Patents Examined by Malcolm Barnes
  • Patent number: 11967449
    Abstract: A transformer tank for a shell type transformer includes a wall, the wall surrounding a tank interior, a clamping arrangement for exerting a clamping force on a magnetic core of the shell type transformer. The clamping arrangement includes a beam fixed on the wall, and a plunger, the plunger including a first axial end configured to exert the clamping force on the magnetic core. The plunger is movable with respect to the beam along its longitudinal axis and a value of the clamping force is settable depending on the position of the plunger relative to the beam.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: April 23, 2024
    Assignee: HITACHI ENERGY LTD
    Inventor: Miguel Aguirre
  • Patent number: 11961657
    Abstract: A multi-coil inductor includes a plurality of stacked inductor units. Each of the inductor units comprises: a magnetic core in which a magnetic path is formed; and a plurality of coils which are wound around the magnetic core to form at least one winding pair. Wherein a part of the magnetic path between the adjacent inductor units is shared. In the present invention, the leakage inductance is controlled and the may be magnetic saturation of magnetic core avoided by adjusting series and parallel connections among the coils.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: April 16, 2024
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Zengyi Lu, Haijun Yang, Shiwei Liu
  • Patent number: 11948723
    Abstract: A winding core includes, for example, four planes, that is, a top surface, a bottom surface, a first side surface, and a second side surface around its central axis. A first wire and a second wire are wound around the winding core in the same direction and have a twisted section. In the twisted section in a plurality of turns at the top surface, bottom surface, first side surface, and second side surface, both the first wire and the second wire are in close contact with each of the ridges between the top surface, bottom surface, first side surface, and second side surface.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: April 2, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryota Hashimoto, Takashi Sukegawa
  • Patent number: 11935688
    Abstract: A coil component includes: a substrate body; a winding part formed by a conductive wire wound around a part of the substrate body; and terminal electrodes, each having a foundation part constituted by a metal plate provided to the substrate body, and a welded part formed on the foundation part wherein a part of the metal plate is welded to the conductive wire at a lead part led out from the winding part; wherein, based on a vertical line which passes through the peak point of the welded part where its height becomes the highest and which also intersects at right angles the foundation part, the distance from the vertical line to the surface of the welded part as viewed in a direction parallel with the foundation part is longer at a point closer to the foundation part when viewed at least in one direction from the vertical line.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: March 19, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Asa Yamamoto, Tetsuo Kumahora, Tsutomu Kojima
  • Patent number: 11929195
    Abstract: A multilayer coil component includes a multilayer body that contain a coil. The coil includes coil conductors. A lamination direction of the multilayer body and an axial direction of the coil are parallel to a first main surface. A distance between the coil conductors adjacent to each other in the lamination direction is from 4 ?m to 8 ?m. Each coil conductor includes a line portion and a land portion that is disposed at an end portion of the line portion. The land portions of the coil conductors adjacent to each other in the lamination direction are connected to each other with a via conductor interposed therebetween. A width of the line portion is from 30 ?m to 50 ?m. An inner diameter of each coil conductor is from 50 ?m to 100 ?m.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: March 12, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Atsuo Hirukawa
  • Patent number: 11923118
    Abstract: A coil component includes a drum core including a winding core portion extending in a first direction and a pair of flange portions provided at both ends of the winding core portion. At least one flange of the pair of flange portions has at least one step or gradient portion. A terminal electrode is provided on the step or gradient portion, and a wire is wound around the winding core portion with an end bonded to the terminal electrode. The terminal electrode includes plural metal layers, an outermost layer of which is an Sn film having a flattened mounting surface. The flattened mounting surface overlaps the step or gradient portion when seen in a second direction perpendicular to the first direction.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: March 5, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shuhei Sato, Yuki Kanbe, Hiroyuki Maso, Masaaki Fukuda
  • Patent number: 11908612
    Abstract: A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 ?m<T2<120 ?m.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: February 20, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Seob Lee, Jong Min Lee
  • Patent number: 11908610
    Abstract: An inductor includes: a magnetic core; a conduction path penetrating the magnetic core; a pedestal portion including a core holding portion that holds the magnetic core, and support portions that support, when placed on a circuit board, electronic components at a height at which the electronic components can be accommodated on the circuit board side with respect to the core holding portion; and a shield portion that is provided on the circuit board side with respect to the magnetic core, and that shields a magnetic field generated by flow of electricity in the conduction path.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: February 20, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Junya Aichi
  • Patent number: 11901112
    Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body including the support substrate and the coil portion disposed therein, an external electrode disposed on a surface of the body and connected to the coil portion, and an insulating layer disposed in a region of the surface of the body other than a region in which the external electrode is disposed, wherein an average roughness (Ra) of the surface of the body in contact with the external electrode is different from an average roughness (Ra) of the surface of the body in contact with the insulating layer.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Seung Mo Lim, No Il Park, Byung Soo Kang, Byeong Cheol Moon
  • Patent number: 11881349
    Abstract: A winding for a phase winding of a transformer. The winding has coil turns around a coil axis. The winding is adapted to transform voltage in a transformer at a predetermined frequency, when the transformer is operating. The winding is excited by a mechanical load having a main frequency corresponding to the predetermined frequency multiplied by two and has vibration modes. The combination of load and vibration modes results in a vibration of the winding. The winding has a set of vibration modes. Each vibration mode has a vibration mode frequency, wherein a main contributing vibration mode of the set of vibration modes is the vibration mode resulting in the largest acoustic power of the vibration modes. The winding is excited by the load and a stiffness difference between a first winding portion stiffness and a second winding portion stiffness is such that the acoustic power is minimized at said main frequency.
    Type: Grant
    Filed: August 22, 2023
    Date of Patent: January 23, 2024
    Assignee: HITACHI ENERGY LTD
    Inventors: Kiran Chandra Sahu, Anders Daneryd
  • Patent number: 11875927
    Abstract: A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: January 16, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Sukegawa, Yasuhiro Itani, Takanori Suzuki, Yuuki Kitadai, Yoshifumi Maki, Reiichi Matsuba
  • Patent number: 11875935
    Abstract: An electronic device includes a substrate; a porous semiconductor material layer arranged on the substrate; a first high magnetic permeability material arranged inside the pores of a first portion of the porous semiconductor layer, the first portion of the porous semiconductor material layer impregnated with the first high magnetic permeability material forming a first magnetic layer separated from the substrate by a second portion of the porous semiconductor material layer; and a coil arranged on the first magnetic layer.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: January 16, 2024
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: Jean-Pierre Colinge
  • Patent number: 11854734
    Abstract: A multilayer coil component includes an element body formed by stacking a plurality of insulating layers on top of one another, a coil buried inside the element body, and an outer electrode that is electrically connected to the coil. The dead weight of the multilayer coil component lies in a range from 0.2 mg to 0.35 mg. The element body has a mounting surface and has a coil lead-out surface to which the coil is electrically led out and on which the outer electrode is provided. Looking at a cross section of the element body that is perpendicular to the mounting surface and the coil lead-out surface, a radius of curvature of an edge portion where the mounting surface and the coil lead-out surface intersect lies in a range from 13 ?m to 30 ?m.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: December 26, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kouhei Matsuura
  • Patent number: 11848134
    Abstract: A wire-wound core includes a wound core portion and a first flange and a second flange provided on a first end portion and a second end portion, respectively. The first flange has a bottom surface facing a mounting substrate during mounting, a top surface facing away from the bottom surface, an inner end surface coupling the bottom surface with the top surface and facing the wound core portion, an outer end surface facing away from the inner end surface, and a first side surface and a second side surface that face away from each other and each couple the bottom surface with the top surface and the inner end surface with the outer end surface. In a region of the outer end surface close to the bottom surface, a first inclined surface inclined toward the inner end surface as the first inclined surface approaches the bottom surface is provided.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: December 19, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kota Takayama, Masashi Miyamoto
  • Patent number: 11848136
    Abstract: A coil component includes a body having one end and the other end opposing each other, a support substrate disposed inside the body, a coil portion, disposed on at least one surface of the support substrate, in which an end portion of an outermost turn is disposed closer to the one surface of the body than to the other surface of the body, a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body, and an anchor portion connected to the lead-out portions and including a via pad disposed between the lead-out portion and the coil portion inside the body.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: December 19, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Byeong Cheol Moon
  • Patent number: 11842835
    Abstract: A magnetic assembly formed by a custom magnetic core and its bobbin with interconnection pins is presented. This magnetic assembly leads to a higher power density of magnetic assembly and a better utilization of the volume inside a power converter, allowing a higher power density of the power converter and a higher efficiency through the minimization of the parasitic inductances.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: December 12, 2023
    Assignee: Rompower Technology Holdings, LLC
    Inventors: Ionel Jitaru, Iulian Busu, Mihai Bogdan Jitariu
  • Patent number: 11842846
    Abstract: A laminated electronic component includes a body including a magnetic layer containing magnetic particles; a coil provided within the body; and outer electrodes provided on a bottom surface of the body and each electrically connected to any one of end portions of the coil. The coil is formed by connecting a plurality of coil conductors stacked within the body, and the body includes a non-magnetic layer present between one of the outer electrodes and one of the coil conductors opposing the one of the outer electrodes.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: December 12, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mitsuhiro Sato, Daisuke Takahashi, Ryohei Kawabata
  • Patent number: 11837397
    Abstract: A wire-wound inductor component includes a core having a columnar shaft portion, first and second support portions provided on first and second end portions of the shaft portion, first and second terminal electrodes provided on the respective support portions, a wire wound around the shaft portion, and a cover member covering an upper surface of the shaft portion. In a height direction of the core, a distance between an upper surface and a top surface of the support portions is a top surface step, and a distance between a lower surface of the shaft portion and a bottom surface of the support portions is a bottom surface step. The top surface step is smaller than the bottom surface step and larger than a wire diameter, and a distance between the upper surface and an uppermost surface of the wire is larger than half of the top surface step.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: December 5, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akira Tanaka, Sunao Noya, Tomotaka Gotohda
  • Patent number: 11837398
    Abstract: A thin-film inductor device includes a substrate made of an electrically insulating material, a first coil unit, a second coil unit, and an inductance-enhancing structure. The first coil unit includes a first upper coil, a first lower coil, and two first electrodes electrically connected to the first upper and lower coils, respectively. The second coil includes a second upper coil, a second lower coil, and two second electrodes electrically connected to the second upper and lower coils, respectively. The first and second upper/lower coils are disposed spacedly and arranged by bifilar winding. The inductance-enhancing structure encapsulates the substrate, the first coil unit, and the second coil unit such that two terminal parts of each of the first electrodes and the second electrodes are exposed for external electrical connection.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: December 5, 2023
    Assignee: CHILISIN ELECTRONICS CORP.
    Inventors: Tim Wang, Hung-Pin Lin
  • Patent number: 11837396
    Abstract: A coil component includes a drum core that includes a winding core portion and a pair of flange portions formed at the ends of the winding core portion, electrodes that are included in the pair of flange portions, and first and second wires that are wound around the winding core portion and that include extended portions electrically connected to the electrodes. The flange portions are continuous with the winding core portion and have slopes that guide the extended portions to the electrodes.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: December 5, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuhiko Takenaka, Shigeto Yamamoto, Ryota Hashimoto, Akio Igarashi, Yuki Kanbe