Patents Examined by Mang Tin Bik Lian
  • Patent number: 11462349
    Abstract: A resonance damping element for a power converter having a positive busbar and a negative busbar, wherein the resonance damping element comprises a magnetic core formed with two openings through which the positive busbar and the negative busbar of the power converter are to be routed, respectively.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: October 4, 2022
    Assignee: VACON OY
    Inventors: Marko Koskela, Jukka Linna, Vesa Väisänen
  • Patent number: 11462351
    Abstract: A coupled inductor has two pillars that are aligned in a vertical direction, wherein a first coil and a second coil are respectively wound around one of the two pillars, respectively, wherein the bottom surface of winding turns of the first coil and the bottom surface of winding turns of the second coil are separated by a gap, wherein a magnetic material is disposed in the gap and a straight line that is enclosed by each of the first coil and the second coil passes through the two pillars.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: October 4, 2022
    Assignee: CYNTEC CO., LTD.
    Inventors: Chi-Hsun Lee, Min-Feng Chung
  • Patent number: 11456103
    Abstract: Two through-holes (7a) are formed in a portion of a second cover (7), the portion facing a second core (9) and a secondary coil (5). Heat radiation members (11) are provided in the through-holes (7a). The heat generated by the secondary coil (5) is radiated to the second core (9) via the heat radiation members (11).
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: September 27, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Yutaka Inagaki
  • Patent number: 11456105
    Abstract: A coil component comprising a core having a winding core part, and a coil wound around the winding core part and including a plurality of wires. The coil includes a twisted wire portion in which the plurality of wires is twisted together. The twisted wire portion includes a bank region including a first layer wound multiple turns continuously around the winding core part and a second layer wound on the first layer continuously from the first layer. The bank region is sparsely wound with the number of turns of the second layer reduced by two or more as compared to the number of turns of the first layer.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: September 27, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Sukegawa, Masashi Miyamoto, Ryota Hashimoto, Chihiro Yamaguchi, Kentaro Yamaguchi
  • Patent number: 11456654
    Abstract: To achieve the foregoing object, a tubular linear motor of the present invention includes a core that has a tubular yoke and a plurality of teeth which are annular and provided at intervals in an axial direction on an outer periphery of the yoke; a winding mounted in a slot between the teeth; and a field magnet that is tubular, into which the core is movably inserted in the axial direction, and having N poles and S poles alternately arranged in the axial direction. An axial width Wi of a yoke-side inner peripheral edge of the teeth is larger than an axial width of an outer peripheral edge of the teeth.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: September 27, 2022
    Assignee: KYB CORPORATION
    Inventors: Yoshiaki Kano, Kousuke Satou, Shinichirou Hakamada, Daichi Shibahara
  • Patent number: 11443887
    Abstract: A planar, in particular intrinsically safe transformer, having: a sandwich-type layer structure having a plurality of layers extending horizontally and arranged vertically on top of one another, including a first and a second conductive layer and at least one insulating inner layer disposed between the two conductive layers, a plurality of electrical circuits, wherein a first electrical circuit and at least a second electrical circuit are galvanically isolated from each other; and at least one ring-type magnetic core having a hole, which acts at least on the first electrical circuit and the second electrical circuit.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: September 13, 2022
    Assignee: Phoenix Contact GmbH & Co. KG
    Inventor: Peter Scholz
  • Patent number: 11443890
    Abstract: A surface mount coil component includes an element body defining a compact including magnetic material particles; a coil that is buried, excluding an end portion of the coil, in the element body; and an input-output terminal electrically connected to the end portion of the coil. A thermoplastic resin layer is provided on a surface on a mounting surface side of the element body. An interlayer connection conductor is provided in the thermoplastic resin layer. The input-output terminal is provided on a surface of the thermoplastic resin layer and is electrically connected to the end portion of the coil via the interlayer connection conductor.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: September 13, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Mitsuyoshi Nishide, Shinichiro Banba
  • Patent number: 11437186
    Abstract: A multi-phase coupled inductor can include: an upper E core including a first upper limb, a second upper limb, and a third upper limb; a lower E core including a first lower limb, a second lower limb, and a third lower limb; a first winding to wind the first upper limb and the first lower limb; a second winding to wind the second upper limb and the second lower limb; a third winding to wind the third upper limb and the third lower limb; a fourth winding to wind the first lower limb; and a fifth winding to wind the third lower limb. A first phase current can flow from the first winding to the fifth winding, and a third phase current can flow from the third winding to the fourth winding.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: September 6, 2022
    Assignee: University of Florida Research Foundation, Incorporated
    Inventors: Shuo Wang, Le Yang
  • Patent number: 11437179
    Abstract: The present invention provides an inductance coil comprising a magnetic core and a coil, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound. The coil is wrapped with an insulating adhesive tape and the tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. Additionally, the present invention provides an electromagnetic device including the above inductance coil.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: September 6, 2022
    Assignee: Eaton Intelligent Power Limited
    Inventors: Fang Xie, Leo Sun, Kevin Lee, David Xu
  • Patent number: 11430601
    Abstract: A coil electrode 4 provided in a coil component 1a includes a plurality of inner metal pins 5a arranged on an inner peripheral side of a coil core 3, a plurality of outer metal pins 5b arranged on an outer peripheral side of the coil core 3 to form a plurality of pairs with the inner metal pins 5a, a plurality of lower wiring patterns 7 that connect lower ends of the inner metal pins 5a and the outer metal pins 5b in the pairs, and a plurality of upper wiring patterns 6 that connect upper ends of the outer metal pins 5b to upper ends of inner metal pins 5a adjacent to the inner metal pins 5a that form the pairs with the outer metal pins 5b.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: August 30, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Norio Sakai
  • Patent number: 11432407
    Abstract: An electronic device package includes a molded case, a plurality of leads and a case lid. The molded case includes integrally formed side walls, end walls, and a bottom wall, which together define an interior for components. Each side wall includes top and bottom portions. The top portion includes first and second surfaces extending downward from a top edge of the side wall. The bottom portion has a top surface that extends away from the interior, a third surface extending downward from the top surface to a bottom edge, and a fourth surface extending downward from the second surface to the bottom wall. The leads are molded in the side wall from the bottom edge to the top edge. Each lead has an end extending above the top edge, and another end extending along the bottom edge of the side wall. The case lid is engaged with the molded case.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: August 30, 2022
    Assignee: XFMRS, Inc.
    Inventors: Tung Kong Luk, Yu Kun Liao
  • Patent number: 11424070
    Abstract: Disclosed herein is a coil component that includes: a first magnetic core extending in the first direction and around which the wires are wound; a second magnetic core having a first wall surface part covering the first magnetic core from one side in the second direction, a second wall surface part covering the first magnetic core from other side in the second direction, and a third wall surface part covering the first magnetic core from one side in the third direction; first and second terminal electrodes connected respectively to one ends of the wires and arranged in the first direction along the first wall surface part; and third and fourth terminal electrodes connected respectively to other ends of the wires and arranged in the first direction along the second wall surface part.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: August 23, 2022
    Assignee: TDK CORPORATION
    Inventors: Shuhei Someya, Kouyu Ohi, Tasuku Mikogami
  • Patent number: 11424065
    Abstract: A coil electronic component includes first and second coil portions magnetically coupled to each other, an intermediate layer disposed between the first and second coil portions and including first magnetic particles, and an encapsulant encapsulating the first and second coil portions and including second magnetic particles. The intermediate layer and the encapsulant have permeabilities different from each other.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: August 23, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Dong Jin Lee, Young Ghyu Ahn
  • Patent number: 11424066
    Abstract: An electronic component 100 includes: a circuit board module 104 which is composed of a plurality of layers, and in which a primary circuit 120 and secondary circuits 122, 124 are each formed using wring patterns of a first layer L1 to an eighth layer L8; and a magnetic core 106 which magnetically couples the primary circuit 120 and the secondary circuits 122, 124. The circuit board module 104 includes: a primary winding 120b and secondary windings 122b, 124b which are formed spirally around the magnetic core 106; and a third layer L3 and a sixth layer L6 interposed between a fourth layer L4 of the primary winding 120b and a second layer L2 of the secondary winding 122b and between a fifth layer L5 of the primary winding 120b and a seventh layer L7 of the secondary winding 124b.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: August 23, 2022
    Assignee: TAMURA CORPORATION
    Inventors: Hiroo Ogawa, Tomohiko Yoshino
  • Patent number: 11417458
    Abstract: A magnetic component and a switch power supply device are disclosed. The magnetic component includes a magnetic core and at least three windings, the magnetic core including at least three winding columns, at least one side columns, a first cover plate and a second cover plate opposite to each other, wherein the at least three winding columns are sequentially arranged in adjacent, the first cover plate and the second cover plate are respectively at upper parts or lower parts of the at least three winding columns and the at least one side column to form a closed magnetic flux loop; the at least three windings are wound on the at least three winding columns, respectively; wherein magnetic flux direction of the middle winding column in adjacent three winding columns is opposite to magnetic fluxes direction of the other two winding columns in adjacent three winding columns.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: August 16, 2022
    Assignee: Delta Electronics, Inc.
    Inventors: Zengyi Lu, Tianding Hong, Haijun Yang, Jinfa Zhang
  • Patent number: 11404195
    Abstract: Provided is a reactor that includes: a coil provided with a wound portion that is obtained by winding a winding wire, and has an exposed region with which a liquid coolant comes into direct contact; a magnetic core that is arranged inside and outside the wound portion, and forms a closed magnetic circuit; a sensor member configured to measure the temperature of the coil, the sensor member including a rod-shaped sensor body portion attached to the exposed region of the wound portion, and a wire coupled to the sensor body portion; and a sensor cover portion that covers surfaces of the outer periphery of the sensor body portion, except for a mounting surface for mounting to the wound portion and at least part of a coupling surface to which the wire is coupled.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: August 2, 2022
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Shinichiro Yamamoto, Takashi Misaki, Seiji Shitama, Tatsuo Hirabayashi
  • Patent number: 11398340
    Abstract: An inductor may include a body and external electrodes on respective external surfaces of the body. The body may include a support member, an insulator on the support member and including a first opening, a coil in the first opening, and a thin film conductor layer between the coil and the support member. The thin film conductor layer may include a second opening, and one or both of its end portions may be between the support member and the insulator.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: July 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Young Sun Kim
  • Patent number: 11387032
    Abstract: A coil component manufacturing method includes embedding coils in a flat plate-shaped element body defined by a molded body including magnetic particles such that the coils are in a matrix and winding axes of the coils extend in a thickness direction of the element body, one end portion of each of the coils is exposed to one main surface of the element body, and the other end portion of each of the coils is exposed to the other main surface of the element body, forming electrode films defining input/output terminals on both main surfaces of the element body so as to make contact with one of the end portions of each of the coils, and performing segmentation into individual coil components by cutting the element body at location between the coils adjacent to each other in the thickness direction.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: July 12, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Kato
  • Patent number: 11373794
    Abstract: A coil electronic component includes first and second coil portions magnetically coupled to each other, an intermediate layer disposed between the first and second coil portions and including first magnetic particles, and an encapsulant encapsulating the first and second coil portions and including second magnetic particles. The intermediate layer and the encapsulant have permeabilities different from each other.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: June 28, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Dong Jin Lee, Young Ghyu Ahn
  • Patent number: 11367569
    Abstract: Embodiments of the invention are directed to a method of fabricating a yoke arrangement of an inductor. A non-limiting example method includes forming a dielectric layer across from a major surface of a substrate. The method further includes configuring the dielectric layer such that it imparts a predetermined dielectric layer compressive stress on the substrate. A magnetic stack is formed on an opposite side of the dielectric layer from the substrate, wherein the magnetic stack includes one or more magnetic layers alternating with one or more insulating layers. The method further includes configuring the magnetic stack such that it imparts a predetermined magnetic stack tensile stress on the dielectric layer, wherein a net effect of the predetermined dielectric layer compressive stress and the predetermined magnetic stack tensile stress on the substrate is insufficient to cause a portion of the major surface of the substrate to be substantially non-planar.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: June 21, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang