A composition containing a high proportion of the polysulphone has improved solvent resistance and stress crack resistance compound to the polysulphone alone. The composition can be used for production of film or fibre or for wire coating or may include other additives such as fillers or fibrous reinforcing agents, e.g. glass or carbon fibre.

Abstract: Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.The polyimide has recurring units of the following formula ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.

Abstract: This invention relates to the use of new special polyimides for the production of cast films and coatings.

Abstract: This invention is directed to novel crystalline chain extended polymers containing segments of crystalline poly(aryl ether ketones). The novel materials are easy to prepare and display excellent toughness, fabricability and very good high temperature and solvent resistance.

Abstract: This invention relates to thermoplastic polyimides of 2,2-bis-phtalic acid anhydro-(4)-propane and 2,2-bis-(4-aminophenoxyphenyl-propane.

Abstract: The invention relates to tough, crystalline polyetherketones, processes for making them and monomers used in their manufacture. The polyetherketones are derived from monomers which provide the repeating polymer unit-(-O-Ph-CO-Ph-CO-Ph-).gtoreq.2- in the polymer chain.The polyetherketones are the etherification reaction product ofX-Ph-CO-Ph-[ -CO-Ph-].sub.1 -[-Ph-CO-Ph-(-CO-Ph-).sub.o -].sub.m -Xwherein X is a halogen such as fluorine and chlorine, l, m and o are individually 0 or 1, with a bisphenol of the formulaHO-Ph-(-Y-Ph-).sub.p -OH,wherein p is 0, 1 or 2, -Y- is -CO- or -O- in either occurence, and an aromatic hydroxy halide of the formulaHO-Ph-CO-Ph-CO-Ph-X,wherein X is as described above, and wherein -Ph- is 1,4-phenylene, said polyetherketone having an ether to ketone molar ration of less than 2/1 and greater than 1/2, and an inherent viscosity of at least 0.6.

Abstract: Extraction of polyamic acid-polyimide gel in bipolymerized polyimide manufacturing process with a solvent containing an extraction-enhancing agent, which is a pyridine, picoline, or quinoline, leads to a polyimide film having increased molecular weight. Polyimides are valuable materials used in fabricating articles which must withstand high temperatures, especially in aerospace applications, and in the manufacture of electronic circuit boards.

Abstract: A method is provided for enhancing the crystallization rate of certain polyetherimide to provide an improved molding mehod for making solvent resistant shaped thermoplastics. Polyetherimide blends containing crystallization rate enhancing agents such as bisimides or imide oligomers also are provided.

Abstract: Copolycondensate molding materials are obtainable by polycondensation offrom 2 to 98 mol % of 2,2-di-(4'-hydroxyphenyl)-propane (A),from 2 to 98 mol % of 4,4'-dihydroxydiphenyl sulfone (B) andfrom 0 to 96 mol % of (C) ##STR1## where R.sup.1 and R.sup.2 are each H, C.sub.1 -C.sub.6 -alkyl or C.sub.1 -C.sub.6 -alkoxy, X is a chemical bond, --S--, --O--, --CO--, CR.sup.3 R.sup.4 (where R.sup.3 and R.sup.4 are different when n and p are each 0), or SO.sub.2 -- (only when n or p is not 0), R.sup.3 and R.sup.4 are each H, C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl or halogen-substituted alkyl of 1 to 4 carbon atoms, m is 0 or 1, and n and p are each 0, 1, 2, 3 or 4, withfrom 1 to 100 mol % of (D) ##STR2## where R.sup.5 and R.sup.6 have the same meanings as R.sup.1 and R.sup.2, and v and w are each 0, 1, 2, 3 or 4, and from 0 to 99 mol % of (E) ##STR3## where R.sup.7 -R.sup.10 are each Cl or F or have the same meanings as R.sup.1 and R.sup.2, q is 0 or 1, r, s, t and n are each 0, 1, 2, 3 or 4, Z.sub.

Abstract: The present invention is connected with a low-melting polyimide copolymer containing 30 to 90 mole % of an imide repeating unit represented by the following formula (I) and 10 to 70 mole % of an imide repeating unit represented by the following formula (II), and having a logarithmic viscosity number of 0.1 to 4 dl/g: ##STR1## wherein R.sup.1 is at least one of ##STR2## Furthermore, the present invention is connected with a method of preparing the low-melting polyimide copolymer.Since having a melting point of about 300.degree. to about 400.degree. C., the polyimide copolymer of the present invention has heat resistance and enables melt-moldings such as extrusion and injection molding.

Abstract: Inorganic-organic alloy polymer adduct compositions for waste water treatment, having the formula:A.B.sup.+.C.D.sup.+wherein A is from 0% to 98% by weight of the total alloy composition, and is selected from the group comprising: polyhydroxyaluminumchloride, hydroxyaluminumchloride, polyhydroxyaluminumagnesiumchloride, polyhydroxyaluminumagnesium sulfate, polyhydroxyaluminumagnesiumsulfate, hydroxyaluminumsulfate, polyhydroxyaluminumzincoxidechloride, polyhydroxyaluminumchlorosulfate, polyhydroxymagnesiumchlorosulfate, polyaluminumferricchloride, polyaluminumferrouschloride, polyaluminumcholridesulfate, polyhydroxyaluminumchloridesilicate, and polyhydroxyaluminumsodiumsulfophosphate;B.sup.

Abstract: A fluorinated poly(phenylene ether ketone) having one of the following structural formulas ##STR1## wherein X is selected from the group consisting of aryl, SO.sub.2, O, CO, --C(CH.sub.3).sub.2, and S, is prepared by reacting a bisphenol with 1,1,1,3,3,3-hexafluoro-2,2-bis[4-(4-halobenzoyl)phenyl]propane (wherein halo is fluoro or chloro), which is a novel monomer formed as the reaction product of halobenzene (wherein halo is fluoro or chloro) and 1,1,1,3,3,3-hexafluoro-2,2-bis(p-chloroformylphenyl)propane.

Abstract: Linear aromatic polyimides with low dielectric constants are produced by adding a diamic acid additive to the polyamic acid resin formed by the condensation of an aromatic dianhydride with an aromatic diamine. The resulting modified polyimide is a better electrical insulator than state-of-the-art commercially available polyimides.