Patents Examined by Mahdi H Nejad
  • Patent number: 11251590
    Abstract: A cable snake and a method of assembling a cable snake. The cable snake may include a housing assembly defining a cavity; an actuator rotatably supported by the housing; and a tape operable to be wound into and unwound out of the cavity, the tape applying an unwinding force. A force may be applied to the actuator and the housing assembly, the force resisting the unwinding force. A retainer assembly may be provided between and integral with the actuator and the tape.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: February 15, 2022
    Assignee: ECM Industries, LLC
    Inventor: Matthew W. Sweeney
  • Patent number: 11235449
    Abstract: A setting tool includes: a body with at least a drive shaft connected to a pull rod designed to be screwed onto the crimp part, to drive the pull rod in rotation along an axis; a draw sleeve fixed to the body and connected to the pull rod, to translate the pull rod along the axis; and a placing nose, to house the pull rod rear end, the drive shaft front end, and the draw sleeve. The draw sleeve front end includes a cavity opening onto a first through hole on the side wall, and a second hole on the drive shaft axis of rotation, the through holes allow the pull rod front end to pass through the holes, to allow the pull rod rear end to pass through the first through hole, and to enable the pull rod to be placed along the drive shaft axis of rotation.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: February 1, 2022
    Assignee: BOLLHOFF OTALU S.A.
    Inventor: David Macchieraldo
  • Patent number: 11232971
    Abstract: A workpiece holding mechanism, a process system and a manufacturing method of a semiconductor structure are provided. The workpiece holding mechanism is used in a vacuum chamber, and includes a stage, a platen and a workpiece clamper. The platen is disposed over the stage, and configured to support a workpiece. The workpiece clamper is standing on the stage, and configured to clamp the workpiece from above the workpiece. The workpiece clamper includes a plurality of supporting elements and an elevated structure. The supporting elements are connected between the stage and the elevated structure. The platen is surrounded by the supporting elements. The elevated structure is configured to physically contact a peripheral region of the workpiece from above the workpiece.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: January 25, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Jui Kuo, Hui-Jung Tsai, Keng-Han Lin
  • Patent number: 11229962
    Abstract: A system for trimming fins on a downhole tool is disclosed. The system includes a jig that mounts to the shaft of the tool. A linear aperture is formed in the jig and has a closed end, an open end, and is sized to axially receive a single fin of the tool. A channel is located on an underside of the jig beneath the aperture. The channel has an inner radius of curvature. The inner radius of curvature is substantially similar to an outer radius of curvature of the shaft. The channel can form a friction lock on the exterior of the shaft and be removably attached to the shaft without fasteners. The channel is arcuate and has a selected arcuate span.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: January 25, 2022
    Assignees: Black Diamond Oilfield Rentals, LLC, Erdos Miller, Inc.
    Inventor: John MacMurrough
  • Patent number: 11219991
    Abstract: A bell cup multi-tool and method is provided for ergonomic straight-line force applications. The multi-tool includes a manipulator for providing the straight-line pressure to a distributor in a bell cup for installation or removal. The multi-tool also includes a base for securing the bell cup in a desired orientation.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: January 11, 2022
    Inventor: Craig E. Williams
  • Patent number: 11219975
    Abstract: A device is provided for inserting coil inserts into threaded holes. The device includes an insertion tool having a manipulator end which is configured to receive and hold a coil insert, and which is operable to apply a torque to the coil insert to screw the coil insert into a threaded hole when presented thereto, the manipulator end having an insertion axis which is coincident with the axis of the coil insert when held by the manipulator end. The device further includes a tool support to which the insertion tool is mounted, the tool support being fixable to an end of a robot arm whereby the manipulator end is presentable by the robot arm to the threaded hole for insertion therein of the coil insert.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: January 11, 2022
    Assignee: Rolls-Royce PLC
    Inventors: Martin C. Bullock, Paolo Villella, George S. Walsh, Stefan A. Winkvist
  • Patent number: 11215215
    Abstract: A torque transmission driver has a first end portion adapted to receive and transmit torque from a torque generation source, and a second end portion including a shaped tapered bit having drive surfaces with an alternating series of five or six lobes and troughs about a rotational axis, having a taper angle between 15 and 45° from the rotational axis operable to engage corresponding drive surfaces in a plurality of at least two size fasteners, the tapered drive surfaces of the bit comprising a first tapered portion operable to engage drive surfaces of a first sized fastener and a second tapered portion operable to engage drive surfaces of a second sized fastener, the drive surfaces of the second sized fastener being larger than the drive surfaces of the first sized fastener.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: January 4, 2022
    Assignee: Infastech Intellectual Properties Pte. Ltd.
    Inventor: Richard W. Lukes
  • Patent number: 11211282
    Abstract: Embodiments of process kit components for use in a substrate support, and substrate supports incorporating same, are provided herein. In some embodiments, the substrate support may include a body, a grounding shell formed of an electrically conductive material disposed about the body, a liner formed of an electrically conductive material disposed about the grounding shell, where the liner includes an upper lip that extends inwardly towards the body, a metal fastener disposed through the upper lip to couple the liner to the grounding shell, and a first insulator ring disposed atop the upper lip of the liner and covering the metal fastener.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: December 28, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Xue Chang, Andrew Nguyen
  • Patent number: 11208166
    Abstract: A device for positioning motor vehicle parts in the production or manufacture of motor vehicles. The device includes a main frame, at least one main module configured to be disposed on the main frame, at least one interchangeable first docking plate configured for releasable connection to the main module, and a plurality of first receptacles, arranged on the interchangeable first docking plate, configured to hold the motor vehicle parts at a predefined position during the production.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: December 28, 2021
    Assignee: MAGNA STEYR Fahrzeugtechnik AG & Co KG
    Inventors: Christoph Kribernegg, Patrick Leonhardsberger, Thomas Mayer, Manfred Pichler
  • Patent number: 11209121
    Abstract: A lifting support device that includes a linear actuator including a first end configured to support an object, and a load sensor positioned to determine application of a first load on the load sensor by at least the object. The linear actuator is maintained in equilibrium when supporting the first load. The lifting support device further includes a controller coupled in communication with the load sensor, and the controller is configured to selectively actuate the linear actuator in response to application of a second load on the load sensor.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: December 28, 2021
    Assignee: THE BOEING COMPANY
    Inventor: Jason Kerestes
  • Patent number: 11192167
    Abstract: A loading and unloading device for a machine, a machine for machining panel-like workpieces, and a workpiece support for such a machine and a method for loading and unloading such a machine, having a loading and unloading module, wherein the loading and unloading module has a vertically upwardly oriented raising device for lifting a cut-free workpiece part and a vertically downwardly oriented gripping device (38) for holding an unmachined, panel-like workpiece.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: December 7, 2021
    Assignees: TRUMPF Werkzeugmaschinen GmbH + Co. KG, J. Schmalz GmbH
    Inventors: Magnus Deiss, Peter Epperlein, Frank Schmauder, Fabian Gaeckle, Jens Ottnad, Heinz-Juergen Prokop, Stefan Stroebel, Walter Dunkmann, Thomas Eisele, Rainer Hoehn, Dirk Plaueln, Hermann Reinisch
  • Patent number: 11192224
    Abstract: A tool for inserting and removing components, in particular bearings, bushes or the like, particularly in the automotive sector, has a spindle, a first sleeve body having a first ramp-form outer circumferential surface and a through-hole, through which the spindle can be axially guided, a second sleeve body having a second ramp-form outer circumferential surface and a through-hole, through which the spindle can be axially guided, and also a first pressure body and a second pressure body.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: December 7, 2021
    Inventor: Michael Mueller
  • Patent number: 11183418
    Abstract: Embodiments herein disclose a de-coupled substrate lift mechanism installation bracket and method of adjusting a plane of a lift pin hoop of the substrate lift mechanism. In one embodiment an apparatus for making adjustments about two remote axes includes a first adjustment mechanism and a second adjustment mechanism. The first adjustment mechanism includes a common member, one or more first side members, a connector member, and a plurality of first joints pivotably coupling the common member, the one or more first side members, and the connector member. The second adjustment mechanism includes a first body having the common member, one or more second side members, a first frame member, and a plurality of second joints pivotably coupling the common member, the one or more second side members, and the first frame member.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: November 23, 2021
    Assignee: Applied Materials, Inc.
    Inventor: Paul Forderhase
  • Patent number: 11180264
    Abstract: A mobile fixture configured to move a structure in a manufacturing environment may include a motorized base configured to move on a surface and a support system connected to the motorized base, the support system being configured to support the structure, the support system being configured to position the structure along at least one of an X-axis, a Y-axis, and a Z-axis, the support system being configured to position the structure about the Z-axis, and the support system being configured to provide free rotation of the structure about at least one of the X-axis and the Y-axis.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: November 23, 2021
    Assignee: The Boeing Company
    Inventors: Steven Best, Eric Reid, James N. Buttrick, Daniel M. McDonagh, Matthew DesJardien
  • Patent number: 11180853
    Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: November 23, 2021
    Assignee: Ebara Corporation
    Inventors: Yu Ishii, Fong-Jie Du, Makoto Kashiwagi
  • Patent number: 11183410
    Abstract: A pellicle removal tool including a stage that holds a photomask and an associated pellicle, two or more arms positioned around the stage and configured to engage pellicle side wells of the pellicle, and two or more actuators each configured to adjust at least a vertical position of a corresponding one of the two or more arms so as to apply a lifting force to the pellicle for removal of the pellicle from the photomask.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: November 23, 2021
    Assignee: PHOTRONICS, INC.
    Inventors: Hilario Ar-Miguel Alvarez, Spencer Allen Mullens, Jesse Eugene Williams, II
  • Patent number: 11180355
    Abstract: The scissor jack cover may be a protective cover for an individual scissor jack. The individual scissor jack may be coupled to the underside of a vehicle. While residing inside of a cavity within the scissor jack cover, the individual scissor jack may be protected from water, road salt, dirt, and other contaminants which may make the individual scissor jack difficult to operate. The vehicle may employ a plurality of scissor jacks to level and stabilize the vehicle when the vehicle is stationary. Multiple instances of the scissor jack cover may be deployed to protect each of the plurality of scissor jacks dispersed beneath the vehicle. As a non-limiting example, the vehicle may be a toy hauler trailer, a recreational vehicle, a travel trailer, a motor home, or other conveyance.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: November 23, 2021
    Inventor: Richard A. French
  • Patent number: 11183401
    Abstract: An industrial-scale system and method for handling precisely aligned and centered semiconductor substrate (e.g., wafer) pairs for substrate-to-substrate (e.g., wafer-to-wafer) aligning and bonding applications is provided. Some embodiments include an aligned substrate transport device having a frame member and a spacer assembly. The centered semiconductor substrate pairs may be positioned within a processing system using the aligned substrate transport device, optionally under robotic control. The centered semiconductor substrate pairs may be bonded together without the presence of the aligned substrate transport device in the bonding device. The bonding device may include a second spacer assembly which operates in concert with that of the aligned substrate transport device to perform a spacer hand-off between the substrates. A pin apparatus may be used to stake the substrates during the hand-off.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: November 23, 2021
    Assignee: SUSS MICROTEC LITHOGRAPHY GMBH
    Inventors: Hale Johnson, Gregory George, Aaron Loomis
  • Patent number: 11179965
    Abstract: An electrostatic chuck includes a metal base plate, an electrostatic puck bonded to the metal base plate, and surface features on the surface of the electrostatic puck. The electrostatic puck includes an electrode embedded in the electrostatic puck. A surface of the electrostatic puck has a flatness of below 10 microns. The surface features include mesas and a sealing band around a perimeter of the electrostatic puck. The surface features have an average surface roughness of approximately 2-6 micro-inches. The corners of the surface features are not rounded.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: November 23, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Vijay D. Parkhe, Kadthala Ramaya Narendrnath
  • Patent number: 11177149
    Abstract: Disclosed herein is a wafer jig with an identification mark for use in inspecting the function of an identification mark reading mechanism for reading an identification mark on a device wafer. The wafer jig includes a wafer piece cut from a region of a device wafer where an identification mark is formed, and a circular plate having the same diameter as the device wafer. The wafer piece is fixed to the circular plate such that the identification mark on the wafer piece is positionally aligned with the identification mark on the device wafer.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: November 16, 2021
    Assignee: DISCO CORPORATION
    Inventor: Zhong Zhou