Abstract: Provided is a silicone adhesive composition having (A) a condensation product of a linear or branched diorganopolysiloxane having a silicon atom-bonded hydroxy group and/or a silicon atom-bonded alkoxy group having 1 to 10 carbon atoms at a terminal and having no alkenyl group, a linear or branched diorganopolysiloxane having at least two alkenyl groups, and an organopolysiloxane comprising an R13SiO0.5 unit and an SiO2 unit and having a silicon atom-bonded hydroxy group and/or a silicon atom-bonded alkoxy group having 1 to 6 carbon atoms, (B) an organohydrogenpolysiloxane having at least three SiH groups and an average polymerization degree of 80 or less in an amount of 0.1 to 5 parts by mass, relative to 100 parts by mass of component (A), and (C) a platinum group metal catalyst in a catalytic amount.

Abstract: A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a thermoplastic resin including a polyester resin; about 50-150 parts by weight of glass fibers; and about 1-10 parts by weight of a polyether-ester copolymer, wherein the polyether-ester copolymer has a melt volume flow rate (MVR) of about 30-120 cm3/10 min as measured under conditions of 230° C. and 2.16 kg based on ISO 1133. The thermoplastic resin composition is excellent in impact resistance, appearance characteristics, metal joining properties, and the like.

Abstract: Upcycling process for producing acidic, end-equilibrated siloxanes bearing acetoxy groups and having chain lengths of greater than 3 silicon atoms from end-of-life silicones by thermal digestion in an acidic reaction medium comprising acetic anhydride, acetic acid and at least one further Brønsted acid having a pKa of <4, the digestion taking place in a reactor having a volume of at least 1 liter.

Abstract: A polymer composition that contains an aromatic polymer in combination with a tribological formulation is provided. The polymer composition may exhibit a low degree of surface friction that minimizes the extent to which a skin layer is peeled off during use of a part containing the composition (e.g., in a camera module). For example, the polymer composition may exhibit a dynamic coefficient of friction of about 1.0 or less and/or a wear depth may be about 500 micrometers or less as determined in accordance with VDA 230-206:2007.

Abstract: Silicon-based protective film for adhesive or self-adhesive elements, characterized in that said protective film is based on silicone and has a level of extractible silicone less than or equal to 100 ng/cm2, preferably less than or equal to 50, preferably less than or equal to 20 ng/cm2, and even more preferably less than 10 ng/cm2, the method of production thereof and uses thereof.

Abstract: The present invention provides a barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide.

Abstract: A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

Abstract: Methods are disclosed for forming a Silicon Metal Oxide film using a mono-substituted TSA precursor. The precursors have the formula: (SiH3)2N—SiH2-X, wherein X is selected from a halogen atom; an isocyanato group; an amino group; an N-containing C4-C10 saturated or unsaturated heterocycle; or an alkoxy group.

Abstract: A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

Abstract: A fluoro(poly)ether group-containing silane compound represented by any of the formulae (A1), (A2), (B1), (B2), (C1), or (C2). In the formulae, PFPE is each independently at each occurrence a group represented by the formula: —(OC3F6)d—, wherein the repeating unit OC3F6 of the formula includes a branched structure, and d is an integer of 2 or more and 200 or less. The symbols are as defined in the description.

Abstract: A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

Abstract: A field-effect transistor including at least: a substrate; a source electrode; a drain electrode; a gate electrode; a semiconductor layer in contact with the source electrode and with the drain electrode; and a gate insulating layer insulating between the semiconductor layer and the gate electrode, wherein the semiconductor layer contains a carbon nanotube, and the gate insulating layer contains a polymer having inorganic particles bound thereto. Provided is a field-effect transistor and a method for producing the field-effect transistor, wherein the field-effect transistor causes decreased leak current and furthermore enables a semiconductor solution to be uniformly applied.

Abstract: One-pot synthetic methods are disclosed for synthesizing curable, antimicrobial silsesquioxane-silica hybrids by hydrolytically co-condensing a tetraalkoxysilane with two different trialkoxysilanes. Particles are also disclosed that are substantially spherical and have an ordered lamellar internal structure. In addition, polymers prepared front the curable, antimicrobial silsesquioxane-silica hybrids and co-monomers are disclosed.

Abstract: Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and has excellent gap-filling ability and repairability; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) a straight-chain organohydrogenpolysiloxane containing an average of 2 to 4 silicon-bonded hydrogen atoms per molecule, at least two of the hydrogen atoms are being located on a side chain of the molecular chain, wherein the amount of silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 mol with respected to 1 mol of an alkenyl group contained in component (A); (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; and (E) an alkoxysilane having an alkyl group with 6 or more carbon atoms per molecule.

Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n?1; m?1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.

Abstract: ABA type block copolymers as a new class of temperature sensing polymers with tunable, high temperature coefficient of resistance (TCR). A sensor includes a heater, a thermal insulator between two thermometer layers, the heater generating a thermal gradient within the thermal insulator. The thermometers give an indirect measurement of fluid flow around the sensor, based on their temperature readings. The thermometers are flexible layers including ABA block polymers.

Abstract: Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness>H) that comparable glass hard materials offer.

Abstract: A polyimide composite, a method of preparing thereof, and an application thereof are provided. A general structure of the polyimide composite is: SiO2-(?-CD-Ada)x/PI, and x is 3 to 5. The polyimide composite has the functions of self-repairing and anti-aging.

Abstract: A condensation curable silicone adhesive composition comprising a condensation curable organopolysiloxane, siloxane-imide crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability.

Abstract: A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane.